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    • 5. 发明申请
    • POSITIVE PHOTOSENSITIVE SILOXANE COMPOSITION
    • 正性感光性硅氧烷组合物
    • US20130216952A1
    • 2013-08-22
    • US13814686
    • 2011-08-19
    • Daishi YokoyamaTakashi FukeYuji TashiroTakashi SekitoToshiaki Nonaka
    • Daishi YokoyamaTakashi FukeYuji TashiroTakashi SekitoToshiaki Nonaka
    • G03F7/075
    • G03F7/0757G03F7/022
    • A positive photosensitive siloxane composition containing: a polysiloxane (Ia), which is obtained by hydrolyzing and condensing the silane compound represented by RSi(OR1)3 in general formula (1) and the silane compound represented by Si(OR1)4 in general formula (2) in the presence of a basic catalyst, and a pre-baked film of which has a dissolution rate of 1,000 Å/second or less in a 5 wt % TMAH aqueous solution; a polysiloxane (Ib), which is obtained by hydrolyzing and condensing at least the silane compound represented by general formula (1) in the presence of an acid or basic catalyst, and a pre-baked film of which has a dissolution rate of 100 Å/second or more in a 2.38 wt % TMAH aqueous solution; and a diazonaphthoquinone derivative and solvent. (In the formula: R represents a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, in which any methylene may be replaced by oxygen, or represents an aryl group having 6 to 20 carbon atoms, in which any hydrogen may be replaced by fluorine; and R1 is an alkyl group having 1 to 5 carbon atoms.)
    • 一种正型感光性硅氧烷组合物,其含有聚硅氧烷(Ia),其通过使通式(1)中的RSi(OR 1)3表示的硅烷化合物和通式(1)中的Si(OR 1)4表示的硅烷化合物)通式 (2)在碱性催化剂存在下,其预烘膜在5重量%TMAH水溶液中的溶解速率为1000埃/秒以下。 通过在酸或碱性催化剂的存在下至少使通式(1)表示的硅烷化合物水解和缩合得到的聚硅氧烷(Ib),其预烘膜的溶解速率为 在2.38重量%TMAH水溶液中的/秒以上; 和重氮萘醌衍生物和溶剂。 (式中,R表示碳原子数1〜20的直链状,支链状或环状的烷基,其中任意亚甲基可被氧代替,或表示碳原子数为6〜20的芳基, 被氟取代; R1是具有1至5个碳原子的烷基)
    • 7. 发明申请
    • POSITIVE PHOTOSENSITIVE SILOXANE COMPOSITION
    • 正性感光性硅氧烷组合物
    • US20140335452A1
    • 2014-11-13
    • US14117433
    • 2012-05-15
    • Daishi YokoyamaTakashi FukeYuji TashiroTakashi SekitoToshiaki Nonaka
    • Daishi YokoyamaTakashi FukeYuji TashiroTakashi SekitoToshiaki Nonaka
    • G03F7/075
    • G03F7/0757C08G77/18C08K5/235C08L83/00C08L83/04G03F7/0233
    • A positive photosensitive siloxane composition comprising at least three types of following polysiloxanes (A), (B) and (C) obtained by hydrolyzing and condensing a silane compound represented by general formula (1) R1nSi (OR2)4-n, a diazonaphthoquinone derivative, and a solvent: a polysiloxane (A) such that if pre-baked the film thereof will be soluble in a 5 weight % TMAH aqueous solution and the solution rate of said film will be 1,000 Å/sec or less; a polysiloxane (B) such that if pre-baked the solution rate of the film thereof will be 4,000 Å/sec or more relative to a 2.38 weight % TMAH aqueous solution; and a polysiloxane (C) such that if pre-baked the solution rate of the film thereof will be between 200 and 3,000 Å/sec relative to a 2.38 weight % TMAH aqueous solution. (In the formula, R1 represents a C1-20 linear or branched cyclic alkyl group, in which any methylene may be substituted by oxygen, or a C6-20 aryl group, in which any hydrogen may be substituted by fluorine; n represents a 0 or a 1; and R2 represents a C1-5 alkyl group.)
