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1. 发明申请

US20090025961A1 Electronic component-embedded board and method of manufacturing the same 审中-公开
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US20090025961A1
公开(公告)日：2009-01-29
申请号：US12219354
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Hiroshige Ohkawa , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Hiroshige Ohkawa , Kenichi Kawabata
IPC分类号： H05K1/00 , H05K3/10
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K3/0052 , H05K3/4644 , H05K2201/10204 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , Y10T29/49155 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and electronic components 41 and chip-like dummy parts 51 primarily made from the same material as the primary material of the electronic component 41 are embedded into the insulating layer 21. Chip-like dummy parts 51 are disposed in an unmounted portion of the electronic components 41 in, for example, a frame-like arrangement so as to surround the plurality of electronic components (groups) 41.
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作片100在大致矩形的基板11的一个表面上包括绝缘层21和31，并且主要由与电子部件41的主要材料相同的材料制成的电子部件41和芯片状的虚拟部分51嵌入绝缘层芯片状虚拟部件51以例如框状的方式设置在电子部件41的未安装部分中，以围绕多个电子部件（组）41。

2. 发明申请

US20120285013A1 Electronic Component-Embedded Board and Method of Manufacturing the Same 审中-公开
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US20120285013A1
公开(公告)日：2012-11-15
申请号：US13533176
申请日：2012-06-26
申请人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
IPC分类号： H05K3/30
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/16227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/0271 , H05K3/0052 , H05K3/0097 , H05K3/4602 , H05K2201/068 , H05K2201/2009 , H05K2203/0169 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet includes insulating layers on one surface of an approximately rectangular substrate, and an electronic component and a plate-like frame member (member) embedded inside the insulating layer, wherein the plate-like frame member satisfying the relationship represented by the following formula (1): α1
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作表包括在近似矩形基板的一个表面上的绝缘层，以及嵌入在绝缘层内部的电子部件和板状框架部件（部件），其中满足由下列公式表示的关系的板状框架部件 1）：将α1<α3和α2<α3（1）安装在基板上的电子部件的未安装部分上。在该式中，α1，α2和α3分别表示电子部件，板状框架部件和基板，各个布线层或各绝缘层的线性热膨胀系数（ppm / K）。

3. 发明申请

US20090025971A1 Electronic component-embedded board and method of manufacturing the same 有权
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US20090025971A1
公开(公告)日：2009-01-29
申请号：US12219355
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
IPC分类号： H05K3/30 , H05K1/16
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/16227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/0271 , H05K3/0052 , H05K3/0097 , H05K3/4602 , H05K2201/068 , H05K2201/2009 , H05K2203/0169 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1): α1
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作片100包括在近似矩形基板11的一个表面上的绝缘层21和31，以及嵌入在绝缘层21内的电子部件41和板状框架部件（部件）51，其中板状框架部件51 满足由下式（1）表示的关系：α1α3和α2α3。。。（1）安装在基板11上的电子部件41的未安装部分上。在该公式中，α1，α2和α3分别表示电子部件41的线性热膨胀系数（ppm / K），板类框架构件51和基板11，各个布线层或各绝缘层。

4. 发明授权

US08502081B2 Assembly substrate and method of manufacturing the same 有权
公开(公告)号：US08502081B2
公开(公告)日：2013-08-06
申请号：US12219372
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Kenichi Kawabata
IPC分类号： H05K1/03 , H05K7/02 , H05K7/04
CPC分类号： H05K3/0052 , H01L23/49838 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H05K1/0271 , H05K1/112 , H05K1/185 , H05K3/0097 , H05K3/4602 , H05K2201/09136 , H05K2201/10636 , H05K2201/10674 , H05K2201/2009 , H05K2203/0169 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , H01L2224/82 , H01L2924/00
摘要： The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).

