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1. 发明专利

JP2006094795A Food using bamboo extract and method for processing the same 审中-公开
标题翻译：使用BAMBOO提取物的食品及其加工方法
公开(公告)号：JP2006094795A
公开(公告)日：2006-04-13
申请号：JP2004286071
申请日：2004-09-30
申请人： Kanamitsu Kikuchi , Hidemoto Kusaka , Nobuhiro Sakurai , 英元日下 , 信洋櫻井 , 金満菊池
发明人： KUSAKA HIDEMOTO , KIKUCHI KANAMITSU , SAKURAI NOBUHIRO
IPC分类号： A23L13/00 , A23L13/20 , A23L13/40
摘要： PROBLEM TO BE SOLVED: To provide a method for processing food improved in taste and solving smell peculiar to the food through soaking bamboo extract into the food. SOLUTION: This method for processing the food comprises a process of confirming whether the food has fat or not, a process of refrigerating the food, in the case of judging that the food has no fat in the process, while soaking in 1-7 wt.% of bamboo extract based on the food, and a process of boil heating the food to bring the central temperature thereof to 75°C. The bamboo extract is obtained by mixing red perilla, rosemary or sweet majorum with a product obtained by a process of soaking a bamboo in water, heating the water to ≥95°C and keeping the temperature for 2 h 45 min-3 h 15 min to extract. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过将竹提取物浸泡到食物中来改善味道和改善食物特有的气味的食品加工方法。解决方案：用于处理食品的方法包括确认食物是否有脂肪的过程，在判断食物在该过程中没有脂肪的情况下，将食物冷却的过程，同时浸泡在1 -7重量％的基于食物的竹提取物，以及煮沸加热食物以使其中心温度达到75℃的过程。通过将紫苏，迷迭香或甜蜜的大小与通过将竹子浸泡在水中的方法获得的产物混合，将水加热至≥95℃并保持温度2小时45分钟3小时15分钟获得竹提取物提取。版权所有（C）2006，JPO＆NCIPI

2. 发明授权

US08250934B2 Multi-axis force sensor and acceleration sensor 有权
标题翻译：多轴力传感器和加速度传感器
公开(公告)号：US08250934B2
公开(公告)日：2012-08-28
申请号：US12702858
申请日：2010-02-09
申请人： Nobuhiro Sakurai
发明人： Nobuhiro Sakurai
IPC分类号： G01L1/22
CPC分类号： G01P15/18 , G01L5/161 , G01P15/123 , G01P2015/0842
摘要： There is provided a multi-axis force sensor including first and second bridge circuit groups detecting resistances of respective first and second groups of strain resistance elements provided at respective strain producing portions. The strain producing portions are formed on two axes intersecting with respect to each other at a right angle. The first group of strain resistance elements are arranged on one axis across an action portion so as to face with respect to each other, and the second group of strain resistance elements are arranged on another axis across the action portion so as to face with respect to each other. The first bridge circuit groups respectively output a positive voltage when receiving tensile force, and the second bridge circuit groups respectively output a negative voltage when receiving tensile force.
摘要翻译：提供了一种多轴力传感器，其包括第一和第二桥接电路组，其检测设置在各个应变产生部分处的各个第一和第二组应变电阻元件的电阻。应变产生部分以相对于彼此以直角相交的两个轴线形成。第一组应变电阻元件布置在跨越作用部分的一个轴上以相对于彼此面对，并且第二组应变阻力元件布置在跨越作用部分的另一个轴上，以相对于彼此。第一桥电路组在接收拉力时分别输出正电压，第二桥电路组在接收拉力时分别输出负电压。

3. 发明授权

US07938028B2 Force sensor 有权
标题翻译：力传感器
公开(公告)号：US07938028B2
公开(公告)日：2011-05-10
申请号：US12544081
申请日：2009-08-19
申请人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
发明人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
IPC分类号： G01L1/04 , G01L1/00 , G01L9/00
CPC分类号： G01L5/165 , G01L1/26 , G01L5/162
摘要： A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
摘要翻译：力传感器包括力传感器芯片和缓冲装置，用于将输入的外力衰减并施加到力传感器芯片。缓冲装置包括输入外力的输入部分，用于将力传感器芯片固定到外部的传感器支座，用于衰减外力的阻尼机构，以及用于将阻尼外力传递到主动感测部分的传动部分。

