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1. 发明授权

US06791178B2 Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices 失效
标题翻译：包括半导体器件的多芯片模块和用于安装半导体器件的布线基板
公开(公告)号：US06791178B2
公开(公告)日：2004-09-14
申请号：US09997175
申请日：2001-11-30
申请人： Yoshihide Yamaguchi , Takao Terabayashi , Hiroyuki Tenmei , Hiroshi Hozoji , Naoya Kanda
发明人： Yoshihide Yamaguchi , Takao Terabayashi , Hiroyuki Tenmei , Hiroshi Hozoji , Naoya Kanda
IPC分类号： H01L2304
CPC分类号： H05K3/0044 , H01L21/486 , H01L23/147 , H01L23/15 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L24/48 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/16225 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1433 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H05K1/0271 , H05K1/0306 , H05K1/115 , H05K3/4605 , H05K3/4688 , H05K2201/0154 , H05K2201/068 , H05K2201/0949 , H05K2201/09518 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2203/025 , H05K2203/1581 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module has semiconductor devices and a wiring substrate for mounting the semiconductor devices, in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.
摘要翻译：多芯片模块具有半导体器件和用于安装半导体器件的布线基板，其中布线基板包括具有通过喷砂形成的孔的玻璃基板和形成在玻璃基板的表面上的布线层并具有布线和绝缘层。

2. 发明授权

US06610934B2 Semiconductor module and method of making the device 失效
公开(公告)号：US06610934B2
公开(公告)日：2003-08-26
申请号：US09995772
申请日：2001-11-29
申请人： Yoshihide Yamaguchi , Takao Terabayashi , Hiroyuki Tenmei , Hiroshi Hozoji , Naoya Kanda
发明人： Yoshihide Yamaguchi , Takao Terabayashi , Hiroyuki Tenmei , Hiroshi Hozoji , Naoya Kanda
IPC分类号： H01R1204
CPC分类号： H05K3/0044 , H01L21/486 , H01L23/147 , H01L23/15 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L24/48 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/16225 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1433 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H05K1/0271 , H05K1/0306 , H05K1/115 , H05K3/4605 , H05K3/4688 , H05K2201/0154 , H05K2201/068 , H05K2201/0949 , H05K2201/09518 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2203/025 , H05K2203/1581 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.

3. 发明授权

US4467170A Electron beam drilling apparatus 失效
标题翻译：电子束钻机
公开(公告)号：US4467170A
公开(公告)日：1984-08-21
申请号：US387666
申请日：1982-06-11
申请人： Seiji Hata , Takao Terabayashi , Noriyoshi Arakawa , Makoto Watanabe
发明人： Seiji Hata , Takao Terabayashi , Noriyoshi Arakawa , Makoto Watanabe
IPC分类号： B23K15/00 , B23K15/08 , B23K27/00
CPC分类号： B23K15/085
摘要： An electron beam drilling apparatus for drilling a number of holes in a substrate by an electron beam is disclosed. The holes are drilled at a high speed by scanning the electron beam along a direction perpendicular to the direction of movement of the workpiece while the workpiece is moved at a high speed. A drilling position error due to the high speed movement of the workpiece is corrected by controlling an electron beam deflection unit and an electron beam generator.
摘要翻译：公开了一种用于通过电子束在基板中钻出许多孔的电子束钻孔装置。在高速移动工件的同时，沿垂直于工件运动方向的方向扫描电子束，高速钻孔。通过控制电子束偏转单元和电子束发生器来校正由于工件的高速运动引起的钻孔位置误差。

