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1. 发明授权

US07944043B1 Semiconductor device having improved contact interface reliability and method therefor 有权
标题翻译：具有改善的接触界面可靠性的半导体器件及其方法
公开(公告)号：US07944043B1
公开(公告)日：2011-05-17
申请号：US12169151
申请日：2008-07-08
申请人： Young Suk Chung , Jae Yoon Kim , Tae Yong Lee
发明人： Young Suk Chung , Jae Yoon Kim , Tae Yong Lee
IPC分类号： H01L23/04
CPC分类号： H01L23/3128 , H01L21/4832 , H01L21/486 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/13 , H01L23/3107 , H01L23/3114 , H01L23/49582 , H01L23/498 , H01L23/49816 , H01L23/49827 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2221/68345 , H01L2224/32225 , H01L2224/4809 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2224/83192 , H01L2224/85001 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/92247 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package has an insulative layer having at least one channel formed on a first surface thereof. A conductive pattern conforming to the at least one channel and exposed to a bottom surface of the semiconductor package is formed. A semiconductor die is electrically connected to the conductive patterns. An encapsulant is used to at least partially filling the at least one channel.
摘要翻译：半导体封装具有在其第一表面上形成有至少一个沟道的绝缘层。形成符合至少一个通道并暴露于半导体封装的底表面的导电图案。半导体管芯电连接到导电图案。密封剂用于至少部分填充至少一个通道。

2. 发明申请

US20140231859A1 SEMICONDUCTOR LIGHT-EMITTING ELEMENT 审中-公开
标题翻译：半导体发光元件
公开(公告)号：US20140231859A1
公开(公告)日：2014-08-21
申请号：US14236582
申请日：2011-08-01
申请人： Jae Yoon Kim , Seok Min Hwang , Su Yeol Lee , Seung Wan Chae , Jae Ho Han , Jin Bock Lee
发明人： Jae Yoon Kim , Seok Min Hwang , Su Yeol Lee , Seung Wan Chae , Jae Ho Han , Jin Bock Lee
IPC分类号： H01L33/38 , H01L33/62 , H01L33/32
CPC分类号： H01L33/387 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： A semiconductor light emitting device may include: a light emitting structure including an n-type semiconductor layer, a p-type semiconductor layer, and an active layer interposed therebetween; a first electrode connected to one of the n-type semiconductor layer and the p-type semiconductor layer; and a second electrode connected to the other of the n-type semiconductor layer and the p-type semiconductor layer. The first electrode may include a first electrode pad disposed in a central portion of one side of the light emitting structure and first to third branch electrodes connected to the first electrode pad, having a fork shape. The second electrode may include second and third electrode pads disposed separately in both corners of the other side opposing the one side and fourth to seventh branch electrodes connected thereto. The fourth and seventh branch electrodes may extend in an interdigitated manner between the first to third branch electrodes.
摘要翻译：半导体发光器件可以包括：包含n型半导体层，p型半导体层和插入其间的有源层的发光结构; 连接到所述n型半导体层和所述p型半导体层之一的第一电极; 以及与n型半导体层和p型半导体层中的另一方连接的第二电极。第一电极可以包括设置在发光结构的一侧的中心部分中的第一电极焊盘和连接到具有叉形状的第一电极焊盘的第一至第三分支电极。第二电极可以包括分别位于与一侧相对的另一侧的两个角部和与其连接的第四至第七分支电极的第二和第三电极焊盘。第四和第七分支电极可以在第一至第三分支电极之间以叉指方式延伸。

3. 发明申请

US20110169359A1 ASSEMBLY STRUCTURE OF BEARING AND HOLDER OF BRUSHLESS DC MOTOR 失效
标题翻译：无刷直流电机轴承和支架组装结构
公开(公告)号：US20110169359A1
公开(公告)日：2011-07-14
申请号：US12773725
申请日：2010-05-04
申请人： Jin Sun MIN , Dong Yeon Shin , Jae Yoon Kim
发明人： Jin Sun MIN , Dong Yeon Shin , Jae Yoon Kim
IPC分类号： H02K5/16
CPC分类号： H02K5/163 , F16C35/02
摘要： Disclosed herein is an assembly structure of a bearing and a holder of a brushless DC motor. The bearing is forcibly fitted into a hollow space formed through the holder. A beveled mouth edge is formed on the upper end of the circumferential inner surface of the holder through which the bearing enters the holder. Therefore, the assembly structure can enhance the workability of the process of assembling the bearing with the holder.
摘要翻译：这里公开了一种无刷直流电动机的轴承和保持器的组装结构。轴承被强制地装配到通过支架形成的中空空间中。在支架的周向内表面的上端形成有斜口嘴缘，轴承进入保持器。因此，组装结构可以提高轴承与支架的组装过程的可加工性。

