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1. 发明授权

US07858415B2 Production methods of pattern thin film, semiconductor element, and circuit substrate, and resist material, semiconductor element, and circuit substrate 有权
标题翻译：图案薄膜，半导体元件和电路基板以及抗蚀剂材料，半导体元件和电路基板的制造方法
公开(公告)号：US07858415B2
公开(公告)日：2010-12-28
申请号：US11918398
申请日：2006-01-31
申请人： Yuichi Saito , Takeshi Hara
发明人： Yuichi Saito , Takeshi Hara
IPC分类号： H01L21/84
CPC分类号： H01L27/1285 , H01L27/1288 , H01L27/1292
摘要： The present invention provides production methods of a pattern thin film, a semiconductor element and a circuit substrate, capable of eliminating the number of photolithography processes needed for patterning; and a semiconductor element, a circuit substrate, and an electron device obtained by the production methods. The production method of the pattern thin film of the present invention is a production method of a pattern thin film, comprising the steps of: forming a first resist pattern film on a thin film formed on a substrate; forming a second resist pattern film; patterning the thin film using at least the second resist pattern film, wherein in the step of forming the second resist pattern film, a fluid resist material or an organic solvent is applied on a groove of a bank pattern formed using the first resist pattern film.
摘要翻译：本发明提供了能够消除图案化所需的光刻处理次数的图案薄膜，半导体元件和电路基板的制造方法; 以及通过制造方法得到的半导体元件，电路基板和电子元件。本发明的图案薄膜的制造方法是图案薄膜的制造方法，包括以下工序：在形成于基板上的薄膜上形成第一抗蚀剂图案膜; 形成第二抗蚀剂图案膜; 使用至少第二抗蚀剂图案膜对薄膜进行图案化，其中在形成第二抗蚀剂图案膜的步骤中，将流体抗蚀剂材料或有机溶剂施加到使用第一抗蚀剂图案膜形成的堤形图案的凹槽上。

2. 发明授权

US08283218B2 Production methods of a patterned thin film, semiconductor element, and circuit substrate using fluid resist material 有权
标题翻译：使用流体抗蚀剂材料的图案化薄膜，半导体元件和电路基板的制造方法
公开(公告)号：US08283218B2
公开(公告)日：2012-10-09
申请号：US12917078
申请日：2010-11-01
申请人： Yuichi Saito , Takeshi Hara
发明人： Yuichi Saito , Takeshi Hara
IPC分类号： H01L21/77 , H01L21/8234
CPC分类号： H01L27/1285 , H01L27/1288 , H01L27/1292
摘要： A production method of a semiconductor element having a channel includes forming a resist pattern film on a thin film formed on a substrate, and pattering the thin film by etching. The production method also includes forming a second resist pattern film by applying a fluid resist material inside a channel groove after channel etching or inside a resist groove formed above a channel region before channel etching. The production method may also include forming a gate electrode, a gate insulating film, a semiconductor film, and a conductive film on an insulating substrate. The method may include applying the fluid resist material inside the channel groove, thereby forming the second resist pattern film, and patterning the semiconductor film using at least the second resist pattern film.
摘要翻译：具有通道的半导体元件的制造方法包括在形成于基板上的薄膜上形成抗蚀剂图案膜，并通过蚀刻对薄膜进行图案化。该制造方法还包括通过在沟道蚀刻之后在沟道槽内部施加流动抗蚀剂材料或在通道蚀刻之前形成在通道区域上方的抗蚀剂槽内部形成第二抗蚀剂图案膜。制造方法还可以包括在绝缘基板上形成栅电极，栅绝缘膜，半导体膜和导电膜。该方法可以包括将流体抗蚀剂材料施加在沟道槽内，从而形成第二抗蚀剂图案膜，并使用至少第二抗蚀剂图案膜来图案化半导体膜。

