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1. 发明授权

US07166152B2 Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method 有权
标题翻译：用于提供化学镀的催化剂的预处理溶液，使用该溶液的预处理方法以及使用该方法生产的无电镀膜和/或电镀对象
公开(公告)号：US07166152B2
公开(公告)日：2007-01-23
申请号：US10636447
申请日：2003-08-07
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Kim Dong Hyun , Shingo Kitamura , Seiichiro Nakao , Hidenori Tsuji , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Kim Dong Hyun , Shingo Kitamura , Seiichiro Nakao , Hidenori Tsuji , Hidemi Nawafune
IPC分类号： C23C18/28
CPC分类号： C23C18/28
摘要： A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.
摘要翻译：提供了一种用于提供无电镀的催化剂的预处理溶液和使用该溶液的预处理方法。所述预处理溶液包含至少含有以下成分（I），（II）和（III）作为必要成分的银胶体溶液：（I）银胶体粒子，（II）一种或多种离子，选自具有可以将银离子还原成溶液中的金属银的金属和在银离子还原时被氧化的离子的金属，和（III）一种或多种选自羟基羧酸根离子，缩合磷酸根离子和胺羧酸根离子，银胶体粒子（I）由金属（II）的离子产生，具有可以将银离子还原成金属银的电位。当通过使用预处理溶液预处理要镀覆的物体时，实现无电镀的有效催化剂。

2. 发明授权

US07056448B2 Method for forming circuit pattern 有权
标题翻译：电路图案形成方法
公开(公告)号：US07056448B2
公开(公告)日：2006-06-06
申请号：US10441588
申请日：2003-05-20
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
IPC分类号： C23F1/00
CPC分类号： C23C18/161 , C23C18/1651 , C23C18/30 , H05K3/181 , Y10T29/49121 , Y10T29/49156
摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.
摘要翻译：形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。电路图案可以形成在印刷线路板上。

3. 发明申请

US20050258134A1 Method for forming circuit pattern 有权
标题翻译：电路图案形成方法
公开(公告)号：US20050258134A1
公开(公告)日：2005-11-24
申请号：US10441588
申请日：2003-05-20
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
IPC分类号： C23C18/28 , B05D3/10 , B05D5/12 , C23C18/16 , C23C18/30 , C23C18/38 , H01B13/00 , H05K3/06 , H05K3/18 , H05K3/46
CPC分类号： C23C18/161 , C23C18/1651 , C23C18/30 , H05K3/181 , Y10T29/49121 , Y10T29/49156
摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.
摘要翻译：形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。电路图案可以形成在印刷线路板上。

4. 发明授权

US06183545B2 Aqueous solutions for obtaining metals by reductive deposition 有权
标题翻译：用于通过还原沉积获得金属的水溶液
公开(公告)号：US06183545B2
公开(公告)日：2001-02-06
申请号：US09340894
申请日：1999-06-28
申请人： Yoshiaki Okuhama , Takao Takeuchi , Masakazu Yoshimoto , Shigeru Takatani , Emiko Tanaka , Masayuki Nishino , Yuji Kato , Yasuhito Kohashi , Kyoko Kuba , Tetsuya Kondo , Keiji Shiomi , Keigo Obata , Mitsuo Komatsu , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Takao Takeuchi , Masakazu Yoshimoto , Shigeru Takatani , Emiko Tanaka , Masayuki Nishino , Yuji Kato , Yasuhito Kohashi , Kyoko Kuba , Tetsuya Kondo , Keiji Shiomi , Keigo Obata , Mitsuo Komatsu , Hidemi Nawafune
IPC分类号： C23C1831
CPC分类号： C25D3/02 , C22B3/0051 , C22B11/046 , C23C18/42 , Y02P10/214 , Y02P10/234
摘要： An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.
摘要翻译：一种用于金属还原沉积的水溶液，除了水以外还包含（A）通式（1）的膦，其中R 1，R 2和R 3表示低级烷基，其中至少一个是羟基或氨基 - 取代的低级烷基，和（B）通过所述膦形成可溶性络合物而溶解的金属或金属化合物的可溶性化合物。

