专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08822837B2 Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate 有权
标题翻译：接线板，电子部件嵌入式基板，制造布线板的方法以及电子部件嵌入式基板的制造方法
公开(公告)号：US08822837B2
公开(公告)日：2014-09-02
申请号：US13310959
申请日：2011-12-05
申请人： Hiroyuki Uematsu , Kenichi Kawabata
发明人： Hiroyuki Uematsu , Kenichi Kawabata
IPC分类号： H05K1/16 , H05K3/42 , H05K1/18 , H05K3/00
CPC分类号： H05K1/115 , H01L2224/04105 , H05K1/185 , H05K1/188 , H05K3/0035 , H05K3/0038 , H05K3/427 , H05K2201/0187 , H05K2201/09563 , H05K2203/095 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49165
摘要： A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.
摘要翻译：布线基板或电子部件嵌入基板包括：基板，其具有含有多个填料的树脂; 以及通孔，其电连接到提供给基板的至少一个互连件，其中所述通孔包括混合区域，在所述混合区域中，在相对于所述基板的内径向侧的所述填料之间设置有金属。制造布线板或电子部件嵌入式基板的方法包括制备包括含有多种填料的树脂的基板; 在所述基板中形成通孔形成孔; 在通孔形成孔的至少内壁上进行灰化处理; 并且对通孔形成孔的内壁进行化学镀。

2. 发明授权

US08530752B2 Multilayer circuit board and method for manufacturing the same 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：US08530752B2
公开(公告)日：2013-09-10
申请号：US12632948
申请日：2009-12-08
申请人： Kenichi Kawabata , Takaaki Morita
发明人： Kenichi Kawabata , Takaaki Morita
IPC分类号： H05K1/16
CPC分类号： H05K3/4652 , H01L23/49822 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/2518 , H01L2224/82039 , H01L2224/82047 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H05K1/185 , H05K3/0044 , H05K3/0058 , H05K3/4602 , H05K3/4682 , H05K3/4688 , H05K2201/0358 , H05K2201/09518 , H05K2201/09527 , H05K2201/09563 , H05K2203/0152 , H05K2203/025 , H05K2203/0554 , H05K2203/1105 , H05K2203/1476 , H05K2203/1572 , Y10T29/49128 , Y10T428/24917 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.
摘要翻译：多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，从而能够使整个基板变薄。此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

3. 发明授权

US08204429B2 Image forming apparatus capable of electrostatically attracting sheet effectively 有权
标题翻译：能够有效地静电吸引片材的图像形成装置
公开(公告)号：US08204429B2
公开(公告)日：2012-06-19
申请号：US12324542
申请日：2008-11-26
申请人： Kenichi Kawabata
发明人： Kenichi Kawabata
IPC分类号： G03G15/00 , B65H29/30
CPC分类号： G03G15/234 , G03G2215/00654
摘要： In an image forming apparatus, a recording head discharges liquid droplets onto a sheet conveyed on a conveying belt to form an image on the sheet. A sheet discharge device is provided downstream from the conveying belt in a sheet conveyance direction and is intermittently driven independently of and in synchronization with the conveying belt to convey the sheet in a sheet discharging direction. A voltage application device applies a voltage to a charger. A distance between the charger and a nip portion formed between a pressing member and the conveying belt for duplex printing is set so that a voltage applied by the voltage application device increases a charged potential of the conveying belt in an area electrostatically attracting a trailing end of a predetermined sheet and a leading end of a subsequent sheet.
摘要翻译：在图像形成装置中，记录头将液滴排放到在传送带上传送的片材上，以在片材上形成图像。片材排出装置在片材输送方向上设置在输送带的下游，并且与输送带独立地且与其同步地间歇地驱动，以将片材沿片材排出方向输送。电压施加装置向充电器施加电压。设置充电器和形成在按压构件和用于双面打印的输送带之间的夹持部之间的距离，使得由施加电压装置施加的电压在静电吸引尾部的区域中增加输送带的带电电位预定片材和后续片材的前端。