4. 发明授权

US07594445B2 Force sensor 失效
标题翻译：力传感器
公开(公告)号：US07594445B2
公开(公告)日：2009-09-29
申请号：US11475957
申请日：2006-06-28
申请人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
发明人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
IPC分类号： G01D7/00 , G01L1/22
CPC分类号： G01L5/165 , G01L1/26 , G01L5/162
摘要： A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
摘要翻译：力传感器包括力传感器芯片和缓冲装置，用于将输入的外力衰减并施加到力传感器芯片。缓冲装置包括输入外力的输入部分，用于将力传感器芯片固定到外部的传感器安装座，用于衰减外力的阻尼机构，以及用于将阻尼外力传递到主动感测部分的传动部分。

5. 发明申请

US20080282813A1 Force sensor 失效
标题翻译：力传感器
公开(公告)号：US20080282813A1
公开(公告)日：2008-11-20
申请号：US12216446
申请日：2008-07-03
申请人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
发明人： Yusuke Hirabayashi , Takeshi Ohsato , Nobuhiro Sakurai , Shigenori Yasuie , Hiroshi Yokobayashi
IPC分类号： G01L1/14
CPC分类号： G01L5/165 , G01L1/26 , G01L5/162
摘要： A force sensor with a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device includes an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
摘要翻译：具有力传感器芯片的力传感器和用于衰减并施加到力传感器芯片的外力的缓冲装置。缓冲装置包括输入外力的输入部，用于将力传感器芯片固定到外部的传感器座，用于抑制外力的阻尼机构，以及用于将阻尼外力传递到主动感测部的传递部。

6. 发明申请

US20080034897A1 Force sensor chip 有权
标题翻译：力传感器芯片
公开(公告)号：US20080034897A1
公开(公告)日：2008-02-14
申请号：US11882327
申请日：2007-07-31
申请人： Takeshi Ohsato , Nobuhiro Sakurai
发明人： Takeshi Ohsato , Nobuhiro Sakurai
IPC分类号： G01L1/04 , G01L1/20
CPC分类号： G01L5/162
摘要： In a force sensor chip, a base member, to which an external force is applied, includes: an operating part provided in a central portion of the base member and having an external-force acting area section; a supporting part provided, in an outer peripheral portion of the base member, for supporting the operating part; an intermediate part provided between the operating part and the supporting part; a first connecting arm section connecting the operating part and the intermediate section; a second connecting arm section connecting the intermediate part and the supporting part; and at least one strain resistance element provided on each of respective deformation-generating portions of the first and the second connecting arm sections.
摘要翻译：在力传感器芯片中，施加有外力的基部构件包括：设置在基座构件的中心部分并具有外力作用区域的操作部; 支撑部，其设置在所述基部构件的外周部中，用于支撑所述操作部; 设置在所述操作部和所述支撑部之间的中间部; 连接所述操作部和所述中间部的第一连接臂部; 连接中间部分和支撑部分的第二连接臂部分; 以及设置在第一和第二连接臂部的各变形产生部的每一个上的至少一个应变电阻元件。

7. 发明授权

US07707899B2 Force sensor chip 有权
标题翻译：力传感器芯片
公开(公告)号：US07707899B2
公开(公告)日：2010-05-04
申请号：US12000405
申请日：2007-12-12
申请人： Nobuhiro Sakurai , Takeshi Ohsato
发明人： Nobuhiro Sakurai , Takeshi Ohsato
IPC分类号： G01L1/22 , G01D7/00
CPC分类号： G01L1/2281 , G01L5/162
摘要： A force sensor chip including a semiconductor substrate having a plurality of strain resistance elements and temperature-compensating resistance elements corresponding to the resistance elements is disclosed. The structure in the periphery of parts where the strain resistance elements, which are provided to deforming parts in the action part formed on the semiconductor substrate, are disposed is the same as the structure in the periphery of parts where the temperature-compensating resistance elements in the action part are disposed.
摘要翻译：公开了一种力传感器芯片，其包括具有多个应变电阻元件的半导体衬底和对应于电阻元件的温度补偿电阻元件。设置在形成于半导体基板上的动作部中的变形部的应变电阻元件的周边部的结构与在温度补偿电阻元件的周边部分的结构相同配置动作部。

