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1. 发明申请

US20110235155A1 MECHANICAL LAYER AND METHODS OF SHAPING THE SAME 失效
标题翻译：机械层及其形成方法
公开(公告)号：US20110235155A1
公开(公告)日：2011-09-29
申请号：US12731583
申请日：2010-03-25
申请人： Yi Tao , Fan Zhong , Teruo Sasagawa
发明人： Yi Tao , Fan Zhong , Teruo Sasagawa
IPC分类号： G02B26/08 , B05D5/06
CPC分类号： B81B3/0072 , B81B2201/047 , G02B5/284 , G02B26/001 , G09G3/3466
摘要： A method of shaping a mechanical layer is disclosed. In one embodiment, the method comprises depositing a support layer, a sacrificial layer and a mechanical layer over a substrate, and forming a support post from the support layer. A kink is formed adjacent to the support post in the mechanical layer. The kink comprises a rising edge and a falling edge, and the kink can be configured to control the shaping and curvature of the mechanical layer upon removal of the sacrificial layer.
摘要翻译：公开了一种成形机械层的方法。在一个实施例中，该方法包括在衬底上沉积支撑层，牺牲层和机械层，以及从支撑层形成支撑柱。在机械层中邻近支撑柱形成扭结。扭结包括上升沿和下降沿，并且扭结可被配置成在去除牺牲层时控制机械层的成形和曲率。

2. 发明授权

US08547626B2 Mechanical layer and methods of shaping the same 失效
标题翻译：机械层及其成型方法
公开(公告)号：US08547626B2
公开(公告)日：2013-10-01
申请号：US12731583
申请日：2010-03-25
申请人： Yi Tao , Fan Zhong , Teruo Sasagawa
发明人： Yi Tao , Fan Zhong , Teruo Sasagawa
IPC分类号： G02B26/00
CPC分类号： B81B3/0072 , B81B2201/047 , G02B5/284 , G02B26/001 , G09G3/3466
摘要： A method of shaping a mechanical layer is disclosed. In one embodiment, the method comprises depositing a support layer, a sacrificial layer and a mechanical layer over a substrate, and forming a support post from the support layer. A kink is formed adjacent to the support post in the mechanical layer. The kink comprises a rising edge and a falling edge, and the kink can be configured to control the shaping and curvature of the mechanical layer upon removal of the sacrificial layer.
摘要翻译：公开了一种成形机械层的方法。在一个实施例中，该方法包括在衬底上沉积支撑层，牺牲层和机械层，以及从支撑层形成支撑柱。在机械层中邻近支撑柱形成扭结。扭结包括上升沿和下降沿，并且扭结可被配置成在去除牺牲层时控制机械层的成形和曲率。

3. 发明授权

US08394656B2 Method of creating MEMS device cavities by a non-etching process 失效
标题翻译：通过非蚀刻工艺制造MEMS器件腔的方法
公开(公告)号：US08394656B2
公开(公告)日：2013-03-12
申请号：US12831898
申请日：2010-07-07
申请人： Chun-Ming Wang , Jeffrey Lan , Teruo Sasagawa
发明人： Chun-Ming Wang , Jeffrey Lan , Teruo Sasagawa
IPC分类号： H01L21/00
CPC分类号： B81C1/00047 , B81B2201/047 , B81C2201/0108 , B81C2201/0111 , G02B26/001
摘要： MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.
摘要翻译：可以使用包含热可汽化聚合物以在可移动层和基底之间形成间隙的牺牲层来制造MEMS器件（例如干涉式调制器）。一个实施例提供了一种制造MEMS器件的方法，该MEMS器件包括在衬底上沉积聚合物层，在聚合物层上形成导电层，并蒸发聚合物层的至少一部分以在衬底和电导电层。另一个实施例提供了制造干涉式调制器的方法，该方法包括提供衬底，在衬底的至少一部分上沉积第一导电材料，在第一导电材料的至少一部分上沉积牺牲材料，沉积绝缘体在所述衬底上并且邻近所述牺牲材料以形成支撑结构，以及在所述牺牲材料的至少一部分上沉积第二导电材料，所述牺牲材料可通过热蒸发而被去除，从而在所述第一电导电层和第二导电层。

