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1. 发明申请

US20090103374A1 MEMORY MODULES AND MEMORY SYSTEMS HAVING THE SAME 有权
标题翻译：具有相同模式的存储器模块和存储器系统
公开(公告)号：US20090103374A1
公开(公告)日：2009-04-23
申请号：US12330351
申请日：2008-12-08
申请人： You-Keun HAN , Seung-Jin SEO , Kwan-Yong JIN , Jung-Hwan CHOI , Jong-Hoon KIM , Seok-Il KIM , Joo-Sun CHOI
发明人： You-Keun HAN , Seung-Jin SEO , Kwan-Yong JIN , Jung-Hwan CHOI , Jong-Hoon KIM , Seok-Il KIM , Joo-Sun CHOI
IPC分类号： G11C7/10 , G11C8/00
CPC分类号： G11C5/04 , G11C5/02 , G11C7/1027 , G11C7/1045 , G11C7/1051 , G11C7/1066 , G11C7/22 , G11C11/4076 , G11C11/4096 , G11C2207/107 , G11C2207/2272
摘要： A memory module includes a plurality of data ports configured to receive/transmit associated data and a plurality of memory devices. The plurality of memory devices include a first set of the memory devices in at least one rank, each memory device of the first set being coupled to each of the associated data ports, and a second set of the memory devices in at least one other rank, each memory device of the second set being configured to receive/transmit the associated data for the memory device through at least each associated memory device of the first set.
摘要翻译：存储器模块包括被配置为接收/发送关联数据的多个数据端口和多个存储器件。所述多个存储器件包括至少一个等级的第一组存储器件，第一组的每个存储器件耦合到每个相关联的数据端口，以及在至少一个其它级中的第二组存储器件，所述第二组的每个存储器件被配置为通过所述第一组的至少每个相关联的存储器装置接收/发送所述存储器设备的相关联的数据。

2. 发明申请

US20150310671A1 SYSTEMS AND METHODS FOR AUGMENTED REALITY INTERACTION 审中-公开
标题翻译：用于实现现实交互的系统和方法
公开(公告)号：US20150310671A1
公开(公告)日：2015-10-29
申请号：US14699526
申请日：2015-04-29
申请人： Jong-Hoon KIM , Nagarajan PRABAKAR , S.S. IYENGAR , Lorenzo CASTILLO , Jon CARVAJAL , Eliana ALMARIO , Giuseppe VIETRI
发明人： Jong-Hoon KIM , Nagarajan PRABAKAR , S.S. IYENGAR , Lorenzo CASTILLO , Jon CARVAJAL , Eliana ALMARIO , Giuseppe VIETRI
IPC分类号： G06T19/00 , G06F3/0484 , G06F3/0481
CPC分类号： G06T19/006 , A63H23/08 , A63H23/16 , A63H30/04 , G06F3/04815 , G06F3/04842 , G06Q10/10
摘要： An augmented reality system is described that comprises a movable object comprising an object hardware component; a control hardware component for wirelessly transmitting and receiving signals via a communication link to the object hardware component; and a software component stored on a non-transitory computer-readable medium and in operable communication with the control hardware component. An application user interface is provided for enabling a user to provide command input for controlling the movement of the movable object via the object hardware component.
摘要翻译：描述了一种增强现实系统，其包括：包括对象硬件部件的可移动对象; 控制硬件组件，用于经由到对象硬件组件的通信链路无线发送和接收信号; 以及存储在非暂时计算机可读介质上并且与控制硬件组件可操作地通信的软件组件。提供了一种应用程序用户界面，用于使用户能够提供用于通过对象硬件组件来控制可移动对象的移动的命令输入。

3. 发明申请

US20100155886A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20100155886A1
公开(公告)日：2010-06-24
申请号：US12719979
申请日：2010-03-09
申请人： Jong-Hoon KIM
发明人： Jong-Hoon KIM
IPC分类号： H01L23/50
CPC分类号： H01L23/64 , H01L23/50 , H01L23/642 , H01L2924/0002 , H01L2924/01055 , H01L2924/01087 , H01L2924/19041 , H01L2924/19104 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
摘要： A semiconductor device is provided. The semiconductor device includes a chip having a plurality of first power voltage terminals connected in common to a first power voltage line, a plurality of second power voltage terminals connected in common with a second power voltage line, a first connection terminal, a second connection terminal connected to the first power voltage line or the second power voltage line, and an on-die capacitor. The semiconductor device also includes a package having a plurality of third power voltage terminals connected to the first power voltage terminals through a first wire by wire bonding during a packaging process and a plurality of fourth power voltage terminals connected to the second power voltage terminals through a second wire by wire bonding during the packaging process, and configured to package the chip, wherein one end of the on-die capacitor is connected to the first connection terminal, and the first connection terminal is connected to the second connection terminal through a third wire by wire bonding during the packaging process.
摘要翻译：提供半导体器件。半导体器件包括具有与第一电源线共同连接的多个第一电源电压端子，与第二电源电压线共同连接的多个第二电力电压端子的第一连接端子，第二连接端子连接到第一电源线或第二电源线，以及片上电容器。该半导体器件还包括具有多个第三电源电压端子的封装，该多个第三电源电压端子通过在封装工艺期间的引线接合而通过第一电线连接到第一电源电压端子，以及多个第四电力电压端子，其通过一个在封装过程中通过引线接合的第二线，并且被配置为封装所述芯片，其中所述片上电容器的一端连接到所述第一连接端子，并且所述第一连接端子通过第三线连接到所述第二连接端子通过在包装过程中的引线键合。

4. 发明申请

US20070202307A1 RIGID FLEXIBLE PRINTED CIRCUIT BOARD HAVING OPENINGS 审中-公开
标题翻译：刚性柔性印刷电路板有开口
公开(公告)号：US20070202307A1
公开(公告)日：2007-08-30
申请号：US11565869
申请日：2006-12-01
申请人： Byoung-Ha OH , Jong-Hoon KIM
发明人： Byoung-Ha OH , Jong-Hoon KIM
IPC分类号： B32B3/00
CPC分类号： H05K1/0253 , H05K1/0224 , H05K3/4691 , H05K2201/09318 , H05K2201/09681 , Y10T428/24917 , Y10T428/24926
摘要： Disclosed herein is a rigid flexible PCB having openings. The rigid flexible PCB includes a flexible section with flexibility and rigid sections being formed at the edges of the flexible section with mechanical stiffness. The flexible section comprises a flexible plane. The flexible plane comprises a base insulating layer; a wire conducting layer being adhered to one of the top side and the bottom side of the base insulating layer; and a plane conducting layer adhered to the other of the top side and the bottom side of the base insulating layer. The plane conducting layer has a plurality of openings being formed as a mesh structure. According to the rigid flexible PCB of the invention, the flexibility of the flexible section and the characteristic impedance of signal wire traces may be improved.
摘要翻译：本文公开了具有开口的刚性柔性PCB。刚性柔性PCB包括具有柔性的柔性部分，并且在柔性部分的边缘处形成具有机械刚度的刚性部分。柔性部分包括柔性平面。柔性平面包括基底绝缘层; 导电层粘接到基底绝缘层的顶侧和底侧之一; 以及与基底绝缘层的顶侧和底侧中的另一个粘合的平面导电层。平面导电层具有形成为网状结构的多个开口。根据本发明的刚性柔性PCB，可以提高柔性部分的灵活性和信号线迹线的特性阻抗。

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