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1. 发明授权

US06882249B2 Surface acoustic wave device 有权
标题翻译：表面声波装置
公开(公告)号：US06882249B2
公开(公告)日：2005-04-19
申请号：US09883481
申请日：2001-06-18
申请人： Yuichi Takamine , Kazunobu Shimoe , Shigeto Taga
发明人： Yuichi Takamine , Kazunobu Shimoe , Shigeto Taga
IPC分类号： H03H9/25 , H03H9/00 , H03H9/10 , H03H9/145 , H03H9/64
CPC分类号： H03H9/0061 , H01L2224/05554 , H01L2224/16225 , H01L2224/48227 , H01L2924/15174 , H01L2924/16195 , H03H9/0042 , H03H9/0057 , H03H9/0085 , H03H9/059 , H03H9/1071 , H03H9/14588 , H03H9/6489
摘要： A surface acoustic wave device includes a piezoelectric substrate, at least one IDT disposed on the piezoelectric substrate, and an input end and an output end connected to the IDT. At least one of the input end and the output end includes a pair of balanced signal terminals, and a delay line or a reactance component connected to one of the pair of balanced signal terminals.
摘要翻译：表面声波装置包括压电基板，设置在压电基板上的至少一个IDT，以及连接到IDT的输入端和输出端。输入端和输出端中的至少一个包括一对平衡信号端子，以及连接到该对平衡信号端子之一的延迟线或电抗分量。

2. 发明授权

US06718604B1 Mounting method for electronic device elements 有权
标题翻译：电子元器件的安装方法
公开(公告)号：US06718604B1
公开(公告)日：2004-04-13
申请号：US09596355
申请日：2000-06-17
申请人： Shigeto Taga , Kazunobu Shimoe , Ryoichi Kita
发明人： Shigeto Taga , Kazunobu Shimoe , Ryoichi Kita
IPC分类号： H04R1700
CPC分类号： H01L24/75 , H01L24/81 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/75 , H01L2224/75743 , H01L2224/81205 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01073 , H01L2924/01079 , Y10T29/42 , Y10T29/4913 , Y10T29/49144 , Y10T29/53178 , Y10T29/53191
摘要： A mounting method for an electronic device element, includes the steps of providing an electronic device element having metal bumps formed on a surface thereof, providing a bonding tool having a pressing surface, providing a mounting substrate, keeping the pressing surface of the bonding tool in contact with a reverse surface of the electronic device element and applying an ultrasonic wave to the bonding tool, thereby mounting the electronic device element on the mounting substrate. The maximum length of the pressing surface of the bonding tool in the ultrasonic-wave-oscillation direction is greater than about 0.5 times the maximum length of the reverse surface of the electronic device element in the ultrasonic-wave-oscillation direction.
摘要翻译：一种电子器件元件的安装方法，包括以下步骤：提供具有形成在其表面上的金属凸块的电子器件元件，提供具有按压表面的接合工具，提供安装基板，将接合工具的按压表面保持在与电子器件元件的反面相接触，并向接合工具施加超声波，从而将电子器件元件安装在安装基板上。接合工具在超声波振荡方向上的按压面的最大长度大于超声波振荡方向上的电子元件元件的背面的最大长度的约0.5倍。

3. 发明授权

US06552475B2 Surface acoustic wave device 有权
公开(公告)号：US06552475B2
公开(公告)日：2003-04-22
申请号：US09892231
申请日：2001-06-27
申请人： Yoshitsugu Hori , Yuji Kimura , Kazunobu Shimoe , Shigeto Taga , Toshiyuki Fuyutsume
发明人： Yoshitsugu Hori , Yuji Kimura , Kazunobu Shimoe , Shigeto Taga , Toshiyuki Fuyutsume
IPC分类号： H01L4108
CPC分类号： H03H3/08 , H01L2224/05001 , H01L2224/05023 , H01L2224/05027 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/11 , H01L2224/05624 , H01L2924/00014 , H01L2224/05639 , H01L2224/05644 , H01L2224/05124 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171
摘要： A surface acoustic wave device includes a surface acoustic wave substrate having two IDT electrodes including wiring electrode portions made of aluminum disposed thereon. First, second and third metal films are laminated on each of the wiring electrode portions. The first metal film has superior bondability to aluminum, and the third metal film has superior bondability to bumps. In addition, the second metal film has an ability to suppress the diffusion of the metal defining the first metal film.