4. 发明授权

US4331280A Method of jointing pipes by friction welding 失效
标题翻译：通过摩擦焊接接管的方法
公开(公告)号：US4331280A
公开(公告)日：1982-05-25
申请号：US221369
申请日：1980-12-30
申请人： Takao Terabayashi , Kenichi Waragai , Atsuya Kamada , Masaru Kobayashi , Izumi Ochiai , Yoiti Wakabayashi
发明人： Takao Terabayashi , Kenichi Waragai , Atsuya Kamada , Masaru Kobayashi , Izumi Ochiai , Yoiti Wakabayashi
IPC分类号： B23K20/12 , B23K20/14
CPC分类号： B23K20/129
摘要： A method for jointing two pipes such as an aluminum pipe and a copper pipe by friction welding. The aluminum pipe is inserted into a bore of a ring made of a heat resistant material, the bore having a straight section and a tapered section continuous from the straight section. The copper pipe has a tapered end peripheral surface. The copper pipe is pressed at its tapered end, in a rotating state, against the end of the aluminum pipe so as to expand the latter. As a result, an ironing is effected on the aluminum pipe by the straight section of the bore of the ring, such that the aluminum pipe overlies the straight section of the copper pipe in close contact with the latter. Consequently, the tapered surface of the copper pipe is friction welded to corresponding portion of the aluminum pipe while the latter is being backed up by the tapered section of the bore of the ring.
摘要翻译：通过摩擦焊接连接铝管和铜管等两个管的方法。铝管被插入到由耐热材料制成的环的孔中，该孔具有直的部分和与直线部分连续的锥形部分。铜管具有锥形端外周面。铜管在其锥形端部以旋转状态压在铝管的端部上，从而使其膨胀。结果，通过环的孔的直线部分在铝管上进行熨烫，使得铝管与铜管的直线部分紧密接触。因此，铜管的锥形表面摩擦焊接到铝管的相应部分，而后者由环的孔的锥形部分支撑。

5. 发明授权

US5414239A Optical apparatus for laser machining 失效
标题翻译：激光加工用光学装置
公开(公告)号：US5414239A
公开(公告)日：1995-05-09
申请号：US24643
申请日：1993-03-01
申请人： Takao Terabayashi , Hidemi Sato , Hideaki Tanaka , Yoshitada Oshida
发明人： Takao Terabayashi , Hidemi Sato , Hideaki Tanaka , Yoshitada Oshida
IPC分类号： B23K26/00 , B23K26/06 , B23K26/38 , G03B27/32 , G03F7/20 , H01S3/00 , H05K3/00
CPC分类号： G03F7/70358 , B23K26/066
摘要： A laser-machining optical apparatus designed to efficiently work an object through a large area thereof by projecting an image of a mask to the object through a laser beam having a small sectional area and a high energy density. The apparatus has a laser head for oscillating laser light for working the specimen, a mask provided in the optical path of the laser light beam between the specimen and the laser head and having a working pattern formed on its surface, an objective provided in the optical path of the laser-light beam between the mask and the specimen, a mechanism on which the mask and the specimen are placed so that an optical imaging relationship is maintained therebetween with the objective interposed therebetween, and a two-dimensional scanning device provided in the optical path of the laser light beam between the laser head and the mask to two-dimensionally scan the surface of the mask with the laser light beam from the laser head.
摘要翻译：一种激光加工光学装置，其被设计为通过将具有小截面积和高能量密度的激光束将掩模的图像投射到物体上，通过其大面积有效地对物体进行加工。该装置具有用于振荡激光的激光头用于加工样品，设置在激光束的光路中的试样和激光头之间并具有在其表面上形成的工作图案的掩模，设置在光学器件中的物镜掩模和试样之间的激光束的路径，其中放置掩模和试样的机构，以便在它们之间保持光学成像关系，并且设置在其中的二维扫描装置在激光头和掩模之间的激光束的光路用激光头的激光二维扫描掩模的表面。

6. 发明授权

US5133403A Cooling arrangement for semiconductor devices and method of making the same 失效
标题翻译：用于半导体器件的冷却装置及其制造方法
公开(公告)号：US5133403A
公开(公告)日：1992-07-28
申请号：US423386
申请日：1989-10-19
申请人： Hitoshi Yokono , Takao Terabayashi , Nobuo Kayaba , Takahiro Daikoku , Shigekazu Kieda , Fumiyuki Kobayashi , Shizuo Zushi
发明人： Hitoshi Yokono , Takao Terabayashi , Nobuo Kayaba , Takahiro Daikoku , Shigekazu Kieda , Fumiyuki Kobayashi , Shizuo Zushi
IPC分类号： H01L23/373 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4338 , H01L23/3733 , F28F2255/18 , H01L2224/16225
摘要： A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.
摘要翻译：一种用于通过从大型电子计算机中的诸如半导体集成芯片的半导体元件产生的热量来冷却半导体元件的冷却装置。该冷却装置由维氏硬度不高于AlN材料的五分之一的复合AlN-BN烧结材料制成，并且二维方向的热导率的各向异性特性比AlN的各向异性高各向同性的导热性。即使复合烧结体的形状和尺寸一致，冷却装置也可以批量生产，同时具有与每个半导体元件产生的热量匹配的高转印性能。复合烧结材料由平均粒径不小于1μm的六方晶BN粉末和平均粒径约2μm的AlN粉末的混合物形成，并加入烧结助剂。混合物进行热压烧结，由此烧结材料在与热压机的轴的轴线平行的方向上的导热性低。

