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1. 发明授权

US07938028B2 Force sensor 有权
标题翻译：力传感器
公开(公告)号：US07938028B2
公开(公告)日：2011-05-10
申请号：US12544081
申请日：2009-08-19
申请人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
发明人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
IPC分类号： G01L1/04 , G01L1/00 , G01L9/00
CPC分类号： G01L5/165 , G01L1/26 , G01L5/162
摘要： A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
摘要翻译：力传感器包括力传感器芯片和缓冲装置，用于将输入的外力衰减并施加到力传感器芯片。缓冲装置包括输入外力的输入部分，用于将力传感器芯片固定到外部的传感器支座，用于衰减外力的阻尼机构，以及用于将阻尼外力传递到主动感测部分的传动部分。

2. 发明授权

US07594445B2 Force sensor 失效
标题翻译：力传感器
公开(公告)号：US07594445B2
公开(公告)日：2009-09-29
申请号：US11475957
申请日：2006-06-28
申请人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
发明人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
IPC分类号： G01D7/00 , G01L1/22
CPC分类号： G01L5/165 , G01L1/26 , G01L5/162
摘要： A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
摘要翻译：力传感器包括力传感器芯片和缓冲装置，用于将输入的外力衰减并施加到力传感器芯片。缓冲装置包括输入外力的输入部分，用于将力传感器芯片固定到外部的传感器安装座，用于衰减外力的阻尼机构，以及用于将阻尼外力传递到主动感测部分的传动部分。

3. 发明申请

US20080282813A1 Force sensor 失效
标题翻译：力传感器
公开(公告)号：US20080282813A1
公开(公告)日：2008-11-20
申请号：US12216446
申请日：2008-07-03
申请人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
发明人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
IPC分类号： G01L1/14
CPC分类号： G01L5/165 , G01L1/26 , G01L5/162
摘要： A force sensor with a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device includes an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
摘要翻译：具有力传感器芯片的力传感器和用于衰减并施加到力传感器芯片的外力的缓冲装置。缓冲装置包括输入外力的输入部，用于将力传感器芯片固定到外部的传感器座，用于抑制外力的阻尼机构，以及用于将阻尼外力传递到主动感测部的传递部。

4. 发明申请

US20070006668A1 Force sensor 失效
标题翻译：力传感器
公开(公告)号：US20070006668A1
公开(公告)日：2007-01-11
申请号：US11475957
申请日：2006-06-28
申请人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
发明人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
IPC分类号： G01L1/26 , G01L1/22 , G01L1/14
CPC分类号： G01L5/165 , G01L1/26 , G01L5/162
摘要： A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
摘要翻译：力传感器包括力传感器芯片和缓冲装置，用于将进入的外力衰减并施加到力传感器芯片。缓冲装置包括输入外力的输入部分，用于将力传感器芯片固定到外部的传感器支座，用于衰减外力的阻尼机构，以及用于将阻尼外力传递到主动感测部分的传动部分。

5. 发明授权

US07757571B2 Force Sensor 失效
标题翻译：力传感器
公开(公告)号：US07757571B2
公开(公告)日：2010-07-20
申请号：US12216446
申请日：2008-07-03
申请人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
发明人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
IPC分类号： G01L5/10 , G01L5/04 , G01L1/00
CPC分类号： G01L5/165 , G01L1/26 , G01L5/162
摘要： A force sensor with a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device includes an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
摘要翻译：具有力传感器芯片的力传感器和用于衰减并施加到力传感器芯片的外力的缓冲装置。缓冲装置包括输入外力的输入部，用于将力传感器芯片固定到外部的传感器座，用于抑制外力的阻尼机构，以及用于将阻尼外力传递到主动感测部的传递部。

