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    • 7. 发明授权
    • Photosensitive composition, cured article thereof, and printed circuit board using the same
    • 感光性组合物,其固化物和使用其的印刷电路板
    • US06818382B2
    • 2004-11-16
    • US10129185
    • 2002-05-02
    • Kenji TamuraMotoyuki HirataYoshikazu Kanemaru
    • Kenji TamuraMotoyuki HirataYoshikazu Kanemaru
    • G03F7028
    • G03F7/038G03F7/027H05K3/287
    • The photosensitive composition of the present invention comprises a photocurable component containing a urethane (meth)acrylate compound (A) having a carboxyl group; a thermosetting resin (C); a photopolymerization initiator (D); and a thermopolymerization catalyst (E); and the above-mentioned photocurable component further contains at least one of (B) a compound having an ethylenically unsaturated group, excluding the component (A), and an epoxy (meth)acrylate compound (F) having a carboxyl group. Therefore, the photosensitive composition is suitable for use as an insulating protective coating film for printed circuit boards. Since the cured film made of the photosensitive composition of the present invention is particularly superior in pliability, curling does not occur even when used for a thin circuit board. Therefore, the cured film is best suited for use in an FPC board.
    • 本发明的感光性组合物含有含有羧基的氨基甲酸酯(甲基)丙烯酸酯化合物(A)的光固化性成分, 热固性树脂(C); 光聚合引发剂(D); 和热聚合催化剂(E); 上述光固化性成分还含有除了(A)成分以外的(B)具有烯键式不饱和基团的化合物和具有羧基的环氧(甲基)丙烯酸酯化合物(F))中的至少一种。 因此,感光性组合物适合用作印刷电路板用绝缘保护涂膜。 由于由本发明的感光组合物制成的固化膜在柔韧性方面特别优异,所以即使用于薄电路板也不会发生卷曲。 因此,固化膜最适用于FPC基板。