3. 发明申请

US20090078937A1 PRODUCTION METHODS OF PATTERN THIN FILMS, SEMICONDUCTOR ELEMENT, AND CIRCUIT SUBSTRATE, AND RESIST MATERIAL, SEMICONDUCTOR ELEMENT, AND CIRCUIT SUBSTRATE 有权
标题翻译：图案薄膜，半导体元件和电路基板，耐电极材料，半导体元件和电路基板的生产方法
公开(公告)号：US20090078937A1
公开(公告)日：2009-03-26
申请号：US11918398
申请日：2006-01-31
申请人： Yuichi Saito , Takeshi Hara
发明人： Yuichi Saito , Takeshi Hara
IPC分类号： H01L29/04 , G03F7/20 , G03F7/004 , H01L21/336
CPC分类号： H01L27/1285 , H01L27/1288 , H01L27/1292
摘要： The present invention provides production methods of a pattern thin film, a semiconductor element and a circuit substrate, capable of eliminating the number of photolithography processes needed for patterning; and a semiconductor element, a circuit substrate, and an electron device obtained by the production methods. The production method of the pattern thin film of the present invention is a production method of a pattern thin film, comprising the steps of: forming a first resist pattern film on a thin film formed on a substrate; forming a second resist pattern film; patterning the thin film using at least the second resist pattern film, wherein in the step of forming the second resist pattern film, a fluid resist material or an organic solvent is applied on a groove of a bank pattern formed using the first resist pattern film.
摘要翻译：本发明提供了能够消除图案化所需的光刻处理次数的图案薄膜，半导体元件和电路基板的制造方法; 以及通过制造方法得到的半导体元件，电路基板和电子元件。本发明的图案薄膜的制造方法是图案薄膜的制造方法，包括以下工序：在形成于基板上的薄膜上形成第一抗蚀剂图案膜; 形成第二抗蚀剂图案膜; 使用至少第二抗蚀剂图案膜对薄膜进行图案化，其中在形成第二抗蚀剂图案膜的步骤中，将流体抗蚀剂材料或有机溶剂施加到使用第一抗蚀剂图案膜形成的堤形图案的凹槽上。

4. 发明授权

US08890912B2 Color erasing apparatus 有权
公开(公告)号：US08890912B2
公开(公告)日：2014-11-18
申请号：US13400523
申请日：2012-02-20
申请人： Hiroyuki Taki , Hiroyuki Tsuchihasi , Takahiro Kawaguchi , Isao Yahata , Yoshiaki Sugizaki , Kikuo Mizutani , Ken Iguchi , Chiaki Iizuka , Hidetoshi Yokochi , Toshiaki Oshiro , Hiroyuki Hazu , Yoichi Yamaguchi , Hiroyuki Sugiyama , Yuichi Saito
发明人： Hiroyuki Taki , Hiroyuki Tsuchihasi , Takahiro Kawaguchi , Isao Yahata , Yoshiaki Sugizaki , Kikuo Mizutani , Ken Iguchi , Chiaki Iizuka , Hidetoshi Yokochi , Toshiaki Oshiro , Hiroyuki Hazu , Yoichi Yamaguchi , Hiroyuki Sugiyama , Yuichi Saito
IPC分类号： B41J2/32 , B41M7/00 , B41J29/36
CPC分类号： B41J29/36 , B41J2/32 , B41J2202/37 , B41M7/0009
摘要： According to one embodiment, a color erasing apparatus includes a color erasing section which erases a color of an image formed with an erasable color material on a sheet conveyed at first speed, a reading section which reads an image on the surface of the sheet conveyed at second speed higher than the first speed, a first conveying section, and a second conveying section. The first conveying section includes a first conveying roller arranged downstream in a sheet conveying direction of the color erasing section and conveys the sheet at the first speed. The second conveying section includes a second conveying roller arranged upstream in the sheet conveying direction of the reading section and in a position where the second conveying roller nips the conveyed sheet simultaneously with the first conveying roller. The second conveying section conveys the sheet to the reading section at the second speed.

