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1. 发明申请

US20070202307A1 RIGID FLEXIBLE PRINTED CIRCUIT BOARD HAVING OPENINGS 审中-公开
标题翻译：刚性柔性印刷电路板有开口
公开(公告)号：US20070202307A1
公开(公告)日：2007-08-30
申请号：US11565869
申请日：2006-12-01
申请人： Byoung-Ha OH , Jong-Hoon KIM
发明人： Byoung-Ha OH , Jong-Hoon KIM
IPC分类号： B32B3/00
CPC分类号： H05K1/0253 , H05K1/0224 , H05K3/4691 , H05K2201/09318 , H05K2201/09681 , Y10T428/24917 , Y10T428/24926
摘要： Disclosed herein is a rigid flexible PCB having openings. The rigid flexible PCB includes a flexible section with flexibility and rigid sections being formed at the edges of the flexible section with mechanical stiffness. The flexible section comprises a flexible plane. The flexible plane comprises a base insulating layer; a wire conducting layer being adhered to one of the top side and the bottom side of the base insulating layer; and a plane conducting layer adhered to the other of the top side and the bottom side of the base insulating layer. The plane conducting layer has a plurality of openings being formed as a mesh structure. According to the rigid flexible PCB of the invention, the flexibility of the flexible section and the characteristic impedance of signal wire traces may be improved.
摘要翻译：本文公开了具有开口的刚性柔性PCB。刚性柔性PCB包括具有柔性的柔性部分，并且在柔性部分的边缘处形成具有机械刚度的刚性部分。柔性部分包括柔性平面。柔性平面包括基底绝缘层; 导电层粘接到基底绝缘层的顶侧和底侧之一; 以及与基底绝缘层的顶侧和底侧中的另一个粘合的平面导电层。平面导电层具有形成为网状结构的多个开口。根据本发明的刚性柔性PCB，可以提高柔性部分的灵活性和信号线迹线的特性阻抗。

2. 发明申请

US20070165390A1 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US20070165390A1
公开(公告)日：2007-07-19
申请号：US11489900
申请日：2006-07-20
申请人： Byoung-Ha Oh , Hwa-Jin Jung
发明人： Byoung-Ha Oh , Hwa-Jin Jung
IPC分类号： H05K1/11
CPC分类号： H05K3/4691 , H05K1/148 , H05K2201/09063 , H05K2201/09081
摘要： An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are mounted, and a signal transmission part for providing a signal transmission path between the first and second substrates, the signal transmission part being extended out of a region having a size smaller than a maximum size of the first substrate within the first substrate, and being extended in the second substrate. In disposing two substrates in a spaced-apart structure of upper and lower positions, a length of flexible printed circuit (FPC) connecting the two substrates can be reduced, and an impedance mismatching caused in use of the FPC can be reduced.
摘要翻译：一种改进的印刷电路板（PCB）包括第一和第二基板，其被布置为相互间隔或间隔开，并且其中安装有至少一个或多个半导体芯片;以及信号传输部分，用于在第一和第二基板之间提供信号传输路径第二基板，信号传输部分从第一基板内的尺寸小于第一基板的最大尺寸的区域延伸出来，并在第二基板中延伸。在将两个基板设置在上下位置的间隔开的结构中，可以减少连接两个基板的柔性印刷电路（FPC）的长度，并且可以减少在使用FPC时引起的阻抗失配。