4. 发明授权

US08344470B2 Electromechanical devices having support structures 有权
标题翻译：具有支撑结构的机电装置
公开(公告)号：US08344470B2
公开(公告)日：2013-01-01
申请号：US13099221
申请日：2011-05-02
申请人： Jeffrey B. Sampsell , Clarence Chui , Manish Kothari , Mark W. Miles , Teruo Sasagawa , Wonsuk Chung , Ming-Hau Tung
发明人： Jeffrey B. Sampsell , Clarence Chui , Manish Kothari , Mark W. Miles , Teruo Sasagawa , Wonsuk Chung , Ming-Hau Tung
IPC分类号： H01L31/0232
CPC分类号： G02B26/001 , B81B3/007 , B81B2201/047 , B81B2203/0307 , B81B2203/053
摘要： Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.
摘要翻译： MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。在某些实施例中，可以使用铆钉和柱。在某些实施方案中，这些支撑结构由诸如金属或氧化物的刚性无机材料形成。在某些实施例中，还可以沉积蚀刻阻挡层以促进材料在形成相对于MEMS器件内的其它部件不能选择性蚀刻的支撑结构的形成中的使用。

5. 发明授权

US08308962B2 Etching processes used in MEMS production 失效
公开(公告)号：US08308962B2
公开(公告)日：2012-11-13
申请号：US12210010
申请日：2008-09-12
申请人： Philip Floyd , Chok Ho , Teruo Sasagawa , Xiaoming Yan
发明人： Philip Floyd , Chok Ho , Teruo Sasagawa , Xiaoming Yan
IPC分类号： H01B13/00
CPC分类号： H01L21/32135 , B01D53/002 , B01D2257/11 , B01D2257/2027 , H01L21/31116
摘要： The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process.

6. 发明申请

US20120120081A1 ILLUMINATION DEVICE WITH PASSIVATION LAYER 审中-公开
标题翻译：具有钝化层的照明装置
公开(公告)号：US20120120081A1
公开(公告)日：2012-05-17
申请号：US13279190
申请日：2011-10-21
申请人： Ion Bita , Kebin Li , Rashmi Rao , Teruo Sasagawa , Brian W. Arbuckle , William Cummings
发明人： Ion Bita , Kebin Li , Rashmi Rao , Teruo Sasagawa , Brian W. Arbuckle , William Cummings
IPC分类号： G06F13/14 , G02B26/00 , B05D5/12 , F21V8/00
CPC分类号： G02B26/001 , G02B6/005 , Y10T29/49826
摘要： This disclosure provides systems, methods and apparatus for providing illumination by using a light guide to distribute light. In one aspect, a passivation layer is attached to the light guide of an illumination device. The passivation layer may be an optically transparent moisture barrier and may have a thickness and refractive index which allows it to function as an anti-reflective coating. The passivation layer may protect moisture-sensitive underlying features, such as metallized light turning features that may be present in the light guide. The light turning features may be configured to redirect light out of the light guide. In some implementations, the redirected light may be applied to illuminate a display.
摘要翻译：本公开提供了通过使用光导来分配光来提供照明的系统，方法和装置。在一个方面，钝化层附着到照明装置的光导。钝化层可以是光学透明的水分屏障，并且可以具有允许其用作抗反射涂层的厚度和折射率。钝化层可以保护水分敏感的底层特征，例如可能存在于光导中的金属化的光转动特征。光转向特征可以被配置为将光重定向到光导中。在一些实施方案中，可以应用重定向的光来照亮显示器。

7. 发明授权

US08149497B2 Support structure for MEMS device and methods therefor 失效
公开(公告)号：US08149497B2
公开(公告)日：2012-04-03
申请号：US12711594
申请日：2010-02-24
申请人： Teruo Sasagawa , Clarence Chui , Manish Kothari , SuryaPrakash Ganti , Jeffrey B. Sampsell , Chun-Ming Wang
发明人： Teruo Sasagawa , Clarence Chui , Manish Kothari , SuryaPrakash Ganti , Jeffrey B. Sampsell , Chun-Ming Wang
IPC分类号： G02B26/00
CPC分类号： G02B26/0841 , B81B2201/042 , B81B2203/0307 , B81C1/00595 , B81C2201/014 , G02B26/001
摘要： A microelectromechanical systems device having support structures formed of sacrificial material surrounded by a protective material. The microelectromechanical systems device includes a substrate having an electrode formed thereon. Another electrode is separated from the first electrode by a cavity and forms a movable layer, which is supported by support structures formed of a sacrificial material.