5. 发明授权

US06235093B1 Aqueous solutions for obtaining noble metals by chemical reductive deposition 有权
标题翻译：通过化学还原沉积获得贵金属的水溶液
公开(公告)号：US06235093B1
公开(公告)日：2001-05-22
申请号：US09340892
申请日：1999-06-28
申请人： Yoshiaki Okuhama , Takao Takeuchi , Keigo Obata , Yasuhito Kohashi , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Takao Takeuchi , Keigo Obata , Yasuhito Kohashi , Hidemi Nawafune
IPC分类号： C23C1831
CPC分类号： C23C18/44
摘要： An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited, and at least one mercapto compound or sulfide compound or a salt thereof as a reducing agent. The reducing agent is typically mercaptoacetic acid, 2-mercaptopropionic acid, 2-aminoethanethiol, 2-mercaptoethanol, glucose cysteine, 1-thioglycerol, sodium mercaptopropanesulfonate, N-acetylmethionine, thiosalicylic acid, 2-thiazoline-2-thiol, 2,5-dimercapto-1,3,4-thiadiazole, 2-benzothiazolethiol, or 2-benzimidazolethiol. They may be used singly or in combination.
摘要翻译：一种用于通过化学还原获得贵金属的水溶液，其含有至少一种选自金，铂，银和钯的金属的水溶性化合物或络合物作为待沉积金属的来源，以及在至少一种巯基化合物或硫化物化合物或其盐作为还原剂。还原剂通常为巯基乙酸，2-巯基丙酸，2-氨基乙硫醇，2-巯基乙醇，葡萄糖半胱氨酸，1-硫代甘油，巯基丙磺酸钠，N-乙酰基甲硫氨酸，硫代水杨酸，2-噻唑啉-2-硫醇，二巯基-1,3,4-噻二唑，2-苯并噻唑硫醇或2-苯并咪唑硫醇。它们可以单独使用或组合使用。

6. 发明授权

US4673470A Tin, lead, or tin-lead alloy plating bath 失效
标题翻译：锡，铅或锡铅合金电镀浴
公开(公告)号：US4673470A
公开(公告)日：1987-06-16
申请号：US831762
申请日：1986-02-21
申请人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
发明人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
IPC分类号： C25D3/32 , C25D3/36 , C25D3/60 , C25D3/56
CPC分类号： C25D3/60 , C25D3/32 , C25D3/36
摘要： A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula ##STR1## wherein R is a C.sub.1-4 hydrocarbon radical, M.sub.1 is a hydrogen atom or alkali metal atom, M.sub.2 is an alkali metal atom, and X.sub.1 and X.sub.2 are each a hydrogen atom, OH, COON, or SO.sub.3 N (where N represents a hydrogen atom or alkali metal atom).
摘要翻译：一种锡，铅或锡铅合金电镀浴，其包含作为必要成分的碱金属盐和可溶性二价锡化合物或/和铅化合物，所有的通式为“IMAGE”的脂族或芳族磺基羧酸 >其中R是C1-4烃基，M1是氢原子或碱金属原子，M2是碱金属原子，X1和X2各自是氢原子，OH，COON或SO3N（其中N表示氢原子或碱金属原子）。

7. 发明授权

US4459185A Tin, lead, and tin-lead alloy plating baths 失效
标题翻译：锡，铅和锡铅合金电镀浴
公开(公告)号：US4459185A
公开(公告)日：1984-07-10
申请号：US532934
申请日：1983-09-16
申请人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
发明人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
IPC分类号： C25D3/30 , C25D3/32 , C25D3/34 , C25D3/36 , C25D3/56 , C25D3/60
CPC分类号： C25D3/32 , C25D3/36 , C25D3/56 , C25D3/60
摘要： A tin, lead or tin-lead alloy plating bath, which comprises(A) a principal plating bath containing an alkanesulfonic or alkanolsulfonic acid, and either a divalent tin salt or a divalent lead salt thereof or both;(B) at least one of surfactants comprising(a) a cationic surfactant selected from the group consisting of quarternary ammonium salts, alkyl pyridinium salts, alkyl imidazolinium salts and higher alkyl amine salts,(b) an amphoteric surfactant selected from betaines, or(c) a nonionic surfactant selected from the group consisting of condensation products of ethylene oxide and/or propylene oxide with a styrenated phenol, a higher alcohol, an alkylphenol, an alkylnaphthol, a fatty acid amide, a sorbitan or a phosphate; and(C) at least one of levelling agents selected from the group consisting of alkylidene sulfamic acids, quinolinol derivatives, benzotriazole derivatives, dialkylidene o-phenylene diamines, benzaldehyde derivatives, triazine derivatives, salicylic acid derivatives and nitriles.
摘要翻译：锡，铅或锡铅合金电镀浴，其包含（A）含有烷烃磺酸或链烷醇磺酸的主要电镀液，以及二价锡盐或其二价铅盐或两者; （B）至少一种表面活性剂，其包含（a）选自季铵盐，烷基吡啶鎓盐，烷基咪唑啉鎓盐和高级烷基胺盐的阳离子表面活性剂，（b）选自甜菜碱的两性表面活性剂或（ c）选自环氧乙烷和/或环氧丙烷与苯乙烯化酚，高级醇，烷基酚，烷基萘酚，脂肪酸酰胺，脱水山梨糖醇或磷酸酯的缩合产物的非离子表面活性剂; 和（C）选自亚烷基氨基磺酸，羟基喹啉衍生物，苯并三唑衍生物，二烷基亚苯基二胺，苯甲醛衍生物，三嗪衍生物，水杨酸衍生物和腈的至少一种流平剂。