3. 发明申请

US20090097297A1 Memory module having star-type topology and method of fabricating the same 有权
标题翻译：具有星型拓扑的存储器模块及其制造方法
公开(公告)号：US20090097297A1
公开(公告)日：2009-04-16
申请号：US12221728
申请日：2008-08-06
申请人： Do-Hyung Kim , Byoung-Ha Oh , Young-Jun Park , Yong-Ho Ko
发明人： Do-Hyung Kim , Byoung-Ha Oh , Young-Jun Park , Yong-Ho Ko
IPC分类号： G11C5/02 , H01S4/00 , G11C5/06
CPC分类号： G11C5/04 , G11C5/025 , Y10T29/49002
摘要： A memory module having a start-type topology and a method of fabricating the same are provided. The memory module includes a substrate. Memory devices are mounted on the substrate in at least two rows and at least two columns. A star-type topology is disposed to be electrically connected to the memory devices. One or more pairs of adjacent ones of the memory devices have a point-symmetric structure.
摘要翻译：提供具有起动型拓扑的存储器模块及其制造方法。存储器模块包括衬底。存储器件以至少两行和至少两列安装在衬底上。星型拓扑被布置成电连接到存储器件。一对或多对相邻的存储器件具有点对称结构。

4. 发明申请

US20070164448A1 Semiconductor chip package with attached electronic devices, and integrated circuit module having the same 审中-公开
标题翻译：带有电子器件的半导体芯片封装，以及具有相同电路的集成电路模块
公开(公告)号：US20070164448A1
公开(公告)日：2007-07-19
申请号：US11505361
申请日：2006-08-17
申请人： Kyoung-Sun Kim , Ki-Hyun Ko , Byoung-Ha Oh
发明人： Kyoung-Sun Kim , Ki-Hyun Ko , Byoung-Ha Oh
IPC分类号： H01L23/48
CPC分类号： H01L23/66 , H01L23/13 , H01L23/49816 , H01L23/562 , H01L24/48 , H01L2224/16 , H01L2224/4824 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K3/303 , H05K2201/10378 , H05K2201/1053 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided are a semiconductor chip package with attached electronic devices, and an integrated circuit module having the same. The semiconductor chip packages may include a supporting substrate, input/output bonding pads arranged on a first plane of the supporting substrate, and device bonding pads arranged on the edges of the first plane or portions of the first plane adjacent to the edges. Accordingly, the mount area of a printed circuit board may be reduced, efficient routing may be possible, and the occurrence of package cracks may be reduced and/or prevented.
摘要翻译：提供了具有附接的电子设备的半导体芯片封装以及具有该电子器件的集成电路模块。半导体芯片封装可以包括支撑衬底，布置在支撑衬底的第一平面上的输入/输出接合焊盘以及布置在第一平面的边缘上的第一平面的边缘或邻近边缘的第一平面的部分的器件接合焊盘。因此，可以减少印刷电路板的安装面积，可以有效地布线，并且可以减少和/或防止包装裂缝的发生。

5. 发明授权

US08040201B2 Substrate having a structure for suppressing noise generated in a power plane and/or a ground plane, and an electronic system including the same 有权
标题翻译：具有用于抑制在电力平面和/或接地平面中产生的噪声的结构的基板，以及包括该基板的电子系统
公开(公告)号：US08040201B2
公开(公告)日：2011-10-18
申请号：US12354488
申请日：2009-01-15
申请人： Kwang-Soo Park , Byoung-Ha Oh , Yong-Ho Ko
发明人： Kwang-Soo Park , Byoung-Ha Oh , Yong-Ho Ko
IPC分类号： H04B3/30 , H01P3/08
CPC分类号： H05K1/0216 , H05K1/0234 , H05K1/0298 , H05K1/09 , H05K1/167 , H05K2201/0338 , H05K2201/0352 , H05K2201/09318 , H05K2201/09327
摘要： A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.
摘要翻译：基板包括放置在彼此之间并且基本上彼此平行的电源平面和接地平面以及放置在电源平面和接地平面之间的至少一条信号线。接地平面包括具有第一导电性的第一导电层。功率平面包括具有第一导电性的第二导电层，并且功率平面或接地平面包括具有比第一导电率低的第二导电性的第三导电层。第三导电层面对穿过电介质物质的至少一条信号线。