7. 发明授权

US4785675A Method of and device for detecting torque 失效
标题翻译：扭矩检测方法及装置
公开(公告)号：US4785675A
公开(公告)日：1988-11-22
申请号：US40124
申请日：1987-04-20
申请人： Shuuhei Takasu , Takao Terabayashi , Isao Takahashi , Yoichi Daiko
发明人： Shuuhei Takasu , Takao Terabayashi , Isao Takahashi , Yoichi Daiko
IPC分类号： G01L3/10 , G01L3/14
CPC分类号： G01L3/10 , G01L3/1428
摘要： The present invention relates to a method of and a device for detecting torque, and more particularly to a method of and a device for detecting torque which are suitable for use at the time of a high-velocity rotation or for detecting a very small torque. An annular or ring-like elastic member is interposed between, for instance, a drive shaft and a load shaft constituting a torque-transmitting shaft system, and is formed with slits with parts of an outer periphery thereof left unslitted to be divided in the axial direction so that the member is of a configuration easily deformable in the radial direction thereof by means of torque. A non-contact type displacement sensor is provided for measuring the deformation of the elastic member, and a marker is attached on the drive shaft to provide a positional signal for use as a sampling signal. The signal of the displacement sensor is extracted on the basis of the sampling signal to be stored and held. At the time when that value of that deformation signal has exceeded a threshold, an overload signal is output, and further the torque load is released responsively to that output signal.
摘要翻译：本发明涉及一种用于检测转矩的方法和装置，更具体地涉及一种适用于高速旋转时使用或用于检测非常小的转矩的用于检测转矩的方法和装置。环形或环状的弹性构件介于例如驱动轴和构成扭矩传递轴系的负载轴之间，并且形成有狭缝，其外周的一部分未被解嵌以轴向分开方向使得构件具有通过扭矩在其径向方向上容易变形的构造。提供用于测量弹性构件的变形的非接触型位移传感器，并且在驱动轴上安装标记以提供用作采样信号的位置信号。基于要存储和保持的采样信号提取位移传感器的信号。当该变形信号的值超过阈值时，输出过载信号，并且响应于该输出信号进一步释放转矩负载。

8. 发明授权

US06199404B1 Manufacturing method for gas discharge type display panel 失效
标题翻译：排气式显示面板的制造方法
公开(公告)号：US06199404B1
公开(公告)日：2001-03-13
申请号：US08955092
申请日：1997-10-21
申请人： Michifumi Kawai , Ryohei Satoh , Masahito Ijuin , Tomohiko Murase , Takao Terabayashi , Nobuyuki Ushifusa , Yoshihiro Kato , Shigeaki Suzuki , Seiichi Tsuchida , Yutaka Naito , Seiichi Yasumoto , Osami Kaneto
发明人： Michifumi Kawai , Ryohei Satoh , Masahito Ijuin , Tomohiko Murase , Takao Terabayashi , Nobuyuki Ushifusa , Yoshihiro Kato , Shigeaki Suzuki , Seiichi Tsuchida , Yutaka Naito , Seiichi Yasumoto , Osami Kaneto
IPC分类号： C03B1301
CPC分类号： H01J9/242 , C03C17/002 , C03C17/02 , H01J2211/36
摘要： A manufacturing method for a gas discharge type display panel makes it possible to manufacture an environmentally friendly substrate with high accuracy and yet at low cost. According to the manufacturing methods electrodes are formed on a back substrate by photolithography or printing, then a glass paste is printed to a height of approximately 10 &mgr;m-500 &mgr;m by printing. A barrier rib blanks are produced by rolling under pressure the glass paste by using a roller provided with grooves. The roller is heated in advance. The barrier rib blanks are sintered into the barrier ribs.
摘要翻译：气体放电型显示面板的制造方法使得可以以高精度且低成本地制造环境友好的基板。根据制造方法，通过光刻或印刷在背面基板上形成电极，然后通过印刷将玻璃浆料印刷到约10μm〜500μm的高度。通过使用设置有凹槽的辊在压力下轧制玻璃浆料来制造隔壁坯料。滚筒预先加热。隔壁坯料被烧结成隔壁。

