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1. 发明授权

US06529714B1 Radio communication equipment 失效
标题翻译：无线电通信设备
公开(公告)号：US06529714B1
公开(公告)日：2003-03-04
申请号：US09314148
申请日：1999-05-19
申请人： Yutaka Nakamura , Noboru Koike
发明人： Yutaka Nakamura , Noboru Koike
IPC分类号： H04B138
CPC分类号： H04M1/0262 , H01M2/1066 , H01M2/20 , H01R12/716 , H01R13/6315 , H04B1/3883
摘要： A radio communication equipment including a housing and a battery pack to be attached to said housing, said radio communication equipment having a male connector of a floating connector provided on said housing, and a female connector the floating connector provided on said battery pack to engage with said male connector.
摘要翻译：一种无线电通信设备，包括外壳和要附接到所述外壳的电池组，所述无线电通信设备具有设置在所述外壳上的浮动连接器的公连接器，以及阴连接器，设置在所述电池组上的浮动连接器与所述公连接器。

2. 发明授权

US06554640B1 Radio communication equipment having a floating connector 失效
标题翻译：具有浮动连接器的无线电通信设备
公开(公告)号：US06554640B1
公开(公告)日：2003-04-29
申请号：US09584084
申请日：2000-06-01
申请人： Noboru Koike , Yutaka Nakamura
发明人： Noboru Koike , Yutaka Nakamura
IPC分类号： H01R300
CPC分类号： H01R13/6315
摘要： A radio communication equipment having a battery compartment and a battery pack provided in the battery compartment, the equipment including a first connector block having a female portion provided at the battery pack, and the first connector block having a first contact with a first contact portion and a second contact portion facing the first contact portion, and a second connector block having a male portion provided at the battery, and the second connector block having a second contact having elasticity with a third contact portion and a fourth contact portion facing the third contact portion, wherein the second connector block is engaged with the first connector block, and the third contact portion is pressed against the first contact portion and the fourth contact portion is pressed against the second contact portion by the elasticity of the second contact.
摘要翻译：一种无线电通信设备，具有设置在所述电池室中的电池室和电池组，所述设备包括：第一连接器块，具有设置在所述电池组件上的阴部分，所述第一连接器块具有与第一接触部分的第一接触;以及面对第一接触部分的第二接触部分和具有设置在电池上的阳部分的第二连接器块，并且第二连接器块具有具有弹性的第二接触件，第三接触部分和面向第三接触部分的第四接触部分其中第二连接器块与第一连接器块接合，并且第三接触部分被按压在第一接触部分上，并且第四接触部分被第二接触件的弹性压靠在第二接触部分上。

3. 发明授权

US6031732A Electronic apparatus with a shield structure and a shield case used in the shield structure and a manufacturing method of the shield case 失效
标题翻译：具有屏蔽结构的电子设备和屏蔽结构中使用的屏蔽壳以及屏蔽壳的制造方法
公开(公告)号：US6031732A
公开(公告)日：2000-02-29
申请号：US563591
申请日：1995-11-28
申请人： Noboru Koike , Yutaka Nakamura
发明人： Noboru Koike , Yutaka Nakamura
IPC分类号： H04B1/38 , H05K9/00
CPC分类号： H05K9/0039 , H04B1/3833
摘要： A shield case for use in a electronic apparatus enclosed in a housing, includes a groove mating with a protruding portion of the housing. When the shield case is clamped between a PC board and the housing, the shield case is urged toward the PC board, and thereby contacts a ground pattern of the PC board.
摘要翻译：一种用于封闭在壳体中的电子设备中的屏蔽盒，包括与壳体的突出部分配合的凹槽。当屏蔽盒夹在PC板和壳体之间时，屏蔽盒被推向PC板，从而接触PC板的接地图案。

4. 发明授权

US5438482A Electronic apparatus having a shield structure 失效
标题翻译：具有屏蔽结构的电子设备
公开(公告)号：US5438482A
公开(公告)日：1995-08-01
申请号：US254057
申请日：1994-06-03
申请人： Yutaka Nakamura , Noboru Koike
发明人： Yutaka Nakamura , Noboru Koike
IPC分类号： H05K1/02 , H04B1/38 , H05K1/14 , H05K7/14 , H05K9/00
CPC分类号： H04B1/3838 , H04B1/3816 , H04B1/3833 , H05K7/1417 , H05K9/0037
摘要： A shield structure for use in an electronic apparatus includes a shield case for covering a first and second circuitry block and for isolating each other. In order to enhance the electrical connection of the shield case to a first ground on a first circuit board and a second ground on a second circuit board, a conductive component is fastened to the shield case. The conductive component includes a fastening portion, a first contact portion contacting the first ground, and a second contact portion contacting the second ground.
摘要翻译：用于电子设备的屏蔽结构包括用于覆盖第一和第二电路块并彼此隔离的屏蔽壳。为了增强屏蔽壳体与第一电路板上的第一接地和第二电路板上的第二接地的电连接，导电部件被紧固到屏蔽壳体上。导电部件包括紧固部分，接触第一接地的第一接触部分和接触第二接地的第二接触部分。

