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1. 发明申请

US20120285013A1 Electronic Component-Embedded Board and Method of Manufacturing the Same 审中-公开
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US20120285013A1
公开(公告)日：2012-11-15
申请号：US13533176
申请日：2012-06-26
申请人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
IPC分类号： H05K3/30
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/16227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/0271 , H05K3/0052 , H05K3/0097 , H05K3/4602 , H05K2201/068 , H05K2201/2009 , H05K2203/0169 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet includes insulating layers on one surface of an approximately rectangular substrate, and an electronic component and a plate-like frame member (member) embedded inside the insulating layer, wherein the plate-like frame member satisfying the relationship represented by the following formula (1): α1
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作表包括在近似矩形基板的一个表面上的绝缘层，以及嵌入在绝缘层内部的电子部件和板状框架部件（部件），其中满足由下列公式表示的关系的板状框架部件 1）：将α1<α3和α2<α3（1）安装在基板上的电子部件的未安装部分上。在该式中，α1，α2和α3分别表示电子部件，板状框架部件和基板，各个布线层或各绝缘层的线性热膨胀系数（ppm / K）。

2. 发明申请

US20090025971A1 Electronic component-embedded board and method of manufacturing the same 有权
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US20090025971A1
公开(公告)日：2009-01-29
申请号：US12219355
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
IPC分类号： H05K3/30 , H05K1/16
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/16227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/0271 , H05K3/0052 , H05K3/0097 , H05K3/4602 , H05K2201/068 , H05K2201/2009 , H05K2203/0169 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1): α1
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作片100包括在近似矩形基板11的一个表面上的绝缘层21和31，以及嵌入在绝缘层21内的电子部件41和板状框架部件（部件）51，其中板状框架部件51 满足由下式（1）表示的关系：α1α3和α2α3。。。（1）安装在基板11上的电子部件41的未安装部分上。在该公式中，α1，α2和α3分别表示电子部件41的线性热膨胀系数（ppm / K），板类框架构件51和基板11，各个布线层或各绝缘层。

3. 发明授权

US08237059B2 Electronic component-embedded board and method of manufacturing the same 有权
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US08237059B2
公开(公告)日：2012-08-07
申请号：US12219355
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
IPC分类号： H05K1/16 , H05K1/18
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/16227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/0271 , H05K3/0052 , H05K3/0097 , H05K3/4602 , H05K2201/068 , H05K2201/2009 , H05K2203/0169 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1): α1
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作片100包括在近似矩形基板11的一个表面上的绝缘层21和31，以及嵌入在绝缘层21内的电子部件41和板状框架部件（部件）51，其中板状框架部件51 满足由下式（1）表示的关系：α1<α3和α2<α3。。。（1）安装在基板11上的电子部件41的未安装部分上。在该公式中，α1，α2和α3分别表示电子部件41的线性热膨胀系数（ppm / K），板类框架构件51和基板11，各个布线层或各绝缘层。

4. 发明申请

US20090025961A1 Electronic component-embedded board and method of manufacturing the same 审中-公开
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US20090025961A1
公开(公告)日：2009-01-29
申请号：US12219354
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Hiroshige Ohkawa , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Hiroshige Ohkawa , Kenichi Kawabata
IPC分类号： H05K1/00 , H05K3/10
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K3/0052 , H05K3/4644 , H05K2201/10204 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , Y10T29/49155 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and electronic components 41 and chip-like dummy parts 51 primarily made from the same material as the primary material of the electronic component 41 are embedded into the insulating layer 21. Chip-like dummy parts 51 are disposed in an unmounted portion of the electronic components 41 in, for example, a frame-like arrangement so as to surround the plurality of electronic components (groups) 41.
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作片100在大致矩形的基板11的一个表面上包括绝缘层21和31，并且主要由与电子部件41的主要材料相同的材料制成的电子部件41和芯片状的虚拟部分51嵌入绝缘层芯片状虚拟部件51以例如框状的方式设置在电子部件41的未安装部分中，以围绕多个电子部件（组）41。