9. 发明授权

US5150274A Multi-chip-module 失效
标题翻译：多芯片模块
公开(公告)号：US5150274A
公开(公告)日：1992-09-22
申请号：US727042
申请日：1991-07-09
申请人： Kenichi Okada , Kyoko Amemiya , Takao Terabayashi , Hideaki Sasaki , Kuninori Imai , Shinichi Kazui
发明人： Kenichi Okada , Kyoko Amemiya , Takao Terabayashi , Hideaki Sasaki , Kuninori Imai , Shinichi Kazui
IPC分类号： H01L23/373 , H01L23/433 , H01L23/473
CPC分类号： H01L23/3733 , H01L23/4338 , H01L23/473 , H01L2224/16 , H01L2224/73253
摘要： A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling system uses in the horizontal direction a coolant supply pipe having straight tube sections and flexible bellows sections alternately disposed in the axial direction of the pipe. The straight tube sections of the aforesaid coolant supply pipe are brought into contact with the upper faces of the chips by a spring force so as to cool continuously the plurality of chips with the coolant flowing in one coolant supply pipe thereby providing a simply structured cooling system for chips. Such a structured cooling system enables the collective assembly of cooling parts for a plurality of chips with only a small number of parts and produces highly reliable effects thereby being able to implement the miniaturization of a main frame computer.
摘要翻译：具有多个芯片的多通道模块安装在多层电路板上，并且具有简单且高度可靠的结构冷却系统，用于冷却由消耗大量电力的芯片产生的热量。冷却系统在水平方向上使用具有直管段的冷却剂供应管和沿管的轴向交替设置的柔性波纹管部。上述冷却剂供给管的直管段通过弹簧力与芯片的上表面接触，以便冷却剂在一个冷却剂供应管中流动而连续地冷却多个芯片，从而提供简单的结构化冷却系统用于芯片这种结构化的冷却系统使得能够将多个芯片的冷却部件集中组装，仅具有少量的部件，并且产生高度可靠的效果，从而能够实现主机计算机的小型化。

10. 发明授权

US4697964A Boring machine 失效
标题翻译：镗机
公开(公告)号：US4697964A
公开(公告)日：1987-10-06
申请号：US758033
申请日：1985-07-23
申请人： Yoichi Daiko , Masami Masuda , Takao Terabayashi
发明人： Yoichi Daiko , Masami Masuda , Takao Terabayashi
IPC分类号： B23Q15/013 , B23B47/18 , B23Q15/12 , H05K3/00 , B23B39/00
CPC分类号： B23Q15/12 , H05K3/0044 , Y10S408/704 , Y10T408/14 , Y10T408/172
摘要： This invention is directed to a boring machine provided with a spindle supported rotatably in a spindle housing, a driving means for rotating the spindle, and a spindle feed mechanism supporting the spindle housing so that the spindle housing can be moved up and down. This boring machine includes a means for detecting the level of axial displacement of the spindle in boring motion with the detecting means not contacting the spindle, and a comparator for comparing the level of the actual axial displacement of the spindle or the thrust force applied thereto and corresponding to this displacement with a predetermined threshold level of axial displacement or a threshold level of thrust force. The spindle feed mechanism is controlled in response to the output from the comparator.
摘要翻译：本发明涉及一种具有可旋转地支撑在主轴壳体中的主轴的钻孔机，用于旋转主轴的驱动装置以及支撑主轴壳体的主轴进给机构，使得主轴壳体能够上下移动。该钻孔机包括用于检测主轴在镗孔运动中的轴向位移水平的装置，其中检测装置不接触主轴;以及比较器，用于比较主轴的实际轴向位移或施加到其上的推力的水平，对应于具有预定阈值水平的轴向位移或推力的阈值水平的该位移。主轴进给机构根据比较器的输出进行控制。

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