5. 发明授权

US08237059B2 Electronic component-embedded board and method of manufacturing the same 有权
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US08237059B2
公开(公告)日：2012-08-07
申请号：US12219355
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
IPC分类号： H05K1/16 , H05K1/18
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/16227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/0271 , H05K3/0052 , H05K3/0097 , H05K3/4602 , H05K2201/068 , H05K2201/2009 , H05K2203/0169 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1): α1
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作片100包括在近似矩形基板11的一个表面上的绝缘层21和31，以及嵌入在绝缘层21内的电子部件41和板状框架部件（部件）51，其中板状框架部件51 满足由下式（1）表示的关系：α1<α3和α2<α3。。。（1）安装在基板11上的电子部件41的未安装部分上。在该公式中，α1，α2和α3分别表示电子部件41的线性热膨胀系数（ppm / K），板类框架构件51和基板11，各个布线层或各绝缘层。

6. 发明申请

US20090025965A1 Assembly substrate and method of manufacturing the same 有权
标题翻译：装配基板及其制造方法
公开(公告)号：US20090025965A1
公开(公告)日：2009-01-29
申请号：US12219372
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Kenichi Kawabata
IPC分类号： H05K1/02 , H05K3/00
CPC分类号： H05K3/0052 , H01L23/49838 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H05K1/0271 , H05K1/112 , H05K1/185 , H05K3/0097 , H05K3/4602 , H05K2201/09136 , H05K2201/10636 , H05K2201/10674 , H05K2201/2009 , H05K2203/0169 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , H01L2224/82 , H01L2924/00
摘要： The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).
摘要翻译：本发明的目的是提供一种易于处理并能够抑制翘曲发生并且提供高生产率和经济效率的组装基板及其制造方法。工作板100在大致矩形的基板11的一个表面上包括绝缘层21，并且电子部件41和板状集成框架51嵌入在绝缘层21的内部。板状集成框架51具有多个凹部53在其内周壁52a处平行布置，并且布置在电子部件41的非放置区域上以围绕多个电子部件41（组）。

7. 发明授权

US08822837B2 Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate 有权
标题翻译：接线板，电子部件嵌入式基板，制造布线板的方法以及电子部件嵌入式基板的制造方法
公开(公告)号：US08822837B2
公开(公告)日：2014-09-02
申请号：US13310959
申请日：2011-12-05
申请人： Hiroyuki Uematsu , Kenichi Kawabata
发明人： Hiroyuki Uematsu , Kenichi Kawabata
IPC分类号： H05K1/16 , H05K3/42 , H05K1/18 , H05K3/00
CPC分类号： H05K1/115 , H01L2224/04105 , H05K1/185 , H05K1/188 , H05K3/0035 , H05K3/0038 , H05K3/427 , H05K2201/0187 , H05K2201/09563 , H05K2203/095 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49165
摘要： A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.
摘要翻译：布线基板或电子部件嵌入基板包括：基板，其具有含有多个填料的树脂; 以及通孔，其电连接到提供给基板的至少一个互连件，其中所述通孔包括混合区域，在所述混合区域中，在相对于所述基板的内径向侧的所述填料之间设置有金属。制造布线板或电子部件嵌入式基板的方法包括制备包括含有多种填料的树脂的基板; 在所述基板中形成通孔形成孔; 在通孔形成孔的至少内壁上进行灰化处理; 并且对通孔形成孔的内壁进行化学镀。

8. 发明授权

US08530752B2 Multilayer circuit board and method for manufacturing the same 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：US08530752B2
公开(公告)日：2013-09-10
申请号：US12632948
申请日：2009-12-08
申请人： Kenichi Kawabata , Takaaki Morita
发明人： Kenichi Kawabata , Takaaki Morita
IPC分类号： H05K1/16
CPC分类号： H05K3/4652 , H01L23/49822 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/2518 , H01L2224/82039 , H01L2224/82047 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H05K1/185 , H05K3/0044 , H05K3/0058 , H05K3/4602 , H05K3/4682 , H05K3/4688 , H05K2201/0358 , H05K2201/09518 , H05K2201/09527 , H05K2201/09563 , H05K2203/0152 , H05K2203/025 , H05K2203/0554 , H05K2203/1105 , H05K2203/1476 , H05K2203/1572 , Y10T29/49128 , Y10T428/24917 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.
摘要翻译：多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，从而能够使整个基板变薄。此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