5. 发明授权

US08844927B2 Sheet loading apparatus, erasing apparatus, and sheet loading method 有权
标题翻译：片材装载装置，擦除装置和片材装载方法
公开(公告)号：US08844927B2
公开(公告)日：2014-09-30
申请号：US13534955
申请日：2012-06-27
申请人： Hiroyuki Hazu , Ken Iguchi , Yuichi Saito , Isao Yahata , Takahiro Kawaguchi , Yoshiaki Sugizaki , Kikuo Mizutani , Hiroyuki Taki , Hiroyuki Tsuchihashi , Chiaki Iizuka , Hidetoshi Yokochi , Toshiaki Oshiro , Yoichi Yamaguchi , Hiroyuki Sugiyama , Jun Ishii
发明人： Hiroyuki Hazu , Ken Iguchi , Yuichi Saito , Isao Yahata , Takahiro Kawaguchi , Yoshiaki Sugizaki , Kikuo Mizutani , Hiroyuki Taki , Hiroyuki Tsuchihashi , Chiaki Iizuka , Hidetoshi Yokochi , Toshiaki Oshiro , Yoichi Yamaguchi , Hiroyuki Sugiyama , Jun Ishii
IPC分类号： B65H31/36 , B65H31/10
CPC分类号： B65H31/10 , B65H31/36 , B65H2404/1521 , B65H2405/11152 , B65H2405/1117 , B65H2511/152 , B65H2511/212 , B65H2511/222 , B65H2220/01 , B65H2220/02 , B65H2220/03 , B65H2220/11
摘要： A sheet loading apparatus includes a loading member which loads the sheet discharged by the discharge member, a tip support member which abuts against the leading edge of the sheet discharged by the discharge member in the sheet discharge direction, a rotation member which abuts against an upper surface of the sheet discharged to the loading member, and is rotated to transport the sheet to the stopper side, and a control section which controls a transport amount of the sheet through the rotation member based on a loading amount of the sheet loaded on the loading member.
摘要翻译：片材装载装置包括装载由排出构件排出的片材的装载构件，与排出构件在片材排出方向上排出的片材的前端抵接的前端支撑构件，抵靠上部片材的旋转构件并且被转动以将片材运送到止动器侧;以及控制部分，其基于装载在装载物上的片材的装载量来控制通过旋转部件的片材的输送量会员。

6. 发明授权

US08670012B2 Erasing apparatus and erasing method 有权
标题翻译：擦除装置和擦除方法
公开(公告)号：US08670012B2
公开(公告)日：2014-03-11
申请号：US13528542
申请日：2012-06-20
申请人： Kikuo Mizutani , Isao Yahata , Takahiro Kawaguchi , Yoshiaki Sugizaki , Ken Iguchi , Hiroyuki Taki , Hiroyuki Tsuchihashi , Chiaki Iizuka , Hidetoshi Yokochi , Toshiaki Oshiro , Hiroyuki Hazu , Yoichi Yamaguchi , Hiroyuki Sugiyama , Yuichi Saito , Jun Ishii
发明人： Kikuo Mizutani , Isao Yahata , Takahiro Kawaguchi , Yoshiaki Sugizaki , Ken Iguchi , Hiroyuki Taki , Hiroyuki Tsuchihashi , Chiaki Iizuka , Hidetoshi Yokochi , Toshiaki Oshiro , Hiroyuki Hazu , Yoichi Yamaguchi , Hiroyuki Sugiyama , Yuichi Saito , Jun Ishii
IPC分类号： B41J2/32
CPC分类号： B41J2/32 , B41J2202/37
摘要： According to one embodiment, an erasing apparatus includes a paper feeding unit configured to feed a sheet having an image recorded, an erasing unit including a pressing roller and a heater that has a shape following the outer circumference of the pressing roller and includes a contact area with the pressing roller, the erasing unit being configured to erase the image formed on the sheet fed to a contact section of the pressing roller and the heater from the paper feeding unit, a temperature detecting unit configured to detect the temperature of the heater, a controller configured to control the heater according to the temperature detected by the temperature detecting unit, and a paper discharge unit configured to discharge the sheet on which the image is erased by the erasing unit.
摘要翻译：根据一个实施例，一种擦除装置包括：送纸单元，配置成进给具有记录图像的纸张，包括加压辊和加热器的擦除单元，其具有与加压辊的外周相邻的形状，并且包括接触区域利用加压辊，擦除单元被配置为从供纸单元擦除供给到加压辊和加热器的接触部分的片材上形成的图像，温度检测单元，其被配置为检测加热器的温度，控制器，其被配置为根据由温度检测单元检测到的温度来控制加热器;以及排纸单元，被配置为对由擦除单元擦除图像的片材进行排出。