    • 包含通过水解和缩合由通式(1)表示的硅烷化合物R1nSi(OR2)4-n,重氮萘醌衍生物(A),(C))所得到的至少三种以下聚硅氧烷(A),(B) 和溶剂:聚硅氧烷(A),使得如果其预烘烤,则其膜可溶于5重量%的TMAH水溶液中,并且所述膜的溶液速率将为1000埃/秒或更小; 聚硅氧烷(B),使得如果预烘焙,则相对于2.38重量%的TMAH水溶液,其膜的溶液速率将为4,000 /秒或更多; 和聚硅氧烷(C),使得如果预烘烤,则相对于2.38重量%的TMAH水溶液,其膜的溶液速率将在200和3000埃之间。 (式中,R 1表示可以被氧取代的任意亚甲基的C 1-20直链状或支链状的烷基或可被氟取代的氢原子的碳原子数为6〜20的芳基,n表示0以上 或1;且R 2表示C 1-5烷基。
    • 9. 发明授权
    • Composition of silicon-containing copolymer, solvent-soluble crosslinked silicon-containing copolymer, and cured articles obtained therefrom
    • 含硅共聚物,溶剂可溶性交联硅含量共聚物和由其获得的固化物的组成
    • US07371433B2
    • 2008-05-13
    • US10506855
    • 2003-04-04
    • Yuji Tashiro
    • Yuji Tashiro
    • B05D3/02
    • H01J11/12C08G77/54C08K5/5415C08K5/5465C08L83/14C09D183/14C09D183/16G02F1/133345H01J11/36H01J11/38H01J11/48H01J2211/366Y10T428/31663
    • A composition comprising a silicon-containing copolymer having a number-average molecular weight of 500 to 1,000,000, having SiO bond in the polymer and containing at least the structural units represented by the following general formulae (I) and (II) and, if necessary, one or more of the structural units represented by the following general formulae (III) to (VII) and a cross-linking agent is reacted at −20 to 100° C. for 1 to 3 hours. The resultant reaction composition is coated on a substrate and cured by heating to a temperature of 150° C. or above, for example, 250° C. to obtain a cured product of a silicon-containing copolymer which has a high heat resistance, a high light transmission, a low relative dielectric constant and a high chemical resistance and which has a strong mechanical strength and a good flexibility. wherein R1 to R6, R8 and R9 each independently represents an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group, an aralkyl group, an alkylamino group, an alkylsilyl group or an alkoxy group, R7 represents a divalent group, R10 represents a divalent aromatic group, and A represents NH or O.
    • 一种组合物,其包含数均分子量为500〜1,000,000的含硅共聚物,在聚合物中具有SiO键,并且至少含有由以下通式(I)和(II)表示的结构单元,并且如有必要 ,由以下通式(III)〜(VII)表示的结构单元中的一种以上,交联剂在-20〜100℃下反应1〜3小时。 将所得反应组合物涂布在基材上,通过加热至150℃以上,例如250℃的温度固化,得到耐热性高的含硅共聚物的固化物, 高透光率,低相对介电常数和高耐化学性,并且具有很强的机械强度和良好的柔韧性。 其中R 1至R 6,R 8和R 9各自独立地表示烷基,烯基 ,环烷基,芳基,芳烷基,烷基氨基,烷基甲硅烷基或烷氧基,R 7表示二价基团,R 10表示 二价芳基,A表示NH或O.
    • 10. 发明授权
    • Positive photosensitive siloxane composition
    • 正光敏硅氧烷组合物
    • US08993214B2
    • 2015-03-31
    • US14117433
    • 2012-05-15
    • Daishi YokoyamaTakashi FukeYuji TashiroTakashi SekitoToshiaki Nonaka
    • Daishi YokoyamaTakashi FukeYuji TashiroTakashi SekitoToshiaki Nonaka
    • G03F7/075G03F7/039G03F7/022
    • G03F7/0757C08G77/18C08K5/235C08L83/00C08L83/04G03F7/0233
    • A positive photosensitive siloxane composition comprising at least three types of following polysiloxanes (A), (B) and (C) obtained by hydrolyzing and condensing a silane compound represented by general formula (1) R1nSi (OR2)4-n, a diazonaphthoquinone derivative, and a solvent: a polysiloxane (A) such that if pre-baked the film thereof will be soluble in a 5 weight % TMAH aqueous solution and the solution rate of said film will be 1,000 Å/sec or less; a polysiloxane (B) such that if pre-baked the solution rate of the film thereof will be 4,000 Å/sec or more relative to a 2.38 weight % TMAH aqueous solution; and a polysiloxane (C) such that if pre-baked the solution rate of the film thereof will be between 200 and 3,000 Å/sec relative to a 2.38 weight % TMAH aqueous solution. (In the formula, R1 represents a C1-20 linear or branched cyclic alkyl group, in which any methylene may be substituted by oxygen, or a C6-20 aryl group, in which any hydrogen may be substituted by fluorine; n represents a 0 or a 1; and R2 represents a C1-5 alkyl group.)
    • 包含通过水解和缩合由通式(1)表示的硅烷化合物R1nSi(OR2)4-n,重氮萘醌衍生物(A),(C))所得到的至少三种以下聚硅氧烷(A),(B) 和溶剂:聚硅氧烷(A),使得如果其预烘烤,则其膜可溶于5重量%的TMAH水溶液中,并且所述膜的溶液速率将为1000埃/秒或更小; 聚硅氧烷(B),使得如果预烘焙,则相对于2.38重量%的TMAH水溶液,其膜的溶液速率将为4,000 /秒或更多; 和聚硅氧烷(C),使得如果预烘烤,则相对于2.38重量%的TMAH水溶液,其膜的溶液速率将在200和3000埃之间。 (式中,R 1表示可以被氧取代的任意亚甲基的C 1-20直链状或支链状的烷基或可被氟取代的氢原子的碳原子数为6〜20的芳基,n表示0以上 或1;且R 2表示C 1-5烷基。