4. 发明授权

US08969895B2 Semiconductor light emitting device and manufacturing method thereof 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08969895B2
公开(公告)日：2015-03-03
申请号：US13225979
申请日：2011-09-06
申请人： Jae Yoon Kim , Jin Bock Lee , Seok Min Hwang , Su Yeol Lee
发明人： Jae Yoon Kim , Jin Bock Lee , Seok Min Hwang , Su Yeol Lee
IPC分类号： H01L33/00 , H01L33/40 , H01L33/38 , H01L33/42 , H01L33/32
CPC分类号： H01L33/005 , H01L33/32 , H01L33/38 , H01L33/405 , H01L33/42 , H01L2933/0016 , H01L2933/0058
摘要： A semiconductor light emitting device includes: a light emission structure in which a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer are sequentially stacked; a first electrode formed on the first conductive semiconductor layer; an insulating layer formed on the second conductive semiconductor layer and made of a transparent material; a reflection unit formed on the insulating layer and reflecting light emitted from the active layer; a second electrode formed on the reflection unit; and a transparent electrode formed on the second conductive semiconductor layer, the transparent electrode being in contact with the insulating layer and the second electrode.
摘要翻译：一种半导体发光器件包括：发光结构，其中第一导电半导体层，有源层和第二导电半导体层依次层叠; 形成在所述第一导电半导体层上的第一电极; 形成在所述第二导电半导体层上并由透明材料制成的绝缘层; 反射单元，形成在所述绝缘层上并反射从所述有源层发射的光; 形成在反射单元上的第二电极; 以及形成在所述第二导电半导体层上的透明电极，所述透明电极与所述绝缘层和所述第二电极接触。

5. 发明申请

US20120017227A1 Motor and optical disc drive using the same 失效
标题翻译：电机和光盘驱动器使用相同
公开(公告)号：US20120017227A1
公开(公告)日：2012-01-19
申请号：US12929335
申请日：2011-01-14
申请人： Pyo Kim , Jae Yoon Kim , Dong Yeon Shin
发明人： Pyo Kim , Jae Yoon Kim , Dong Yeon Shin
IPC分类号： G11B17/028 , H02K5/167
CPC分类号： G11B19/2009 , H02K1/187 , H02K5/1675
摘要： There is provided a motor formed to have a simple coupling structure between a base plate and a sleeve holder, thereby implementing a simple structure and reducing costs and processes taken for manufacturing the motor, and an optical disc drive using the same. To this end, the motor includes a base plate having at least one protrusion formed therein, and a sleeve holder having a body part, of which the shape is cylindrical and in which a sleeve is fitted, and a flange protrudingly formed from a lower end of the body part in such a manner as to make surface-to-surface contact with an upper surface of the base plate, wherein the flange is formed to have at least one insertion hole, through which the protrusion is inserted so that the sleeve holder is coupled to the base plate.
摘要翻译：提供了一种电动机，其形成为在基板和套筒保持器之间具有简单的联接结构，从而实现简单的结构并降低了用于制造电动机的成本和过程，以及使用该马达的光盘驱动器。为此，电动机包括具有形成在其中的至少一个突起的基板和具有主体部分的套筒保持器，该主体部分的形状为圆柱形并且套筒中装配有一个凸缘，凸缘从下端突出地形成所述主体部分以与所述基板的上表面进行表面与表面接触的方式，其中所述凸缘形成为具有至少一个插入孔，所述突起通过所述至少一个插入孔使得所述套筒保持器耦合到基板。

6. 发明授权

US08089159B1 Semiconductor package with increased I/O density and method of making the same 有权
标题翻译：具有增加I / O密度的半导体封装和制造相同的方法
公开(公告)号：US08089159B1
公开(公告)日：2012-01-03
申请号：US11866886
申请日：2007-10-03
申请人： Doo Hyun Park , Jae Yoon Kim , Yoon Ha Jung
发明人： Doo Hyun Park , Jae Yoon Kim , Yoon Ha Jung
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/12 , H01L21/44
CPC分类号： H01L24/97 , H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L23/49582 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L2224/13099 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/16245 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49 , H01L2224/73265 , H01L2224/83101 , H01L2224/838 , H01L2224/85001 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/81 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： The present invention is related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a die pad having a semiconductor die mounted thereto, and two or more sets of leads or I/O pads which extend at least partially about the die pad in spaced relation thereto and to each other. The formation of the die pad and the leads of the leadframe are facilitated by the completion of multiple plating and chemical etching processes in a prescribed sequence. The present invention is further related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a semiconductor die electrically connected a plurality of leads or I/O pads via a flip chip type connection, each of the leads being formed by the completion of multiple plating and chemical etching processes in a prescribed sequence.
摘要翻译：本发明涉及一种半导体封装及其制造方法，其中半导体封装包括具有安装在其上的半导体管芯的管芯焊盘，以及至少部分地围绕模具延伸的两组或多组引线或I / O焊盘衬垫彼此间隔开并且彼此。通过以规定的顺序完成多次电镀和化学蚀刻工艺，促进了芯片焊盘和引线框架的引线的形成。本发明还涉及半导体封装及其制造方法，其中半导体封装包括通过倒装芯片型连接电连接多个引线或I / O焊盘的半导体管芯，每个引线由以规定的顺序完成多次电镀和化学蚀刻工艺。

