专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07867867B2 Methods of manufacturing semiconductor devices 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07867867B2
公开(公告)日：2011-01-11
申请号：US11593898
申请日：2006-11-07
申请人： Yong-kuk Jeong , Andrew-tae Kim , Dong-suk Shin
发明人： Yong-kuk Jeong , Andrew-tae Kim , Dong-suk Shin
IPC分类号： H01L21/336
CPC分类号： H01L21/823807 , H01L21/76801 , H01L21/76825 , H01L21/76826 , H01L21/76828 , H01L21/823864 , H01L29/7843 , H01L2924/0002 , H01L2924/00
摘要： Methods of manufacturing a semiconductor device include forming an NMOS transistor on a semiconductor substrate, forming a first interlayer dielectric layer on the NMOS transistor, and dehydrogenating the first interlayer dielectric layer. Dehydrogenating the first interlayer dielectric layer may change a stress of the first interlayer dielectric layer. In particular, the first interlayer dielectric layer may have a tensile stress of 200 MPa or more after dehydrogenization. Semiconductor devices including dehydrogenated interlayer dielectric layers are also provided.
摘要翻译：制造半导体器件的方法包括在半导体衬底上形成NMOS晶体管，在NMOS晶体管上形成第一层间电介质层，并使第一层间电介质层脱氢。使第一层间电介质层脱氢可以改变第一层间电介质层的应力。特别地，第一层间电介质层可以在脱氢后具有200MPa以上的拉伸应力。还提供了包括脱氢层间电介质层的半导体器件。

2. 发明授权

US08237202B2 Semiconductor devices including dehydrogenated interlayer dielectric layers 有权
标题翻译：包括脱氢层间电介质层的半导体器件
公开(公告)号：US08237202B2
公开(公告)日：2012-08-07
申请号：US12987415
申请日：2011-01-10
申请人： Yong-kuk Jeong , Andrew-tae Kim , Dong-suk Shin
发明人： Yong-kuk Jeong , Andrew-tae Kim , Dong-suk Shin
IPC分类号： H01L27/118
CPC分类号： H01L21/823807 , H01L21/76801 , H01L21/76825 , H01L21/76826 , H01L21/76828 , H01L21/823864 , H01L29/7843 , H01L2924/0002 , H01L2924/00
摘要： Methods of manufacturing a semiconductor device include forming an NMOS transistor on a semiconductor substrate, forming a first interlayer dielectric layer on the NMOS transistor, and dehydrogenating the first interlayer dielectric layer. Dehydrogenating the first interlayer dielectric layer may change a stress of the first interlayer dielectric layer. In particular, the first interlayer dielectric layer may have a tensile stress of 200 MPa or more after dehydrogenization. Semiconductor devices including dehydrogenated interlayer dielectric layers are also provided.
摘要翻译：制造半导体器件的方法包括在半导体衬底上形成NMOS晶体管，在NMOS晶体管上形成第一层间电介质层，并使第一层间电介质层脱氢。使第一层间电介质层脱氢可以改变第一层间电介质层的应力。特别地，第一层间电介质层可以在脱氢后具有200MPa以上的拉伸应力。还提供了包括脱氢层间电介质层的半导体器件。

3. 发明申请

US20110163386A1 Semiconductor Devices Including Dehydrogenated Interlayer Dielectric Layers 有权
标题翻译：包括脱氢层间电介质层的半导体器件
公开(公告)号：US20110163386A1
公开(公告)日：2011-07-07
申请号：US12987415
申请日：2011-01-10
申请人： Yong-kuk Jeong , Andrew-tae Kim , Dong-suk Shin
发明人： Yong-kuk Jeong , Andrew-tae Kim , Dong-suk Shin
IPC分类号： H01L27/092 , H01L29/51
CPC分类号： H01L21/823807 , H01L21/76801 , H01L21/76825 , H01L21/76826 , H01L21/76828 , H01L21/823864 , H01L29/7843 , H01L2924/0002 , H01L2924/00
摘要： Methods of manufacturing a semiconductor device include forming an NMOS transistor on a semiconductor substrate, forming a first interlayer dielectric layer on the NMOS transistor, and dehydrogenating the first interlayer dielectric layer. Dehydrogenating the first interlayer dielectric layer may change a stress of the first interlayer dielectric layer. In particular, the first interlayer dielectric layer may have a tensile stress of 200 MPa or more after dehydrogenization. Semiconductor devices including dehydrogenated interlayer dielectric layers are also provided.
摘要翻译：制造半导体器件的方法包括在半导体衬底上形成NMOS晶体管，在NMOS晶体管上形成第一层间电介质层，并使第一层间电介质层脱氢。使第一层间电介质层脱氢可以改变第一层间电介质层的应力。特别地，第一层间电介质层可以在脱氢后具有200MPa以上的拉伸应力。还提供了包括脱氢层间电介质层的半导体器件。