8. 发明授权

US07536922B2 Force sensor chip 有权
标题翻译：力传感器芯片
公开(公告)号：US07536922B2
公开(公告)日：2009-05-26
申请号：US11889438
申请日：2007-08-13
申请人： Nobuhiro Sakurai , Takeshi Ohsato
发明人： Nobuhiro Sakurai , Takeshi Ohsato
IPC分类号： G01D7/00
CPC分类号： G01L1/205
摘要： In a force sensor chip, a semiconductor substrate includes: a plurality of operating parts each including an external-force acting area section and a non-deforming section; a supporting part for supporting the operating parts, and a plurality of connecting parts for connecting the operating parts and the supporting part. Strain resistance elements are provided on deformation-generating sections of the connecting parts. The plurality of operating parts are provided, in corresponding relation to the plurality of connecting parts, between the connecting parts and the supporting part.
摘要翻译：在力传感器芯片中，半导体衬底包括：多个操作部件，每个操作部件包括外力作用区域部分和非变形部分; 用于支撑操作部件的支撑部件和用于连接操作部件和支撑部件的多个连接部件。应变电阻元件设置在连接部件的变形产生部分上。多个操作部件以与多个连接部件相对应的方式设置在连接部件和支撑部件之间。

9. 发明申请

US20070266797A1 Force sensor chip 有权
标题翻译：力传感器芯片
公开(公告)号：US20070266797A1
公开(公告)日：2007-11-22
申请号：US11797173
申请日：2007-05-01
申请人： Yusuke Hirabayashi , Nobuhiro Sakurai , Takeshi Ohsato
发明人： Yusuke Hirabayashi , Nobuhiro Sakurai , Takeshi Ohsato
IPC分类号： G01L1/22 , G01L5/16
CPC分类号： G01L5/162
摘要： A force sensor chip having a multiaxial force sensing function is disclosed. The force sensor chip comprises a base member having an operating part provided with an external force application area, a supporting part for supporting the operating part, connecting parts for connecting the operating part and the supporting part, and strain resistance elements disposed in the connecting parts or within boundaries between the connecting parts and the operating part. The base member has a thin area formed with a small thickness, and the boundaries of the thin area are disposed in the supporting part and operating part.
摘要翻译：公开了一种具有多轴力检测功能的力传感器芯片。力传感器芯片包括具有设置有外力施加区域的操作部分的基座构件，用于支撑操作部件的支撑部件，用于连接操作部件和支撑部件的连接部件以及设置在连接部件中的应变阻力元件或在连接部件和操作部件之间的边界内。基部构件具有形成为较小厚度的薄区域，并且薄区域的边界设置在支撑部分和操作部分中。

10. 发明申请

US20060086190A1 Multi-axis force sensor chip and multi-axis force sensor using same 有权
标题翻译：多轴力传感器芯片和多轴力传感器使用相同
公开(公告)号：US20060086190A1
公开(公告)日：2006-04-27
申请号：US11256982
申请日：2005-10-25
申请人： Takeshi Ohsato , Nobuhiro Sakurai , Yusuke Hirabayashi , Hiroshi Yokobayashi
发明人： Takeshi Ohsato , Nobuhiro Sakurai , Yusuke Hirabayashi , Hiroshi Yokobayashi
IPC分类号： G01B7/16
CPC分类号： G01L5/162
摘要： A multi-axis sensor chip provided by the invention includes a semiconductor substrate having an action part having an external force action area part and non-deforming area parts, a support part supporting the action part, and connecting parts connecting the action part to the support part. The sensor chip also has strain resistance devices provided on deforming parts of the connecting parts and has temperature-compensating resistance devices provided on the non-deforming area parts. Temperature compensation is carried out exactly by means of the temperature-compensating resistance devices when an external force or a load acts on the action part, and highly accurate stress detection can be carried out.
摘要翻译：本发明提供的多轴传感器芯片包括：半导体基板，其具有具有外力作用区域部分和非变形区域部分的作用部分，支撑作用部分的支撑部分和将作用部分连接到支撑体的连接部件部分。传感器芯片还具有设置在连接部件的变形部分上的应变阻抗装置，并且具有设置在非变形区域部件上的温度补偿电阻装置。当外力或负载作用于动作部件时，通过温度补偿电阻装置进行温度补偿，可以进行高精度的应力检测。

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