4. 发明授权

US06710676B2 Surface acoustic wave filter device 有权
标题翻译：表面声波滤波装置
公开(公告)号：US06710676B2
公开(公告)日：2004-03-23
申请号：US10043133
申请日：2002-01-14
申请人： Masaru Yata , Kazunobu Shimoe , Yoichi Sawada , Hiroki Watanabe , Yuichi Takamine
发明人： Masaru Yata , Kazunobu Shimoe , Yoichi Sawada , Hiroki Watanabe , Yuichi Takamine
IPC分类号： H03H964
CPC分类号： H03H9/0061 , H03H9/0042 , H03H9/0071 , H03H9/14591
摘要： A surface acoustic wave filter device has a balance-unbalance conversion function and substantially equal input impedance and output impedance so as to increase out-of-passband attenuation. The surface acoustic wave filter device includes an unbalanced signal terminal, first and second balanced signal terminals, and first and second surface acoustic wave filters having input and output impedances. In each filter, one of the input and output impedances is approximately four times the other impedance. Additionally, 2n−1 first surface acoustic wave filters are connected between the unbalanced signal terminal and the first balanced signal terminal, and 2n−1 second surface acoustic wave filters are connected between the unbalanced signal terminal and the second balanced signal terminal, where n is an integer of 1 or more. The second surface acoustic wave filters are 180 degrees out-of-phase with respect to the first surface acoustic wave filters.
摘要翻译：表面声波滤波器装置具有平衡不平衡转换功能和基本相等的输入阻抗和输出阻抗，以便增加通带衰减。表面声波滤波器装置包括不平衡信号端子，第一和第二平衡信号端子以及具有输入和输出阻抗的第一和第二声表面波滤波器。在每个滤波器中，输入和输出阻抗之一约为另一个阻抗的四倍。另外，2 第一声表面波滤波器连接在不平衡信号端子和第一平衡信号端子之间，并且2 第二声表面波滤波器连接在不平衡信号端子和第二平衡信号端子之间信号端子，其中n是1或更大的整数。第二声表面波滤波器相对于第一声表面波滤波器是180度异相。

5. 发明授权

US06815834B2 Electronic part 失效
标题翻译：电子部件
公开(公告)号：US06815834B2
公开(公告)日：2004-11-09
申请号：US10240513
申请日：2003-04-22
申请人： Kazunobu Shimoe , Mitsuo Takeda , Toshiaki Takata , Norihiko Takada
发明人： Kazunobu Shimoe , Mitsuo Takeda , Toshiaki Takata , Norihiko Takada
IPC分类号： H01L2348
CPC分类号： H03H9/059 , H01L24/81 , H01L2224/05573 , H01L2224/05624 , H01L2224/05655 , H01L2224/05666 , H01L2224/13144 , H01L2224/16 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： An electronic component includes an electronic element and a substrate to which the electronic element is mounted, the electronic element and the substrate being electrically or mechanically connected to each other by at least three bumps. Both the value obtained by dividing the total bonding-area of the bumps bonded to the electronic element by the mass of the electronic element and the value obtained by dividing the total bonding-area of the bumps bonded to the substrate by the mass of the electronic element are at least about 8.8 mm2/g.
摘要翻译：电子部件包括电子元件和安装有电子元件的基板，电子元件和基板通过至少三个凸块彼此电或机械地连接。将与电子元件接合的凸点的总接合面积除以电子元件的质量所得到的值和通过将与基板接合的凸块的总接合面积除以电子元件的质量而得到的值元素为至少约8.8mm 2 / g。

6. 发明授权

US06437439B1 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US06437439B1
公开(公告)日：2002-08-20
申请号：US09532188
申请日：2000-03-21
申请人： Kazunobu Shimoe
发明人： Kazunobu Shimoe
IPC分类号： H01L2348
CPC分类号： H03H9/1071 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H03H9/059 , H01L2924/013 , H01L2924/00014
摘要： An electronic component includes an electronic component element electrically and mechanically joined to a base member, a plurality of electrode pads of the electronic component element and corresponding electrode lands of the base member being respectively joined together via bumps such that the electronic component element is arranged opposite to the base member. The bumps located along the peripheral portion of the electronic component element have a greater height than that of the bumps located at the central portion of the electronic component element.
摘要翻译：电子部件包括电气机械地接合到基底部件的电子部件元件，电子部件元件的多个电极焊盘和基体部件的对应电极焊盘通过凸块分别接合在一起，使得电子部件元件相对布置到基地会员。沿着电子元件元件的周边部分设置的凸块的高度高于位于电子元件的中心部分的凸块的高度。