4. 发明申请

US20070105297A1 Semiconductor devices and methods of manufacturing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20070105297A1
公开(公告)日：2007-05-10
申请号：US11593898
申请日：2006-11-07
申请人： Yong-kuk Jeong , Andrew-tae Kim , Dong-suk Shin
发明人： Yong-kuk Jeong , Andrew-tae Kim , Dong-suk Shin
IPC分类号： H01L21/8234
CPC分类号： H01L21/823807 , H01L21/76801 , H01L21/76825 , H01L21/76826 , H01L21/76828 , H01L21/823864 , H01L29/7843 , H01L2924/0002 , H01L2924/00
摘要： Methods of manufacturing a semiconductor device include forming an NMOS transistor on a semiconductor substrate, forming a first interlayer dielectric layer on the NMOS transistor, and dehydrogenating the first interlayer dielectric layer. Dehydrogenating the first interlayer dielectric layer may change a stress of the first interlayer dielectric layer. In particular, the first interlayer dielectric layer may have a tensile stress of 200 MPa or more after dehydrogenization. Semiconductor devices including dehydrogenated interlayer dielectric layers are also provided.
摘要翻译：制造半导体器件的方法包括在半导体衬底上形成NMOS晶体管，在NMOS晶体管上形成第一层间电介质层，并使第一层间电介质层脱氢。使第一层间电介质层脱氢可以改变第一层间电介质层的应力。特别地，第一层间电介质层可以在脱氢后具有200MPa以上的拉伸应力。还提供了包括脱氢层间电介质层的半导体器件。

5. 发明申请

US20110284988A1 ELECTRICAL FUSE DEVICE 失效
标题翻译：电保险装置
公开(公告)号：US20110284988A1
公开(公告)日：2011-11-24
申请号：US13193637
申请日：2011-07-29
申请人： Dong-suk Shin , Andrew-tae Kim , Hong-jae Shin
发明人： Dong-suk Shin , Andrew-tae Kim , Hong-jae Shin
IPC分类号： H01L23/525
CPC分类号： H01L23/5256 , H01L23/5258 , H01L27/112 , H01L2924/0002 , H01L2924/00
摘要： The invention relates generally to a fuse device of a semiconductor device, and more particularly, to an electrical fuse device of a semiconductor device. Embodiments of the invention provide a fuse device that is capable of reducing programming error caused by non-uniform current densities in a fuse link. In one respect, there is provided an electrical fuse device that includes: an anode; a fuse link coupled to the anode on a first side of the fuse link; a cathode coupled to the fuse link on a second side of the fuse link; a first cathode contact coupled to the cathode; and a first anode contact coupled to the anode, at least one of the first cathode contact and the first anode contact being disposed across a virtual extending surface of the fuse link.
摘要翻译：本发明一般涉及半导体器件的熔丝器件，更具体地，涉及一种半导体器件的电熔丝器件。本发明的实施例提供一种能够减少由熔丝链中的不均匀电流密度引起的编程误差的熔丝装置。在一方面，提供一种电熔丝装置，其包括：阳极; 熔丝链路，其在所述熔丝连接件的第一侧上耦合到所述阳极; 连接到所述熔丝链的第二侧上的所述熔断体的阴极; 耦合到阴极的第一阴极接触; 以及耦合到所述阳极的第一阳极触点，所述第一阴极触点和所述第一阳极触点中的至少一个跨越所述熔断体的虚拟延伸表面设置。