6. 发明申请

US20090301226A1 FORCE SENSOR 有权
标题翻译：力传感器
公开(公告)号：US20090301226A1
公开(公告)日：2009-12-10
申请号：US12544081
申请日：2009-08-19
申请人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
发明人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
IPC分类号： G01L1/14
CPC分类号： G01L5/165 , G01L1/26 , G01L5/162
摘要： A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
摘要翻译：力传感器包括力传感器芯片和缓冲装置，用于将输入的外力衰减并施加到力传感器芯片。缓冲装置包括输入外力的输入部分，用于将力传感器芯片固定到外部的传感器支座，用于衰减外力的阻尼机构，以及用于将阻尼外力传递到主动感测部分的传动部分。

7. 发明授权

US08113065B2 Force sensor 有权
标题翻译：力传感器
公开(公告)号：US08113065B2
公开(公告)日：2012-02-14
申请号：US12310197
申请日：2007-08-24
申请人： Takeshi Ohsato , Shigenori Yasuie , Yusuke Hirabayashi , Hiroshi Yokobayashi
发明人： Takeshi Ohsato , Shigenori Yasuie , Yusuke Hirabayashi , Hiroshi Yokobayashi
IPC分类号： G01L1/22 , G01D7/00 , H01C17/28 , H01C17/00
CPC分类号： G01L5/162 , G01L1/18 , G01L1/2231 , Y10T29/49002 , Y10T29/49082 , Y10T29/49103
摘要： A force sensor 1 includes: a force sensor chip 2 including an action portion 21, a connecting portion 23 on which strain resistive elements are disposed, and a support portion 22 for supporting the action portion 21 and the connecting portion 23; an attenuator 3 including an input portion 30 to which an external force is input, a fixing portion 32 for fixing the force sensor chip 2, and a transmission portion 31 for attenuating the external force and transmitting the attenuated external force to the action portion 21; a first glass member 11 disposed between the action portion 21 and the transmission portion 31 and a second glass member 12 disposed between the support portion 22 and the fixing portion 32, through which glass members 11, 12 the force sensor chip 2 and the attenuator 3 are joined. A single or more glass beams 13 joins the first glass member 11 and the second glass member 12 together as a single member.
摘要翻译：力传感器1包括：力传感器芯片2，包括作用部分21，其上设置有应变电阻元件的连接部分23和用于支撑作用部分21和连接部分23的支撑部分22; 包括输入部分30的衰减器3，用于固定力传感器芯片2的固定部分32，以及用于衰减外力并将衰减的外力传递到动作部分21的传输部分31; 布置在动作部分21和传动部分31之间的第一玻璃部件11和设置在支撑部分22和固定部分32之间的第二玻璃部件12，玻璃部件11,12，力传感器芯片2和衰减器3 被加入。单个或更多个玻璃梁13将第一玻璃构件11和第二玻璃构件12连接在一起作为单个构件。

8. 发明授权

US07458281B2 Multi-axis force sensor chip and multi-axis force sensor using same 有权
标题翻译：多轴力传感器芯片和多轴力传感器使用相同
公开(公告)号：US07458281B2
公开(公告)日：2008-12-02
申请号：US11256982
申请日：2005-10-25
申请人： Takeshi Ohsato , Nobuhiro Sakurai , Yusuke Hirabayashi , Hiroshi Yokobayashi
发明人： Takeshi Ohsato , Nobuhiro Sakurai , Yusuke Hirabayashi , Hiroshi Yokobayashi
IPC分类号： G01L1/22 , G01D7/00 , G01L1/04
CPC分类号： G01L5/162
摘要： A multi-axis sensor chip provided by the invention includes a semiconductor substrate having an action part having an external force action area part and non-deforming area parts, a support part supporting the action part, and connecting parts connecting the action part to the support part. The sensor chip also has strain resistance devices provided on deforming parts of the connecting parts and has temperature-compensating resistance devices provided on the non-deforming area parts. Temperature compensation is carried out exactly by means of the temperature-compensating resistance devices when an external force or a load acts on the action part, and highly accurate stress detection can be carried out.
摘要翻译：本发明提供的多轴传感器芯片包括：半导体基板，其具有具有外力作用区域部分和非变形区域部分的作用部分，支撑作用部分的支撑部分和将作用部分连接到支撑体的连接部件部分。传感器芯片还具有设置在连接部件的变形部分上的应变阻抗装置，并且具有设置在非变形区域部件上的温度补偿电阻装置。当外力或负载作用于动作部件时，通过温度补偿电阻装置进行温度补偿，可以进行高精度的应力检测。