7. 发明授权

US06792656B2 Surface acoustic wave apparatus and manufacturing method therefor 有权
标题翻译：表面声波装置及其制造方法
公开(公告)号：US06792656B2
公开(公告)日：2004-09-21
申请号：US10025901
申请日：2001-12-26
申请人： Kazunobu Shimoe , Shuji Yamato , Takashi Marukawa
发明人： Kazunobu Shimoe , Shuji Yamato , Takashi Marukawa
IPC分类号： H01L4108
CPC分类号： H03H3/08 , H03H9/02897 , H03H9/25 , Y10T29/42 , Y10T29/49128 , Y10T29/49156
摘要： A method for manufacturing a surface acoustic wave apparatus to be mounted via bumps by a flip chip bonding system prevents peeling of electrode pads from the piezoelectric substrate and cracks in the piezoelectric substrate from occurring during the formation of the bumps or at other times during the manufacturing process. In the method of manufacturing a surface acoustic wave apparatus, a first electrode layer of the electrode pad is formed on a piezoelectric substrate by etching, an electrode for a surface acoustic wave element is formed by a lift-off method after the first electrode layer is formed, and thereafter, an electrode film including a second electrode layer of the electrode pad and a wiring electrode is formed.
摘要翻译：制造通过倒装芯片接合系统通过凸块安装的表面声波装置的方法防止电极焊盘从压电基板剥离，并且压电基板中的裂纹在形成凸块期间或在制造过程中的其它时刻发生处理。在表面声波装置的制造方法中，通过蚀刻在压电基板上形成电极焊盘的第一电极层，在第一电极层是第一电极层之后，通过剥离法形成表面声波元件用电极形成，然后形成包括电极焊盘的第二电极层和布线电极的电极膜。

8. 发明授权

US06534862B2 Electronic component 有权
公开(公告)号：US06534862B2
公开(公告)日：2003-03-18
申请号：US10119128
申请日：2002-04-10
申请人： Kazunobu Shimoe
发明人： Kazunobu Shimoe
IPC分类号： H01L2940
CPC分类号： H03H9/1071 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H03H9/059 , H01L2924/013 , H01L2924/00014
摘要： An electronic component includes an electronic component element electrically and mechanically joined to a base member, a plurality of electrode pads of the electronic component element and corresponding electrode lands of the base member being respectively joined together via bumps such that the electronic component element is arranged opposite to the base member. The bumps located along the peripheral portion of the electronic component element have a greater height than that of the bumps located at the central portion of the electronic component element.

9. 发明授权

US07112913B2 Surface acoustic wave apparatus and manufacturing method therefor 有权
公开(公告)号：US07112913B2
公开(公告)日：2006-09-26
申请号：US10806404
申请日：2004-03-23
申请人： Kazunobu Shimoe , Shuji Yamato , Takashi Marukawa
发明人： Kazunobu Shimoe , Shuji Yamato , Takashi Marukawa
IPC分类号： H01L41/08
CPC分类号： H03H3/08 , H03H9/02897 , H03H9/25 , Y10T29/42 , Y10T29/49128 , Y10T29/49156
摘要： A method for manufacturing a surface acoustic wave apparatus to be mounted via bumps by a flip chip bonding system prevents peeling of electrode pads from the piezoelectric substrate and cracks in the piezoelectric substrate from occurring during the formation of the bumps or at other times during the manufacturing process. In the method of manufacturing a surface acoustic wave apparatus, a first electrode layer of the electrode pad is formed on a piezoelectric substrate by etching, an electrode for a surface acoustic wave element is formed by a lift-off method after the first electrode layer is formed, and thereafter, an electrode film including a second electrode layer of the electrode pad and a wiring electrode is formed.

10. 发明授权

US5986524A Surface acoustic wave resonator filter with a weighted asymmetrical interdigital electrode 失效
标题翻译：具有加权不对称叉指电极的表面声波谐振器滤波器
公开(公告)号：US5986524A
公开(公告)日：1999-11-16
申请号：US976798
申请日：1997-11-24
申请人： Kazunobu Shimoe
发明人： Kazunobu Shimoe
IPC分类号： H03H9/145 , H03H9/25 , H03H9/64
CPC分类号： H03H9/6436 , H03H9/25
摘要： A three-electrode longitudinally-coupled-type SAW resonator filter has an improved level of selectivity by effectively suppressing unwanted large spurious responses generated in a range higher than the pass band. A first ID electrode, a second ID electrode and a third ID electrode are disposed on a piezoelectric substrate. Reflectors are provided on one side of each of the second and third ID electrodes, respectively. A center distance L.sub.1 between the most adjacent electrode fingers of the respective first and second ID electrodes is differentiated from the center distance L.sub.2 between the most adjacent electrode fingers of the respective first and third ID electrodes. Further, the first ID electrode is weighted to more effectively suppress undesired spurious responses.
摘要翻译：三电极纵向耦合型SAW谐振滤波器通过有效地抑制在比通带高的范围内产生的不需要的大杂散响应，具有提高的选择性水平。第一ID电极，第二ID电极和第三ID电极设置在压电基板上。反射器分别设置在每个第二和第三ID电极的一侧。相应的第一和第二ID电极的最相邻的电极指之间的中心距离L1与相应的第一和第三ID电极的最相邻的电极指之间的中心距离L2不同。此外，第一ID电极被加权以更有效地抑制不期望的杂散响应。

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