6. 发明授权

US08013420B2 Electrical fuse device 失效
标题翻译：电熔丝装置
公开(公告)号：US08013420B2
公开(公告)日：2011-09-06
申请号：US12203256
申请日：2008-09-03
申请人： Dong-suk Shin , Andrew-tae Kim , Hong-jae Shin
发明人： Dong-suk Shin , Andrew-tae Kim , Hong-jae Shin
IPC分类号： H01L23/525
CPC分类号： H01L23/5256 , H01L23/5258 , H01L27/112 , H01L2924/0002 , H01L2924/00
摘要： The invention relates generally to a fuse device of a semiconductor device, and more particularly, to an electrical fuse device of a semiconductor device. Embodiments of the invention provide a fuse device that is capable of reducing programming error caused by non-uniform current densities in a fuse link. In one respect, there is provided an electrical fuse device that includes: an anode; a fuse link coupled to the anode on a first side of the fuse link; a cathode coupled to the fuse link on a second side of the fuse link; a first cathode contact coupled to the cathode; and a first anode contact coupled to the anode, at least one of the first cathode contact and the first anode contact being disposed across a virtual extending surface of the fuse link.
摘要翻译：本发明一般涉及半导体器件的熔丝器件，更具体地，涉及一种半导体器件的电熔丝器件。本发明的实施例提供一种能够减少由熔丝链中的不均匀电流密度引起的编程误差的熔丝装置。在一方面，提供一种电熔丝装置，其包括：阳极; 熔丝链路，其在所述熔丝连接件的第一侧上耦合到所述阳极; 连接到所述熔丝链的第二侧上的所述熔断体的阴极; 耦合到阴极的第一阴极接触; 以及耦合到所述阳极的第一阳极触点，所述第一阴极触点和所述第一阳极触点中的至少一个跨越所述熔断体的虚拟延伸表面设置。

7. 发明授权

US07892966B2 Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same 有权
标题翻译：在布线层中具有热形成气隙的半导体器件及其制造方法
公开(公告)号：US07892966B2
公开(公告)日：2011-02-22
申请号：US11859822
申请日：2007-09-24
申请人： Seok-jun Won , Andrew-tae Kim
发明人： Seok-jun Won , Andrew-tae Kim
IPC分类号： H01L21/4763
CPC分类号： H01L23/5222 , H01L21/7682 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device is provided. A unit wiring level of the semiconductor device includes; first and second wiring layers spaced apart from each other on a support layer, a large space formed adjacent to the first wiring layer and including a first air gap of predetermined width as measured from a sidewall of the first wiring layer, and a portion of a thermally degradable material layer formed on the support layer, small space formed between the first and second wiring layers, wherein the small space is smaller than the large space, and a second air gap at least partially fills the small space, and a porous insulating layer formed on the first and second air gaps.
摘要翻译：提供半导体器件。半导体器件的单位布线层包括：在支撑层上彼此间隔开的第一和第二布线层，与第一布线层相邻形成的大空间，并且包括从第一布线层的侧壁测量的预定宽度的第一气隙，形成在支撑层上的热降解材料层，形成在第一和第二布线层之间的小空间，其中小空间小于大空间，第二气隙至少部分地填充小空间，多孔绝缘层形成在第一和第二气隙上。

8. 发明授权

US07638423B2 Semiconductor device and method of forming wires of semiconductor device 失效
标题翻译：半导体装置及其形成方法
公开(公告)号：US07638423B2
公开(公告)日：2009-12-29
申请号：US11701420
申请日：2007-02-02
申请人： Jung-eun Lee , Young-jin Wee , Andrew-tae Kim , Young-joon Moon
发明人： Jung-eun Lee , Young-jin Wee , Andrew-tae Kim , Young-joon Moon
IPC分类号： H01L21/4763
CPC分类号： H01L23/53295 , H01L21/76805 , H01L21/76807 , H01L21/76814 , H01L21/76844 , H01L21/76864 , H01L23/5226 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： A method of forming wires of a semiconductor device including forming a first metal wire on a semiconductor substrate; forming a first insulating film on the first metal wire; etching a portion of the first insulating film to expose a surface portion of the first metal wire; forming a first barrier metal film on sidewalls of the opening and the exposed first metal wire; etching a portion of the first barrier metal film on the first metal wire to expose a surface portion of the first metal wire; performing a heat treatment process on the exposed surface portion of the first metal wire to improve surface roughness; and forming a second wire by filling the opening using a conductive material.
摘要翻译：一种形成半导体器件的线的方法，包括在半导体衬底上形成第一金属线; 在所述第一金属线上形成第一绝缘膜; 蚀刻第一绝缘膜的一部分以暴露第一金属线的表面部分; 在开口的侧壁和暴露的第一金属线上形成第一阻挡金属膜; 蚀刻第一金属线上的第一阻挡金属膜的一部分以暴露第一金属线的表面部分; 对所述第一金属线的暴露表面部进行热处理，以改善表面粗糙度; 以及通过使用导电材料填充所述开口而形成第二线。