6. 发明申请

US20090184778A1 SUBSTRATE HAVING A STRUCTURE FOR SUPPRESSING NOISE GENERATED IN A POWER PLANE AND/OR A GROUND PLANE, AND AN ELECTRONIC SYSTEM INCLUDING THE SAME 有权
标题翻译：具有用于抑制在电力平面和/或地面平面中产生的噪声的结构的基板以及包括其的电子系统
公开(公告)号：US20090184778A1
公开(公告)日：2009-07-23
申请号：US12354488
申请日：2009-01-15
申请人： Kwang-Soo Park , Byoung-Ha Oh , Yong-Ho Ko
发明人： Kwang-Soo Park , Byoung-Ha Oh , Yong-Ho Ko
IPC分类号： H04B15/00
CPC分类号： H05K1/0216 , H05K1/0234 , H05K1/0298 , H05K1/09 , H05K1/167 , H05K2201/0338 , H05K2201/0352 , H05K2201/09318 , H05K2201/09327
摘要： A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.
摘要翻译：基板包括放置在彼此之间并且基本上彼此平行的电源平面和接地平面以及放置在电源平面和接地平面之间的至少一条信号线。接地平面包括具有第一导电性的第一导电层。功率平面包括具有第一导电性的第二导电层，并且功率平面或接地平面包括具有比第一导电率低的第二导电性的第三导电层。第三导电层面对穿过电介质物质的至少一条信号线。

7. 发明授权

US07821803B2 Memory module having star-type topology and method of fabricating the same 有权
标题翻译：具有星型拓扑的存储器模块及其制造方法
公开(公告)号：US07821803B2
公开(公告)日：2010-10-26
申请号：US12221728
申请日：2008-08-06
申请人： Do-Hyung Kim , Byoung-Ha Oh , Young-Jun Park , Yong-Ho Ko
发明人： Do-Hyung Kim , Byoung-Ha Oh , Young-Jun Park , Yong-Ho Ko
IPC分类号： G11C5/02
CPC分类号： G11C5/04 , G11C5/025 , Y10T29/49002
摘要： A memory module having a start-type topology and a method of fabricating the same are provided. The memory module includes a substrate. Memory devices are mounted on the substrate in at least two rows and at least two columns. A star-type topology is disposed to be electrically connected to the memory devices. One or more pairs of adjacent ones of the memory devices have a point-symmetric structure.
摘要翻译：提供具有起动型拓扑的存储器模块及其制造方法。存储器模块包括衬底。存储器件以至少两行和至少两列安装在衬底上。星型拓扑被布置成电连接到存储器件。一对或多对相邻的存储器件具有点对称结构。

8. 发明授权

US07450398B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US07450398B2
公开(公告)日：2008-11-11
申请号：US11489900
申请日：2006-07-20
申请人： Byoung-Ha Oh , Hwa-Jin Jung
发明人： Byoung-Ha Oh , Hwa-Jin Jung
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K3/4691 , H05K1/148 , H05K2201/09063 , H05K2201/09081
摘要： An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are mounted, and a signal transmission part for providing a signal transmission path between the first and second substrates, the signal transmission part being extended out of a region having a size smaller than a maximum size of the first substrate within the first substrate, and being extended in the second substrate. In disposing two substrates in a spaced-apart structure of upper and lower positions, a length of flexible printed circuit (FPC) connecting the two substrates can be reduced, and an impedance mismatching caused in use of the FPC can be reduced.
摘要翻译：一种改进的印刷电路板（PCB）包括第一和第二基板，其被布置为相互间隔或间隔开，并且其中安装有至少一个或多个半导体芯片;以及信号传输部分，用于在第一和第二基板之间提供信号传输路径第二基板，信号传输部分从第一基板内的尺寸小于第一基板的最大尺寸的区域延伸出来，并在第二基板中延伸。在将两个基板设置在上下位置的间隔开的结构中，可以减少连接两个基板的柔性印刷电路（FPC）的长度，并且可以减少在使用FPC时引起的阻抗失配。

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