5. 发明授权

US06465894B2 Semiconductor device having bed structure underlying electrode pad 有权
标题翻译：半导体器件具有位于电极焊盘下方的床结构
公开(公告)号：US06465894B2
公开(公告)日：2002-10-15
申请号：US09907659
申请日：2001-07-19
申请人： Noboru Koike
发明人： Noboru Koike
IPC分类号： H01L2941
CPC分类号： H01L24/05 , H01L21/76229 , H01L24/03 , H01L24/06 , H01L24/11 , H01L2224/02166 , H01L2224/0401 , H01L2224/05556 , H01L2224/13099 , H01L2224/78301 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01074 , H01L2924/05042
摘要： A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat. According to the semiconductor device and the method for manufacturing the same, it is possible to more sufficiently planarize the surface of the insulating layer by the rotary polishing method, and it is possible to decrease the bonding damage applied to a underlayer portion serving as a bed of the semiconductor device when carrying out the wire bonding.
摘要翻译：半导体器件具有：具有嵌入有绝缘层的具有预定图案的表面的半导体衬底; 形成在所述基板上的层间绝缘膜，所述层间绝缘膜具有用于保护所述基板的保护层; 以及形成在层间绝缘膜上的电极。此外，半导体器件的制造方法包括以下步骤：形成具有表面的半导体衬底，该表面具有嵌入绝缘层的沟槽; 在嵌入槽内的绝缘层的上表面上形成保护半导体衬底表面的保护层; 并在保护层上形成电极。根据半导体装置及其制造方法，可以通过旋转研磨方法更充分地平坦化绝缘层的表面，并且可以减少施加到用作床的下层部分的接合损伤的半导体器件。

6. 发明授权

US5557507A Apparatus having shield structure 失效
标题翻译：具有屏蔽结构的装置
公开(公告)号：US5557507A
公开(公告)日：1996-09-17
申请号：US265027
申请日：1994-06-24
申请人： Noboru Koike , Hirokazu Seraku
发明人： Noboru Koike , Hirokazu Seraku
IPC分类号： H01R4/64 , H05K9/00
CPC分类号： H05K9/0037 , H05K9/0016
摘要： An electronic apparatus includes first and second circuitry blocks mounted on opposite surfaces of a double-sided circuit board. A first shield case is attached to the circuit board so that the first shield case covers the first circuitry block. A second circuitry block is attached to the circuit board so that the second shield case covers the second circuitry block. A conductive component contacts the first and second shield cases and is engaged with the edge of the circuit board for enabling the circuit board to be electrically connected to the first and second shield cases.
摘要翻译：电子设备包括安装在双面电路板的相对表面上的第一和第二电路块。第一屏蔽壳附接到电路板，使得第一屏蔽壳覆盖第一电路块。第二电路块连接到电路板，使得第二屏蔽壳覆盖第二电路块。导电部件接触第一和第二屏蔽壳体并与电路板的边缘接合，以使得电路板能够电连接到第一和第二屏蔽壳体。

7. 发明授权

US5032964A Headlight for motor vehicle 失效
标题翻译：汽车头灯
公开(公告)号：US5032964A
公开(公告)日：1991-07-16
申请号：US605295
申请日：1990-10-30
申请人： Masayasu Endo , Noboru Koike
发明人： Masayasu Endo , Noboru Koike
IPC分类号： G01C9/00 , B60Q1/068 , F21S8/10 , F21V14/04
CPC分类号： B60Q1/0686
摘要： A vehicular headlight which does not require a large amount of equipment to properly adjust the angle of the azimuthal direction of emission of light from the headlight. A reflector within the body of the headlight is adjustable relative to a vertical axis and horizontal axis to control the direction in which light is emitted from the headlight. The headlight further includes aiming devices for measuring the aiming angle relative to the vertical axis and horizontal axis.
摘要翻译：一种车头灯，其不需要大量设备来适当地调节来自头灯的光发射的方位角的角度。头灯主体内的反射器可相对于垂直轴和水平轴线调节，以控制从头灯发出光线的方向。头灯还包括用于测量相对于垂直轴和水平轴线的瞄准角度的瞄准装置。