7. 发明申请

US20130003138A1 SHADING DEVICE FOR IMAGE READING SECTION 有权
标题翻译：用于图像读取部分的高亮设备
公开(公告)号：US20130003138A1
公开(公告)日：2013-01-03
申请号：US13484232
申请日：2012-05-30
申请人： Yoshiaki Sugizaki , Hidetoshi Yokochi , Hiroyuki Tsuchihashi , Isao Yahata , Takahiro Kawaguchi , Ken Iguchi , Kikuo Mizutani , Hiroyuki Taki , Chiaki Ilzuka , Toshiaki Oshiro , Hiroyuki Hazu , Yoichi Yamaguchi , Hiroyuki Sugiyama , Yuichi Saito , Jun Ishii
发明人： Yoshiaki Sugizaki , Hidetoshi Yokochi , Hiroyuki Tsuchihashi , Isao Yahata , Takahiro Kawaguchi , Ken Iguchi , Kikuo Mizutani , Hiroyuki Taki , Chiaki Ilzuka , Toshiaki Oshiro , Hiroyuki Hazu , Yoichi Yamaguchi , Hiroyuki Sugiyama , Yuichi Saito , Jun Ishii
IPC分类号： H04N1/40
CPC分类号： H04N1/00588 , G03G15/60 , G03G2215/00189 , H04N1/00591 , H04N1/00602 , H04N1/00612 , H04N1/0062 , H04N1/00633 , H04N1/2032 , H04N1/401 , H04N1/4076 , H04N2201/044
摘要： A shading device includes: a shading member to pass a conveying path for conveying a recoding medium to plural image reading sections and reach the plural image reading sections; and a moving member to move the shading member between the plural image reading sections and a retracted position on the outside of the conveying path.
摘要翻译：遮光装置包括：遮光构件，用于将用于将记录介质传送到多个图像读取部分的传送路径，并到达多个图像读取部分; 以及移动构件，用于在多个图像读取部分之间移动遮光构件和在输送路径的外侧上的缩回位置。

8. 发明申请

US20130001050A1 SHEET PROCESSING APPARATUS, SHEET CONVEYING PATH OPENING METHOD, AND ERASING APPARATUS 有权
标题翻译：板材加工设备，输送路面打开方法和擦除装置
公开(公告)号：US20130001050A1
公开(公告)日：2013-01-03
申请号：US13529773
申请日：2012-06-21
申请人： Toshiaki OSHIRO , Isao Yahata , Takahiro Kawaguchi , Yoshiaki Sugizaka , Kikuo Mizutani , Hiroyuki Taki , Hiroyuki Tsuchihashi , Chiaki IIzuka , Hidetoshi Yokochi , Ken Iguchi , Hiroyuki Hazu , Yoichi Yamaguchi , Hiroyuki Sugiyama , Yuichi Saito
发明人： Toshiaki OSHIRO , Isao Yahata , Takahiro Kawaguchi , Yoshiaki Sugizaka , Kikuo Mizutani , Hiroyuki Taki , Hiroyuki Tsuchihashi , Chiaki IIzuka , Hidetoshi Yokochi , Ken Iguchi , Hiroyuki Hazu , Yoichi Yamaguchi , Hiroyuki Sugiyama , Yuichi Saito
IPC分类号： B65G21/10 , B65G13/02
CPC分类号： G03G21/00 , B65H2220/09 , B65H2402/31 , B65H2402/441 , B65H2601/11
摘要： A sheet processing apparatus includes: a conveying member configured to convey a sheet; a first opening section including a conveyance guide section arranged on the opposite side of the conveying member across a conveying path and configured to form the conveying path and a first pivot shaft configured to pivotably support the conveyance guide section, the first opening section being configured to form the conveying path using the conveyance guide section if changing to a closed state and open the conveying path if changing to an open state; and a second opening section including a cover section configured to cover the first opening section if the first opening section changes to the closed state and a second pivot shaft configured to pivotably support the cover section, the second opening section being configured to cause, if pivoting, the first opening section to pivot following the second opening section.
摘要翻译：一种片材处理设备包括：输送构件，用于输送片材; 第一开口部分，包括输送引导部分，该输送引导部分布置在输送部件的相对侧上并且构造成形成输送路径，第一枢轴构造成可枢转地支撑输送引导部，第一开口部被配置为如果改变为关闭状态，则使用输送引导部形成传送路径，如果改变为打开状态则打开输送路径; 以及第二开口部分，包括盖部分，其被构造成如果第一开口部分变为闭合状态则覆盖第一开口部分;以及第二枢转轴构造成可枢转地支撑盖部分，第二开口部分被构造成如果枢转，所述第一开口部分在所述第二开口部分之后枢转。