9. 发明申请

US20060177630A1 Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method 有权
标题翻译：形成半导体器件的金属互连的方法以及通过这种方法形成的金属互连
公开(公告)号：US20060177630A1
公开(公告)日：2006-08-10
申请号：US11336905
申请日：2006-01-23
申请人： Sun-jung Lee , Soo-geun Lee , Hong-jae Shin , Andrew-tae Kim , Seung-man Choi , Bong-seok Suh
发明人： Sun-jung Lee , Soo-geun Lee , Hong-jae Shin , Andrew-tae Kim , Seung-man Choi , Bong-seok Suh
IPC分类号： B32B3/04
CPC分类号： H01L21/76877 , H01L21/7684 , H01L21/76883 , Y10T428/24207
摘要： A metal interconnection of a semiconductor device, formed using a damascene process, has large grains and yet a smooth surface. First, a barrier layer and a metal layer are sequentially formed in an opening in an interlayer dielectric layer. A CMP process is carried out on the metal layer to form a metal interconnection remaining within the opening. Then, the metal interconnection is treated with plasma. The plasma treatment creates compressive stress in the metal interconnection, which stress produces hillocks at the surface of the metal interconnection. In addition, the plasma treatment process causes grains of the metal to grow, especially when the design rule is small, to thereby decrease the resistivity of the metal interconnection. The hillocks are then removed by a CMP process aimed at polishing the portion of the barrier layer that extends over the upper surface of the interlayer dielectric layer. Finally, a capping insulating layer is formed. The intentional forming of hillocks by the plasma treatment process at weak portions of the metal interconnection and the subsequent removal of the hillocks greatly reduces the possibility of any additional hillocks being produced at the surface of the metal interconnection, especially when the capping layer is formed.
摘要翻译：使用镶嵌工艺形成的半导体器件的金属互连具有大的晶粒并且具有光滑的表面。首先，在层间电介质层的开口中依次形成阻挡层和金属层。在金属层上进行CMP工艺以形成残留在开口内的金属互连。然后，用等离子体处理金属互连。等离子体处理在金属互连中产生压应力，该应力在金属互连表面产生小丘。此外，等离子体处理工艺使得金属晶粒生长，特别是当设计规则小时，从而降低金属互连的电阻率。然后通过CMP工艺去除小丘，目的是抛光在层间电介质层的上表面上延伸的阻挡层的部分。最后，形成封盖绝缘层。通过等离子体处理在金属互连的弱部分和随后的小丘的移除中有意形成小丘大大减少了在金属互连表面产生任何额外的小丘的可能性，特别是当形成覆盖层时。

10. 发明授权

US08198701B2 Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same 有权
标题翻译：在布线层中具有热形成气隙的半导体器件及其制造方法
公开(公告)号：US08198701B2
公开(公告)日：2012-06-12
申请号：US12987427
申请日：2011-01-10
申请人： Seok-jun Won , Andrew-tae Kim
发明人： Seok-jun Won , Andrew-tae Kim
IPC分类号： H01L23/48
CPC分类号： H01L23/5222 , H01L21/7682 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device is provided. A unit wiring level of the semiconductor device includes; first and second wiring layers spaced apart from each other on a support layer, a large space formed adjacent to the first wiring layer and including a first air gap of predetermined width as measured from a sidewall of the first wiring layer, and a portion of a thermally degradable material layer formed on the support layer, small space formed between the first and second wiring layers, wherein the small space is smaller than the large space, and a second air gap at least partially fills the small space, and a porous insulating layer formed on the first and second air gaps.
摘要翻译：提供半导体器件。半导体器件的单位布线层包括：在支撑层上彼此间隔开的第一和第二布线层，与第一布线层相邻形成的大空间，并且包括从第一布线层的侧壁测量的预定宽度的第一气隙，形成在支撑层上的热降解材料层，形成在第一和第二布线层之间的小空间，其中小空间小于大空间，第二气隙至少部分地填充小空间，多孔绝缘层形成在第一和第二气隙上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式