4. 发明授权

US08157342B2 Liquid-jet device, image forming apparatus, and method for adjusting landing positions of liquid droplets 有权
标题翻译：液体喷射装置，图像形成装置以及用于调节液滴的着陆位置的方法
公开(公告)号：US08157342B2
公开(公告)日：2012-04-17
申请号：US12047973
申请日：2008-03-13
申请人： Tetsu Morino , Noboru Sawayama , Kenichi Kawabata , Mamoru Yorimoto , Tetsuro Hirota , Takumi Hagiwara , Masatoshi Sakakitani
发明人： Tetsu Morino , Noboru Sawayama , Kenichi Kawabata , Mamoru Yorimoto , Tetsuro Hirota , Takumi Hagiwara , Masatoshi Sakakitani
IPC分类号： B41J29/38
CPC分类号： B41J2/2135 , B41J19/207
摘要： A disclosed liquid-jet device includes a liquid-jet head configured to jet liquid droplets; a pattern formation control unit configured to control the liquid-jet head and thereby to form a test pattern composed of separate liquid droplets on a water-repellent part; a detecting unit including a light-emitting element configured to illuminate the test pattern on the water-repellent part and a light-receiving element configured to receive specularly reflected light from the illuminated test pattern and to output a detection signal proportional to the received specularly reflected light; and a landing position adjusting unit configured to adjust landing positions of the liquid droplets based on the detection signal from the light-receiving element.
摘要翻译：所公开的液体喷射装置包括构造成喷射液滴的液体喷射头; 图案形成控制单元，被配置为控制喷液头，从而在防水部件上形成由分离的液滴组成的测试图案; 检测单元，其包括被配置为照亮所述防水部件上的测试图案的发光元件和被配置为从所述被照亮测试图案接收镜面反射光并且输出与所接收的镜面反射的成比例的检测信号的光接收元件光; 以及着陆位置调整单元，其被配置为基于来自所述光接收元件的检测信号来调节所述液滴的着陆位置。

5. 发明授权

US08052276B2 Image forming apparatus and belt conveying device 有权
标题翻译：成像设备和皮带输送装置
公开(公告)号：US08052276B2
公开(公告)日：2011-11-08
申请号：US11820584
申请日：2007-06-19
申请人： Kenichi Kawabata
发明人： Kenichi Kawabata
IPC分类号： B41J2/01 , B65H5/22 , B65H43/04
CPC分类号： G03G15/0131 , B41J11/007 , B65H5/004 , B65H5/224 , B65H2402/10 , B65H2404/255 , B65H2404/2693 , G03G21/1695 , G03G2221/1642
摘要： An image forming apparatus includes an image forming member and a belt conveying device. The image forming member is configured to form an image on a sheet. The belt conveying device is configured to convey the sheet. The belt conveying device includes first and second rollers, a conveying belt, a platen guide, a support, and an adjuster. The conveying belt has an endless belt-like shape and is looped over at least the first and second rollers. The platen guide is provided between the first and second rollers in a sheet conveyance direction and is configured to guide the conveying belt in a manner that the conveying belt forms a flat plane surface. The support is configured to support at least one end of the second roller in an axial direction of the second roller. The adjuster is configured to adjust a position of the support.
摘要翻译：图像形成装置包括图像形成部件和带传送装置。图像形成构件被配置为在片材上形成图像。皮带输送装置构造成输送片材。带式输送装置包括第一和第二辊，输送带，压板引导件，支撑件和调节器。传送带具有环形带状形状，并且至少环绕第一和第二辊。压板引导件在纸张输送方向上设置在第一辊和第二辊之间，并且构造成以使得输送带形成平坦表面的方式引导输送带。支撑构造成在第二辊的轴向方向上支撑第二辊的至少一端。调节器被配置为调节支撑件的位置。

6. 发明申请

US20110198115A1 ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子元件内置模块及其制造方法
公开(公告)号：US20110198115A1
公开(公告)日：2011-08-18
申请号：US13025658
申请日：2011-02-11
申请人： Yukihiro AZUMA , Seiichi TAJIMA , Shigeru ASAMI , Hiroki HARA , Shuichi TAKIZAWA , Kenichi KAWABATA
发明人： Yukihiro AZUMA , Seiichi TAJIMA , Shigeru ASAMI , Hiroki HARA , Shuichi TAKIZAWA , Kenichi KAWABATA
IPC分类号： H05K1/16 , H05K3/34
CPC分类号： H05K3/284 , H01L23/3135 , H01L23/552 , H01L2224/16225 , H01L2924/19105 , H01L2924/3025 , H05K1/0209 , H05K3/3431 , H05K2201/0116 , H05K2201/0715 , H05K2201/09872 , Y10T29/49144
摘要： An electronic component built-in module includes an electronic component, a substrate on which the electronic component is mounted, a first resin covering the electronic component and the substrate, and a second resin covering the surface of the first resin. The first resin is formed of a resin including pores. The first resin is formed so that the thickness of the first resin on an area where the electronic component is not mounted is larger than that on an area where the electronic component is mounted on the surface of the substrate. A porosity of the second resin is smaller than that of the first resin.
摘要翻译：电子部件内置模块包括电子部件，安装有电子部件的基板，覆盖电子部件和基板的第一树脂和覆盖第一树脂的表面的第二树脂。第一树脂由包括孔的树脂形成。第一树脂形成为使得未安装电子部件的区域上的第一树脂的厚度大于在电子部件安装在基板的表面上的区域的厚度。第二树脂的孔隙率小于第一树脂的孔隙率。