9. 发明申请

US20060086190A1 Multi-axis force sensor chip and multi-axis force sensor using same 有权
标题翻译：多轴力传感器芯片和多轴力传感器使用相同
公开(公告)号：US20060086190A1
公开(公告)日：2006-04-27
申请号：US11256982
申请日：2005-10-25
申请人： Takeshi Ohsato , Nobuhiro Sakurai , Yusuke Hirabayashi , Hiroshi Yokobayashi
发明人： Takeshi Ohsato , Nobuhiro Sakurai , Yusuke Hirabayashi , Hiroshi Yokobayashi
IPC分类号： G01B7/16
CPC分类号： G01L5/162
摘要： A multi-axis sensor chip provided by the invention includes a semiconductor substrate having an action part having an external force action area part and non-deforming area parts, a support part supporting the action part, and connecting parts connecting the action part to the support part. The sensor chip also has strain resistance devices provided on deforming parts of the connecting parts and has temperature-compensating resistance devices provided on the non-deforming area parts. Temperature compensation is carried out exactly by means of the temperature-compensating resistance devices when an external force or a load acts on the action part, and highly accurate stress detection can be carried out.
摘要翻译：本发明提供的多轴传感器芯片包括：半导体基板，其具有具有外力作用区域部分和非变形区域部分的作用部分，支撑作用部分的支撑部分和将作用部分连接到支撑体的连接部件部分。传感器芯片还具有设置在连接部件的变形部分上的应变阻抗装置，并且具有设置在非变形区域部件上的温度补偿电阻装置。当外力或负载作用于动作部件时，通过温度补偿电阻装置进行温度补偿，可以进行高精度的应力检测。

10. 发明申请

US20090320610A1 FORCE SENSOR 有权
标题翻译：力传感器
公开(公告)号：US20090320610A1
公开(公告)日：2009-12-31
申请号：US12310197
申请日：2007-08-24
申请人： Takeshi Ohsato , Shigenori Yasuie , Yusuke Hirabayashi , Hiroshi Yakobayashi
发明人： Takeshi Ohsato , Shigenori Yasuie , Yusuke Hirabayashi , Hiroshi Yakobayashi
IPC分类号： G01L5/16 , G01R3/00
CPC分类号： G01L5/162 , G01L1/18 , G01L1/2231 , Y10T29/49002 , Y10T29/49082 , Y10T29/49103
摘要： A force sensor 1 includes: a force sensor chip 2 including an action portion 21, a connecting portion 23 on which strain resistive elements are disposed, and a support portion 22 for supporting the action portion 21 and the connecting portion 23; an attenuator 3 including an input portion 30 to which an external force is input, a fixing portion 32 for fixing the force sensor chip 2, and a transmission portion 31 for attenuating the external force and transmitting the attenuated external force to the action portion 21; a first glass member 11 disposed between the action portion 21 and the transmission portion 31 and a second glass member 12 disposed between the support portion 22 and the fixing portion 32, through which glass members 11, 12 the force sensor chip 2 and the attenuator 3 are joined. A single or more glass beams 13 joins the first glass member 11 and the second glass member 12 together as a single member.
摘要翻译：力传感器1包括：力传感器芯片2，包括作用部分21，其上设置有应变电阻元件的连接部分23和用于支撑作用部分21和连接部分23的支撑部分22; 包括输入部分30的衰减器3，用于固定力传感器芯片2的固定部分32，以及用于衰减外力并将衰减的外力传递到动作部分21的传输部分31; 布置在动作部分21和传动部分31之间的第一玻璃部件11和设置在支撑部分22和固定部分32之间的第二玻璃部件12，玻璃部件11,12，力传感器芯片2和衰减器3 被加入。单个或更多个玻璃梁13将第一玻璃构件11和第二玻璃构件12连接在一起作为单个构件。

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