7. 发明申请

US20110140583A1 Motor 失效
标题翻译：发动机
公开(公告)号：US20110140583A1
公开(公告)日：2011-06-16
申请号：US12923095
申请日：2010-09-01
申请人： Dong Woo Rhee , Jae Yoon Kim , Jun Kyu Park
发明人： Dong Woo Rhee , Jae Yoon Kim , Jun Kyu Park
IPC分类号： H02K11/00
CPC分类号： H02K29/10 , H02K11/22
摘要： Disclosed is a motor. The motor includes a rotor case, a ring member mounted on the rotor case and including an encoder on a bottom surface thereof extending outside of the rotor case, and an encoder sensor detecting speed information of the rotor case from the encoder such that the rotor case rotates at low speeds enabling a LightScribe operation.
摘要翻译：公开了一种电动机。电动机包括转子壳体，安装在转子壳体上的环形构件，并且在其底面上包括延伸到转子壳体外部的编码器，以及编码器传感器，其从编码器检测转子壳体的速度信息，使得转子壳体以低速旋转，实现LightScribe操作。

8. 发明申请

US20140175503A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20140175503A1
公开(公告)日：2014-06-26
申请号：US14237461
申请日：2011-08-17
申请人： Seok Min Hwang , Hae Soo Ha , Jae Yoon Kim , Jae Ho Han
发明人： Seok Min Hwang , Hae Soo Ha , Jae Yoon Kim , Jae Ho Han
IPC分类号： H01L33/38
CPC分类号： H01L33/38 , H01L33/20
摘要： A semiconductor light emitting device may include an n-type semiconductor layer, an active layer and a p-type semiconductor layer disposed in a first region corresponding to a portion of an upper surface of the n-type semiconductor layer, an n-type electrode formed in a second region distinct from the first region on the n-type semiconductor layer to be electrically connected to the n-type semiconductor layer and including an n-type electrode pad and first and second n-type electrode fingers, and a p-type electrode formed on the p-type semiconductor layer to be electrically connected to the p-type semiconductor layer and including a p-type electrode pad and a p-type electrode finger. A distance between n-type and p-type electrodes may be constant to significantly reduce a phenomenon of concentration of a current in a specific region of an electrode.
摘要翻译：半导体发光器件可以包括n型半导体层，有源层和p型半导体层，其设置在与n型半导体层的上表面的一部分对应的第一区域中，n型电极形成在与n型半导体层上的与n型半导体层电连接的第一区域不同的第二区域中，并且包括n型电极焊盘和第一和第n型电极指，形成在p型半导体层上以与p型半导体层电连接并且包括p型电极焊盘和p型电极指的p型电极。 n型和p型电极之间的距离可以是恒定的，以显着减少电极的特定区域中的电流浓度的现象。

9. 发明申请

US20140159083A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20140159083A1
公开(公告)日：2014-06-12
申请号：US13708567
申请日：2012-12-07
申请人： Jae Ho Han , Myeong Ha Kim , Jae Yoon Kim
发明人： Jae Ho Han , Myeong Ha Kim , Jae Yoon Kim
IPC分类号： H01L33/36 , H01L33/42 , H01L33/40
CPC分类号： H01L33/42 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/405 , H01L33/44
摘要： A semiconductor light emitting device includes a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer, an insulating region formed along the outer edges of an upper surface of the second conductivity-type semiconductor layer, and an ohmic-electrode layer disposed on the second conductivity-type semiconductor layer.
摘要翻译：半导体发光器件包括第一导电型半导体层，有源层，第二导电类型半导体层，沿着第二导电类型半导体层的上表面的外边缘形成的绝缘区域，以及欧姆电极层，设置在第二导电型半导体层上。

10. 发明授权

US08610162B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US08610162B2
公开(公告)日：2013-12-17
申请号：US13286807
申请日：2011-11-01
申请人： Seok Min Hwang , Jae Yoon Kim , Jin Bock Lee
发明人： Seok Min Hwang , Jae Yoon Kim , Jin Bock Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L33/42 , H01L2933/0016
摘要： A semiconductor light emitting device includes: first and second conductive type semiconductor layers; an active layer disposed between the first and second conductive type semiconductor layers; and first and second electrodes disposed on one surface of each of the first and second conductive type semiconductor layers, respectively, wherein at least one of the first and second electrodes includes a pad part and a finger part formed to extend from the pad part, and the end of the finger part has an annular shape. Because a phenomenon in which current is concentrated in a partial area of the finger part is minimized, tolerance to electrostatic discharge (ESD) can be strengthened and light extraction efficiency can be improved.
摘要翻译：半导体发光器件包括：第一和第二导电类型半导体层; 设置在所述第一和第二导电类型半导体层之间的有源层; 以及分别设置在每个第一和第二导电类型半导体层的一个表面上的第一和第二电极，其中第一和第二电极中的至少一个包括衬垫部分和形成为从衬垫部分延伸的指状部分，以及手指部分的端部具有环形形状。由于电流集中在手指部分的部分区域的现象最小化，因此可以增强对静电放电（ESD）的耐受性，并且可以提高光提取效率。

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