8. 发明授权

US08235696B2 In-mold forming apparatus, in-mold forming method, in-mold formed article manufacturing method, and dust collector 失效
标题翻译：模内成型装置，模内成型方法，模内成形制品的制造方法和集尘器
公开(公告)号：US08235696B2
公开(公告)日：2012-08-07
申请号：US11251826
申请日：2005-10-18
申请人： Yoshinori Kairiku , Noboru Koike
发明人： Yoshinori Kairiku , Noboru Koike
IPC分类号： B29C35/12
CPC分类号： B03C3/017 , B08B6/00 , B29C45/14016 , B29C45/14827 , B29C45/1701
摘要： An in-mold forming apparatus including a first mold and a second mold for injection molding and a film feeding mechanism for feeding in-mold foil between the first mold and the second mold. A transfer foil is formed on the in-mold foil. The in-mold forming apparatus further includes a mold closing mechanism for closing the first mold and the second mold, thereby to fix the in-mold foil inside a cavity formed between the first mold and the second mold, a resin injection forming mechanism for injecting fused resin into the cavity, thereby to unit the transfer foil formed on the in-mold foil with the resin, and a charger arranged in the neighborhood of at least one of the first mold, the second mold, and the in-mold foil. The charger includes a charging unit for freeing ions and charging particles in the neighborhood of the in-mold foil, and an electrode for adsorbing the particles charged by the ions.
摘要翻译：一种模内成型装置，包括第一模具和用于注射成型的第二模具，以及用于在第一模具和第二模具之间进给模内箔片的薄膜进给机构。在模内箔上形成转印箔。模内成型装置还包括用于封闭第一模具和第二模具的模具闭合机构，从而将模内箔固定在形成在第一模具和第二模具之间的空腔内;树脂注入成型机构，用于注入熔融树脂进入空腔中，从而将形成在模内箔上的转印箔与树脂单元化，并将充电器设置在第一模具，第二模具和模内箔中的至少一个附近。充电器包括用于释放离子并在模内箔附近充电颗粒的充电单元和用于吸附由离子加载的颗粒的电极。

9. 发明授权

US06677623B2 Bed structure underlying electrode pad of semiconductor device and method for manufacturing same 有权
标题翻译：半导体器件底层电极焊盘的底层结构及其制造方法
公开(公告)号：US06677623B2
公开(公告)日：2004-01-13
申请号：US10217455
申请日：2002-08-14
申请人： Noboru Koike
发明人： Noboru Koike
IPC分类号： H01L2974
CPC分类号： H01L24/05 , H01L21/76229 , H01L24/03 , H01L24/06 , H01L24/11 , H01L2224/02166 , H01L2224/0401 , H01L2224/05556 , H01L2224/13099 , H01L2224/78301 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01074 , H01L2924/05042
摘要： A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat. According to the semiconductor device and the method for manufacturing the same, it is possible to more sufficiently planarize the surface of the insulating layer by the rotary polishing method, and it is possible to decrease the bonding damage applied to a underlayer portion serving as a bed of the semiconductor device when carrying out the wire bonding.
摘要翻译：半导体器件具有：具有嵌入有绝缘层的具有预定图案的表面的半导体衬底; 形成在所述基板上的层间绝缘膜，所述层间绝缘膜具有用于保护所述基板的保护层; 以及形成在层间绝缘膜上的电极。此外，半导体器件的制造方法包括以下步骤：形成具有表面的半导体衬底，该表面具有嵌入绝缘层的沟槽; 在嵌入槽内的绝缘层的上表面上形成保护半导体衬底表面的保护层; 并在保护层上形成电极。根据半导体装置及其制造方法，可以通过旋转研磨方法更充分地平坦化绝缘层的表面，并且可以减少施加到用作床的下层部分的接合损伤的半导体器件。

10. 发明授权

US6049135A Bed structure underlying electrode pad of semiconductor device and method for manufacturing same 失效
标题翻译：半导体器件底层电极焊盘的底层结构及其制造方法
公开(公告)号：US6049135A
公开(公告)日：2000-04-11
申请号：US863423
申请日：1997-05-27
申请人： Noboru Koike
发明人： Noboru Koike
IPC分类号： H01L21/60 , H01L21/762 , H01L23/485 , H01L29/41
CPC分类号： H01L24/05 , H01L21/76229 , H01L24/03 , H01L24/06 , H01L24/11 , H01L2224/02166 , H01L2224/0401 , H01L2224/05556 , H01L2224/13099 , H01L2224/78301 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01074 , H01L2924/05042
摘要： A semiconductor device has: a substantially flat surface which is formed on a semiconductor substrate and has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the surface, the interlayer insulator film having a protective layer for protecting the semiconductor substrate; and formed on the interlayer insulator film and adapted for bonding a wire thereto. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat. According to the semiconductor device and the method for manufacturing the same, it is possible to more sufficiently planarize the surface of the insulating layer by the rotary polishing method, and it is possible to decrease the bonding damage applied to a underlayer portion serving as a bed of the semiconductor device when carrying out the wire bonding.
摘要翻译：半导体器件具有：基本上平坦的表面，其形成在半导体衬底上并且具有嵌入绝缘层的预定图案; 形成在所述表面上的层间绝缘膜，所述层间绝缘膜具有用于保护半导体衬底的保护层; 并且形成在层间绝缘膜上并适用于将导线接合到其上。此外，半导体器件的制造方法包括以下步骤：形成具有表面的半导体衬底，该表面具有嵌入绝缘层的沟槽; 在嵌入槽内的绝缘层的上表面上形成保护半导体衬底表面的保护层; 并在保护层上形成电极。根据半导体装置及其制造方法，可以通过旋转研磨方法更充分地平坦化绝缘层的表面，并且可以减少施加到用作床的下层部分的接合损伤的半导体器件。

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