8. 发明授权

US07944603B2 Microelectromechanical device and method utilizing a porous surface 有权
标题翻译：微机电装置和利用多孔表面的方法
公开(公告)号：US07944603B2
公开(公告)日：2011-05-17
申请号：US12119712
申请日：2008-05-13
申请人： Teruo Sasagawa , Lior Kogut
发明人： Teruo Sasagawa , Lior Kogut
IPC分类号： G02B26/00
CPC分类号： B81B3/001 , B81B2201/047 , B81C2201/0115 , G02B26/001
摘要： A microelectromechanical device (MEMS) utilizing a porous electrode surface for reducing stiction is disclosed. In one embodiment, a microelectromechanical device is an interferometric modulator that includes a transparent electrode having a first surface; and a movable reflective electrode with a second surface facing the first surface. The movable reflective electrode is movable between a relaxed and actuated (collapsed) position. An aluminum layer is provided on either the first or second surface. The aluminum layer is then anodized to provide an aluminum oxide layer which has a porous surface. The porous surface, in the actuated position, decreases contact area between the electrodes, thus reducing stiction.
摘要翻译：公开了一种利用多孔电极表面降低静摩擦力的微机电装置（MEMS）。在一个实施例中，微机电装置是干涉式调制器，其包括具有第一表面的透明电极; 以及具有面向第一表面的第二表面的可移动反射电极。可移动反射电极可在松弛和致动（折叠）位置之间移动。在第一或第二表面上提供铝层。然后将铝层阳极氧化以提供具有多孔表面的氧化铝层。处于致动位置的多孔表面减小了电极之间的接触面积，从而减小了静电。

9. 发明授权

US07623287B2 Non-planar surface structures and process for microelectromechanical systems 失效
标题翻译：微机电系统的非平面表面结构和工艺
公开(公告)号：US07623287B2
公开(公告)日：2009-11-24
申请号：US11406866
申请日：2006-04-19
申请人： Teruo Sasagawa , Lior Kogut , Ming-Hau Tung
发明人： Teruo Sasagawa , Lior Kogut , Ming-Hau Tung
IPC分类号： G02B26/00
CPC分类号： B81B3/0008 , G02B26/001
摘要： Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. A non-planar surface is formed on one or more layers by flowing an etchant through a permeable layer. In one embodiment the non-planar surface is formed on a sacrificial layer. A movable layer formed over the non-planar surface of the sacrificial layer results in a non-planar interface between the sacrificial and movable layers. Removal of the sacrificial layer results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.
摘要翻译：制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。通过使蚀刻剂流过可渗透层而在一个或多个层上形成非平面表面。在一个实施例中，非平面表面形成在牺牲层上。形成在牺牲层的非平面表面上的可移动层导致牺牲层和可移动层之间的非平面界面。牺牲层的去除导致释放的MEMS器件在MEMS器件致动时具有减小可移动层和固定层之间的接触面积。减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。这些方法可用于制造释放和未释放的干涉式调制器。

10. 发明授权

US07580172B2 MEMS device and interconnects for same 失效
标题翻译： MEMS器件和互连相同
公开(公告)号：US07580172B2
公开(公告)日：2009-08-25
申请号：US11540485
申请日：2006-09-29
申请人： Alan G. Lewis , Manish Kothari , John Batey , Teruo Sasagawa , Ming-Hau Tung , Gregory D. U'Ren , Stephen Zee
发明人： Alan G. Lewis , Manish Kothari , John Batey , Teruo Sasagawa , Ming-Hau Tung , Gregory D. U'Ren , Stephen Zee
IPC分类号： G02F1/03 , G02B26/00
CPC分类号： B81B7/0006 , B81B7/007 , B81B2201/047 , G02B26/001 , H02N1/006
摘要： A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.
摘要翻译：一种微机电系统装置，其具有在所述装置外部的电路和所述装置内的电极和可移动层中的至少一个之间的电互连。电互连的至少一部分由与电极和器件的机械层之间的导电层相同的材料形成。在一个实施例中，该导电层是牺牲层，其随后被去除以在电极和可移动层之间形成空腔。牺牲层优选由钼，掺杂硅，钨或钛形成。根据另一实施例，导电层是优选包括铝的可移动反射层。

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