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    • 3. 发明授权
    • Method for manufacturing SOI substrate
    • 制造SOI衬底的方法
    • US08093136B2
    • 2012-01-10
    • US12340869
    • 2008-12-22
    • Yuta EndoShunpei Yamazaki
    • Yuta EndoShunpei Yamazaki
    • H01L21/30H01L21/46
    • H01L21/76254
    • A single crystal semiconductor substrate and a base substrate are prepared; a first insulating film is formed over the single crystal semiconductor substrate; a separation layer is formed by introducing ions at a predetermined depth through a surface of the single crystal semiconductor substrate; plasma treatment is performed on the base substrate so as to planarize a surface of the base substrate; a second insulating film is formed over the planarized base substrate; a surface of the first insulating film is bonded to a surface of the second insulating film by making the surface of the single crystal semiconductor substrate and the surface of the base substrate face each other; and a single crystal semiconductor film is provided over the base substrate with the second insulating film and the first insulating film interposed therebetween by performing separation at the separation layer.
    • 制备单晶半导体衬底和基底衬底; 在单晶半导体衬底上形成第一绝缘膜; 通过在单晶半导体衬底的表面上以预定深度引入离子形成分离层; 在基底基板上进行等离子体处理,使基板的表面平坦化; 在平坦化的基底基板上形成第二绝缘膜; 通过使单晶半导体衬底的表面和基底表面彼此面对,将第一绝缘膜的表面接合到第二绝缘膜的表面; 并且通过在分离层进行分离,在基底基板上设置有第二绝缘膜和第一绝缘膜之间的单晶半导体膜。