7. 发明授权

US07841682B2 Image forming apparatus and landing position error correction method 有权
标题翻译：图像形成装置和着陆位置误差校正方法
公开(公告)号：US07841682B2
公开(公告)日：2010-11-30
申请号：US12354278
申请日：2009-01-15
申请人： Mamoru Yorimoto , Kenichi Kawabata , Takayuki Niihara , Shinichiro Naruse , Tetsu Morino , Takumi Hagiwara
发明人： Mamoru Yorimoto , Kenichi Kawabata , Takayuki Niihara , Shinichiro Naruse , Tetsu Morino , Takumi Hagiwara
IPC分类号： B41J2/01
CPC分类号： B41J2/2142 , B41J29/38 , B41J29/393
摘要： An image forming apparatus includes a carriage carrying a recording head configured to discharge a droplet. A landing position error detecting pattern is formed on a pattern forming member. Based on a result of reading the landing position error detecting pattern, a landing position error of the droplet discharged by the recording head is corrected. Either a first pattern or a second pattern is selected as the landing position error detecting pattern, depending on a surface condition of the pattern forming member. The first pattern produces a relatively small amount of specular reflection compared with diffused reflection, while the second pattern produces a relatively large amount of specular reflection compared with diffused reflection, upon irradiation with light.
摘要翻译：图像形成装置包括承载配置为排出液滴的记录头的托架。着陆位置误差检测图案形成在图案形成部件上。基于读取着陆位置误差检测图案的结果，校正由记录头排出的液滴的着陆位置误差。根据图案形成构件的表面状况，选择第一图案或第二图案作为着陆位置误差检测图案。与扩散反射相比，第一图案产生相对较少量的镜面反射，而与光扩散相比，第二图案与漫反射相比产生相对大量的镜面反射。

8. 发明授权

US07761982B2 Method for manufacturing IC-embedded substrate 有权
标题翻译： IC嵌入式基板的制造方法
公开(公告)号：US07761982B2
公开(公告)日：2010-07-27
申请号：US11612419
申请日：2006-12-18
申请人： Kenji Nagase , Kenichi Kawabata
发明人： Kenji Nagase , Kenichi Kawabata
IPC分类号： H05K3/30 , H01L23/48
CPC分类号： H01L25/16 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01078 , H01L2924/14 , H01L2924/30107 , H05K1/185 , H05K3/0044 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09518 , H05K2201/10674 , H05K2203/025 , H05K2203/0554 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/49151 , Y10T29/49155
摘要： A method for manufacturing an IC-embedded substrate comprises a first step for encapsulating at least an IC chip having a pad electrode in an insulating layer, a second step for forming a metal layer having at least a first aperture in a location directly above the pad electrode of the IC chip and a second aperture in a location above an area other than the area in which the IC chip is mounted, and a third step for selectively removing the insulating layer by a blasting treatment in which the metal layer is used as a mask, whereby forming a first via hole that corresponds to the first aperture and a second via hole that corresponds to the second aperture.
摘要翻译：一种用于制造嵌入IC的衬底的方法包括：第一步骤，用于将至少具有焊盘电极的IC芯片封装在绝缘层中;第二步骤，用于形成金属层，所述金属层至少具有位于衬垫上方的位置的第一孔 IC芯片的电极和除了安装IC芯片的区域之外的区域上方的位置的第二孔，以及第三步骤，通过其中使用金属层的喷砂处理来选择性地去除绝缘层，从而形成对应于第一孔的第一通孔和对应于第二孔的第二通孔。

