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    • 3. 发明授权
    • Method of producing a semiconductor structure including a recrystallized
film
    • 制造包括再结晶膜的半导体结构的方法
    • US5467731A
    • 1995-11-21
    • US322375
    • 1994-10-13
    • Satoshi ArimotoNorio HayafujiMikio DeguchiSatoshi Hamamoto
    • Satoshi ArimotoNorio HayafujiMikio DeguchiSatoshi Hamamoto
    • H01L21/208H01L21/20C30B13/20
    • H01L21/2022
    • A method for producing a semiconductor structure including a semiconductor film formed on a semiconductor substrate body via an insulating film includes: laminating a first insulating film, a first semiconductor film, and a second insulating film on the semiconductor substrate successively; forming stripe-shaped second semiconductor films of predetermined width on the second insulating film arranged periodically at a predetermined interval and covering these second semiconductor films with a third insulating film; performing zone melting recrystallization of the first semiconductor film from one end of the substrate to the opposite end along the stripe direction of the stripe-shaped second semiconductor film; etching the third insulating film and portions of the second insulating film not sandwiched by the first and second semiconductor films; oxidizing portions of the second semiconductor film and the first semiconductor film exposed in the etching step and etching and removing the second insulating film remaining after the previous etching. Thus, a semiconductor substrate including a recrystallized semiconductor film having removed sub-grain-boundaries generated during the zone melting recrystallization, is obtained by fewer process steps than in the prior art.
    • 一种用于制造半导体结构的方法,该半导体结构包括通过绝缘膜形成在半导体衬底本体上的半导体膜,包括:依次在半导体衬底上层叠第一绝缘膜,第一半导体膜和第二绝缘膜; 在预定间隔周期性地布置的第二绝缘膜上形成预定宽度的条状第二半导体膜,并用第三绝缘膜覆盖这些第二半导体膜; 从所述基板的一端到所述条状的第二半导体膜的条带方向的相反端进行区域熔融再结晶的第一半导体膜; 蚀刻第三绝缘膜和未被第一和第二半导体膜夹持的第二绝缘膜的部分; 在蚀刻步骤中暴露的第二半导体膜和第一半导体膜的氧化部分,并蚀刻除去在先前蚀刻之后残留的第二绝缘膜。 因此,通过比现有技术更少的工艺步骤获得包括在区域熔融再结晶期间产生的去除亚晶界的再结晶半导体膜的半导体衬底。
    • 6. 发明授权
    • Method for fabricating recrystallized semiconductor film
    • 用于制备重晶体半导体膜的方法
    • US5228948A
    • 1993-07-20
    • US802481
    • 1991-12-05
    • Mikio Deguchi
    • Mikio Deguchi
    • H01L21/20H01L21/225H01L21/84
    • H01L21/2022H01L21/2007H01L21/2254Y10S117/913
    • A method for fabricating a recrystallized semiconductor film includes forming a polycrystalline or amorphous semiconductor film on a base having a melting point or softening temperature lower than the melting point of the semiconductor film, heating the base to melt it with a first heater, and melting the semiconductor film with a second heater and recrystallizing the semiconductor film while the base is molten. Thereby, generation of stress in the semiconductor film is prevented or reduced and the planarity of the semiconductor film is not damaged by distortion of the substrate and the temperature in the semiconductor film is uniform at the time of recrystallization. As a result, a recrystallized film with good crystallinity is obtained.
    • 制造再结晶半导体膜的方法包括在具有低于半导体膜的熔点的熔点或软化温度的基底上形成多晶或非晶半导体膜,加热基底以用第一加热器熔化, 具有第二加热器的半导体膜,并且在基底熔融时重新结晶半导体膜。 由此,防止或减少半导体膜中的应力的产生,并且半导体膜的平坦性不会由于基板的变形而损坏,并且半导体膜中的温度在再结晶时是均匀的。 结果,得到结晶度良好的再结晶膜。
    • 8. 发明授权
    • Apparatus for producing semiconductor devices
    • 用于制造半导体器件的装置
    • US5006192A
    • 1991-04-09
    • US273556
    • 1988-11-21
    • Mikio Deguchi
    • Mikio Deguchi
    • H01L21/205H01J37/32H01L21/31
    • H01J37/32862Y10S438/905
    • An apparatus for treating wafers utilizing the plasma produced by a gas discharge and a method of cleaning such apparatus are disclosed. The apparatus is equipped with a device for forming a high voltage electric field in a space outside of the discharge space in which the wafer treating plasma is generated. The cleaning of the inner surfaces of the vacuum vessel of the apparatus is effected during the periods between the treatments by means of the plasma generated by the gas discharge started and sustained by the electric field device as well as by a main electrode for maintaining the treating discharge. The device for forming a high voltage electric field as mentioned above may comprise a limiter electrode surrounding the treating discharge space; alternatively, it may comprise an auxiliary electrode disposed in the space outside the treating discharge space. First, an etching gas capable of etching the films deposited on the inner surfaces of the vessel of the apparatus is introduced into the vessel as the discharge gas in the cleaning process; next, hydrogen is introduced into the vessel to remove the impurities adsorbed on the surfaces of the vessel. The etching gas may comprise hydrogen or argon.
    • 公开了一种利用由气体放电产生的等离子体处理晶片的设备和清洁这种设备的方法。 该装置配备有在其中产生晶片处理等离子体的放电空间外部的空间中形成高电压电场的装置。 在设备的真空容器的内表面的清洁通过由电场装置启动和维持的气体放电产生的等离子体以及通过用于维持处理的主电极而产生的等离子体之间的期间进行 卸货。 如上所述的用于形成高电压电场的装置可以包括围绕处理放电空间的限制电极; 或者,其可以包括设置在处理放电空间外部的空间中的辅助电极。 首先,将能够蚀刻沉积在装置的容器的内表面上的膜的蚀刻气体作为清洗工序中的放电气体引入容器内; 接下来,将氢气引入容器中以除去吸附在容器表面上的杂质。 蚀刻气体可以包括氢气或氩气。