8. 发明授权

US07628903B1 Silver and silver alloy plating bath 有权
标题翻译：银和银合金电镀浴
公开(公告)号：US07628903B1
公开(公告)日：2009-12-08
申请号：US09563479
申请日：2000-05-02
申请人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
发明人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
IPC分类号： C25D3/46 , C23C18/31
CPC分类号： C25D3/46 , C25D3/64
摘要： A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobis(triglycerol), 3,3′-thiodipropanol, thiodiglycerin, 3,6-dithiooctane-1,8-diol, and the like, which contain at least one or more of an ether oxygen atom, a 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, and not containing a basic nitrogen atom. Compared to baths containing aliphatic monosulfide compounds, such as thiodiglycol or beta-thiodiglycol, which do not contain an ether oxygen atom, 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, by having these particular compounds, the plating bath of the present invention has excellent stability over extended time, excellent co-deposition of silver and various metals, and excellent appearance of the electrodeposition coating.
摘要翻译：银和银合金电镀浴包括（A）可溶性盐，其具有银盐或银盐和金属如锡，铋，铟，铅等的盐的混合物; 和（B）特定的脂族硫醚化合物，例如硫代双（二甘醇），二硫代双（三甘油），3,3'-硫代二丙醇，硫二甘油，3,6-二硫辛烷-1,8-二醇等，至少一个或多个醚氧原子，1-羟丙基，羟基亚丙基，或分子中的硫原子键中的两个或多个，并且不含碱性氮原子。与分子中含有不含醚氧原子，1-羟丙基，羟基亚丙基或两个或多个硫键的脂族单硫醚化合物如硫二甘醇或β-硫二甘醇相比，具有这些特定化合物，本发明的电镀浴在延长的时间内具有优异的稳定性，优异的银和各种金属的共沉积，以及优异的电沉积外观。

9. 发明授权

US07938948B2 Silver and silver alloy plating bath 有权
标题翻译：银和银合金电镀浴
公开(公告)号：US07938948B2
公开(公告)日：2011-05-10
申请号：US12553731
申请日：2009-09-03
申请人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
发明人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
IPC分类号： C25D3/46 , C25D3/64 , C23C18/31
CPC分类号： C25D3/46 , C25D3/64
摘要： To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.
摘要翻译：开发稳定的非氰化银和银合金电镀浴。本发明是一种银和银合金电镀液，包括：（A）可溶性盐，其包含银盐或银盐和选自锡，铋，钴等的金属盐的混合物，锑，铱，铟，铅，铜，铁，锌，镍，钯，铂和金; 和（B）至少一种包含选自醚氧原子，3-羟基丙基和羟基亚丙基的官能团的脂族硫化物，条件是脂族硫化物不包含碱性氮原子。

10. 发明授权

US06607653B1 Plating bath and process for depositing alloy containing tin and copper 有权
标题翻译：电镀浴和沉积含锡和铜合金的工艺
公开(公告)号：US06607653B1
公开(公告)日：2003-08-19
申请号：US09667715
申请日：2000-09-22
申请人： Kiyotaka Tsuji , Keigo Obata , Takao Takeuchi , Hidemi Nawafune , Tetsuji Nishikawa
发明人： Kiyotaka Tsuji , Keigo Obata , Takao Takeuchi , Hidemi Nawafune , Tetsuji Nishikawa
IPC分类号： C25D358
CPC分类号： C25D3/60
摘要： The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating bath containing tin and copper, the bath being capable of preventing deposition of copper on a tin anode by substitution, having low dependence of plated coating composition on current density, high bath stability and resistance to turbidness.
摘要翻译：本发明提供了含有可溶性金属化合物和特定含硫化合物的锡 - 铜合金电镀浴，锡 - 铜 - 铋合金电镀浴或锡 - 铜 - 银合金电镀浴。本发明的电镀液是含有锡和铜的合金电镀液，该浴能够防止铜在锡阳极上的沉积而被置换，镀层组合物对电流密度的依赖性低，浴的稳定性和耐浑浊

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