9. 发明申请

US20090218678A1 SEMICONDUCTOR IC-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体IC嵌入式基板及其制造方法
公开(公告)号：US20090218678A1
公开(公告)日：2009-09-03
申请号：US12435385
申请日：2009-05-04
申请人： Kenichi Kawabata , Takaaki Morita
发明人： Kenichi Kawabata , Takaaki Morita
IPC分类号： H01L23/48
CPC分类号： H01L23/5389 , H01L21/568 , H01L21/6835 , H01L23/5383 , H01L23/5384 , H01L23/544 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2221/68368 , H01L2223/54473 , H01L2224/0401 , H01L2224/04105 , H01L2224/1134 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13171 , H01L2224/24225 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2224/83132 , H01L2224/83136 , H01L2224/92244 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H05K1/185 , H05K3/4652 , H05K2201/09518 , H05K2201/09563 , H05K2201/096 , H05K2201/09781 , H05K2201/09918 , H05K2201/10674 , H05K2203/016 , H05K2203/1469 , H05K2203/166 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor IC-embedded substrate suitable for embedding a semiconductor IC in which the electrode pitch is extremely narrow. The substrate comprises a semiconductor IC 120 in which stud bumps 121 are provided to the principal surface 120a, a first resin layer 111 for covering the principal surface 120a of the semiconductor IC 120, and a second resin layer 112 for covering the back surface 120b of the semiconductor IC 120. The stud bumps 121 of the semiconductor IC 120 protrude from the surface of the first resin layer 111. The method for causing the stud bumps 121 to protrude from the surface of the first resin layer 111 may involve using a wet blasting method to cause an overall reduction of the thickness of the first resin layer 111. The stud bumps 121 can thereby be properly uncovered even when the electrode pitch of the semiconductor IC 120 is narrow.
摘要翻译：适用于嵌入电极间距极窄的半导体IC的半导体IC嵌入式基板。基板包括半导体IC 120，其中将柱状凸块121设置在主表面120a上，第一树脂层111用于覆盖半导体IC 120的主表面120a，第二树脂层112用于覆盖半导体IC 120的背面120b 半导体IC 120的柱状突起121从第一树脂层111的表面突出。使柱状突起121从第一树脂层111的表面突出的方法可以涉及使用湿式喷砂导致第一树脂层111的厚度的总体减小的方法。即使当半导体IC 120的电极间距窄时，也可以适当地覆盖柱形突起121。

10. 发明申请

US20090185813A1 IMAGE FORMING APPARATUS 有权
标题翻译：图像形成装置
公开(公告)号：US20090185813A1
公开(公告)日：2009-07-23
申请号：US12355176
申请日：2009-01-16
申请人： TAKUMI HAGIWARA , KENICHI KAWABATA , MAMORU YORIMOTO , TAKAYUKI NIIHARA , SHINICHIRO NARUSE , TETSU MORINO
发明人： TAKUMI HAGIWARA , KENICHI KAWABATA , MAMORU YORIMOTO , TAKAYUKI NIIHARA , SHINICHIRO NARUSE , TETSU MORINO
IPC分类号： G03G15/00
CPC分类号： B41J29/393
摘要： A disclosed image forming apparatus includes a carriage having a head for jetting droplets; a pattern forming unit configured to form, on a belt, a pattern used for detecting displacement of landing positions of the droplets; a reading unit configured to scan the belt before the pattern formation to output a first result, and scan the pattern to output a second result; a correcting unit configured to correct the displacement based on the second result; a frequency analyzing unit configured to calculate frequencies of the belt and amplitudes of respective frequency components based on the first result; and a peak frequency calculating unit configured to calculate peak frequencies of the belt based on the frequencies of the belt and the amplitudes of the frequency components, the peak frequencies being frequency components whose amplitude exceeds a predetermined level. The pattern is formed at a frequency different from the peak frequencies.
摘要翻译：公开的图像形成装置包括具有用于喷射液滴的头部的滑架; 图案形成单元，其构造成在带上形成用于检测液滴的着陆位置的位移的图案; 读取单元，被配置为在图案形成之前扫描所述带以输出第一结果，并且扫描所述图案以输出第二结果; 校正单元，被配置为基于所述第二结果校正所述位移; 频率分析单元，被配置为基于所述第一结果计算所述带的频率和各个频率分量的振幅; 以及峰值频率计算单元，被配置为基于所述带的频率和频率分量的振幅计算所述带的峰值频率，所述峰值频率是振幅超过预定水平的频率分量。该图案以与峰值频率不同的频率形成。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式