5. 发明授权

US08502081B2 Assembly substrate and method of manufacturing the same 有权
公开(公告)号：US08502081B2
公开(公告)日：2013-08-06
申请号：US12219372
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Kenichi Kawabata
IPC分类号： H05K1/03 , H05K7/02 , H05K7/04
CPC分类号： H05K3/0052 , H01L23/49838 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H05K1/0271 , H05K1/112 , H05K1/185 , H05K3/0097 , H05K3/4602 , H05K2201/09136 , H05K2201/10636 , H05K2201/10674 , H05K2201/2009 , H05K2203/0169 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , H01L2224/82 , H01L2924/00
摘要： The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).

6. 发明申请

US20090025965A1 Assembly substrate and method of manufacturing the same 有权
标题翻译：装配基板及其制造方法
公开(公告)号：US20090025965A1
公开(公告)日：2009-01-29
申请号：US12219372
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Kenichi Kawabata
IPC分类号： H05K1/02 , H05K3/00
CPC分类号： H05K3/0052 , H01L23/49838 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H05K1/0271 , H05K1/112 , H05K1/185 , H05K3/0097 , H05K3/4602 , H05K2201/09136 , H05K2201/10636 , H05K2201/10674 , H05K2201/2009 , H05K2203/0169 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , H01L2224/82 , H01L2924/00
摘要： The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).
摘要翻译：本发明的目的是提供一种易于处理并能够抑制翘曲发生并且提供高生产率和经济效率的组装基板及其制造方法。工作板100在大致矩形的基板11的一个表面上包括绝缘层21，并且电子部件41和板状集成框架51嵌入在绝缘层21的内部。板状集成框架51具有多个凹部53在其内周壁52a处平行布置，并且布置在电子部件41的非放置区域上以围绕多个电子部件41（组）。

7. 发明授权

US06818382B2 Photosensitive composition, cured article thereof, and printed circuit board using the same 有权
标题翻译：感光性组合物，其固化物和使用其的印刷电路板
公开(公告)号：US06818382B2
公开(公告)日：2004-11-16
申请号：US10129185
申请日：2002-05-02
申请人： Kenji Tamura , Motoyuki Hirata , Yoshikazu Kanemaru
发明人： Kenji Tamura , Motoyuki Hirata , Yoshikazu Kanemaru
IPC分类号： G03F7028
CPC分类号： G03F7/038 , G03F7/027 , H05K3/287
摘要： The photosensitive composition of the present invention comprises a photocurable component containing a urethane (meth)acrylate compound (A) having a carboxyl group; a thermosetting resin (C); a photopolymerization initiator (D); and a thermopolymerization catalyst (E); and the above-mentioned photocurable component further contains at least one of (B) a compound having an ethylenically unsaturated group, excluding the component (A), and an epoxy (meth)acrylate compound (F) having a carboxyl group. Therefore, the photosensitive composition is suitable for use as an insulating protective coating film for printed circuit boards. Since the cured film made of the photosensitive composition of the present invention is particularly superior in pliability, curling does not occur even when used for a thin circuit board. Therefore, the cured film is best suited for use in an FPC board.
摘要翻译：本发明的感光性组合物含有含有羧基的氨基甲酸酯（甲基）丙烯酸酯化合物（A）的光固化性成分，热固性树脂（C）; 光聚合引发剂（D）; 和热聚合催化剂（E）; 上述光固化性成分还含有除了（A）成分以外的（B）具有烯键式不饱和基团的化合物和具有羧基的环氧（甲基）丙烯酸酯化合物（F））中的至少一种。因此，感光性组合物适合用作印刷电路板用绝缘保护涂膜。由于由本发明的感光组合物制成的固化膜在柔韧性方面特别优异，所以即使用于薄电路板也不会发生卷曲。因此，固化膜最适用于FPC基板。

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