9. 发明授权

US08204429B2 Image forming apparatus capable of electrostatically attracting sheet effectively 有权
标题翻译：能够有效地静电吸引片材的图像形成装置
公开(公告)号：US08204429B2
公开(公告)日：2012-06-19
申请号：US12324542
申请日：2008-11-26
申请人： Kenichi Kawabata
发明人： Kenichi Kawabata
IPC分类号： G03G15/00 , B65H29/30
CPC分类号： G03G15/234 , G03G2215/00654
摘要： In an image forming apparatus, a recording head discharges liquid droplets onto a sheet conveyed on a conveying belt to form an image on the sheet. A sheet discharge device is provided downstream from the conveying belt in a sheet conveyance direction and is intermittently driven independently of and in synchronization with the conveying belt to convey the sheet in a sheet discharging direction. A voltage application device applies a voltage to a charger. A distance between the charger and a nip portion formed between a pressing member and the conveying belt for duplex printing is set so that a voltage applied by the voltage application device increases a charged potential of the conveying belt in an area electrostatically attracting a trailing end of a predetermined sheet and a leading end of a subsequent sheet.
摘要翻译：在图像形成装置中，记录头将液滴排放到在传送带上传送的片材上，以在片材上形成图像。片材排出装置在片材输送方向上设置在输送带的下游，并且与输送带独立地且与其同步地间歇地驱动，以将片材沿片材排出方向输送。电压施加装置向充电器施加电压。设置充电器和形成在按压构件和用于双面打印的输送带之间的夹持部之间的距离，使得由施加电压装置施加的电压在静电吸引尾部的区域中增加输送带的带电电位预定片材和后续片材的前端。

10. 发明授权

US08157342B2 Liquid-jet device, image forming apparatus, and method for adjusting landing positions of liquid droplets 有权
标题翻译：液体喷射装置，图像形成装置以及用于调节液滴的着陆位置的方法
公开(公告)号：US08157342B2
公开(公告)日：2012-04-17
申请号：US12047973
申请日：2008-03-13
申请人： Tetsu Morino , Noboru Sawayama , Kenichi Kawabata , Mamoru Yorimoto , Tetsuro Hirota , Takumi Hagiwara , Masatoshi Sakakitani
发明人： Tetsu Morino , Noboru Sawayama , Kenichi Kawabata , Mamoru Yorimoto , Tetsuro Hirota , Takumi Hagiwara , Masatoshi Sakakitani
IPC分类号： B41J29/38
CPC分类号： B41J2/2135 , B41J19/207
摘要： A disclosed liquid-jet device includes a liquid-jet head configured to jet liquid droplets; a pattern formation control unit configured to control the liquid-jet head and thereby to form a test pattern composed of separate liquid droplets on a water-repellent part; a detecting unit including a light-emitting element configured to illuminate the test pattern on the water-repellent part and a light-receiving element configured to receive specularly reflected light from the illuminated test pattern and to output a detection signal proportional to the received specularly reflected light; and a landing position adjusting unit configured to adjust landing positions of the liquid droplets based on the detection signal from the light-receiving element.
摘要翻译：所公开的液体喷射装置包括构造成喷射液滴的液体喷射头; 图案形成控制单元，被配置为控制喷液头，从而在防水部件上形成由分离的液滴组成的测试图案; 检测单元，其包括被配置为照亮所述防水部件上的测试图案的发光元件和被配置为从所述被照亮测试图案接收镜面反射光并且输出与所接收的镜面反射的成比例的检测信号的光接收元件光; 以及着陆位置调整单元，其被配置为基于来自所述光接收元件的检测信号来调节所述液滴的着陆位置。

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