9. 发明申请

US20110101354A1 SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体元件及其制造方法
公开(公告)号：US20110101354A1
公开(公告)日：2011-05-05
申请号：US12864461
申请日：2009-01-08
申请人： Yuichi Saito , Masao Moriguchi , Akihiro Kohno
发明人： Yuichi Saito , Masao Moriguchi , Akihiro Kohno
IPC分类号： H01L33/16 , H01L21/336
CPC分类号： H01L29/78669 , H01L29/66765 , H01L29/78609 , H01L29/78618 , H01L29/78678
摘要： A semiconductor device 101 includes: a substrate 1; an active layer 4 provided on the substrate 1, the active layer 4 including a channel region 4c and a first region 4a and a second region 4b that are respectively located on opposite sides of the channel region 4c; a first contact layer 6a and a second contact layer 6b which are respectively in contact with the first region 4a and the second region 4b of the active layer 4; a first electrode 7 electrically coupled to the first region 4a via the first contact layer 6a; a second electrode 8 electrically coupled to the second region 4b via the second contact layer 6b; and a gate electrode 2 which is provided such that a gate insulating layer 3 is interposed between the gate electrode 2 and the active layer 4, the gate electrode 2 being configured to control a conductivity of the channel region 4c. The active layer 4 contains silicon. The semiconductor device further includes an oxygen-containing silicon layer 5 between the active layer 4 and the first and second contact layers 6a, 6b. The oxygen-containing silicon layer 5 contains oxygen at a concentration higher than the active layer 4 and the first and second contact layers 6a, 6b.
摘要翻译：半导体器件101包括：衬底1; 设置在基板1上的有源层4，有源层4包括分别位于沟道区域4c的相对侧上的沟道区域4c和第一区域4a和第二区域4b; 分别与有源层4的第一区域4a和第二区域4b接触的第一接触层6a和第二接触层6b; 经由第一接触层6a电耦合到第一区域4a的第一电极7; 经由第二接触层6b电耦合到第二区域4b的第二电极8; 栅极电极2被设置为使得栅极绝缘层3插入在栅极电极2和有源层4之间，栅电极2被配置为控制沟道区域4c的导电性。有源层4含有硅。半导体器件还包括有源层4和第一和第二接触层6a，6b之间的含氧硅层5。含氧硅层5含有浓度高于有源层4和第一和第二接触层6a，6b的氧。

10. 发明授权

US07731532B2 Connector 有权
标题翻译：连接器
公开(公告)号：US07731532B2
公开(公告)日：2010-06-08
申请号：US10585544
申请日：2005-06-17
申请人： Toshio Masumoto , Yuichi Saito
发明人： Toshio Masumoto , Yuichi Saito
IPC分类号： H01R13/648
CPC分类号： H01R13/648 , H01R12/724 , H01R13/658 , H01R13/73 , H01R13/748
摘要： A connector, comprising a connector body (11) having a flange (19), a shell (17) forming a contour part, and a reinforcement member (53). The reinforcement member (53) further comprises a reinforcement part (67) in contact with the flange (19) in which screw holes (57) are formed and an engagement part (65) engaged with the shell (17). The reinforcement member (53) is detachably fitted to the connector body (11).
摘要翻译：一种连接器，包括具有凸缘（19）的连接器主体（11），形成轮廓部分的壳体（17）和加强构件（53）。加强构件（53）还包括与其中形成有螺纹孔（57）的凸缘（19）接触的加强部分（67）和与壳体（17）接合的接合部分（65）。加强构件（53）可拆卸地装配到连接器主体（11）上。

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