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1. 发明授权

US5825914A Component detection method 失效
公开(公告)号：US5825914A
公开(公告)日：1998-10-20
申请号：US678658
申请日：1996-07-11
申请人： Yasutaka Tsuboi , Junichi Hada , Masamichi Morimoto
发明人： Yasutaka Tsuboi , Junichi Hada , Masamichi Morimoto
IPC分类号： G01B11/00 , G06T1/00 , G06T7/60 , H01L21/60 , H01L21/68 , G06K9/36
CPC分类号： G06T7/606 , G06T2207/30108
摘要： It is intended to accurately detect the centerline or center of electronic component by relieving effects of brightness or darkness or the like caused by the shape or color of the component, irregularity on the surface or how illuminance is projected on the component through statistical processing. To this end, the present invention comprises a first step for determining edge points of opposing sides of said component, a second step for determining two-dimensional coordinate axes which are established to make a deflection angle of said component zero, a third step for projecting the center position of two edge points in total each of which is arbitrarily selected from each side to a coordinate axis of said two-dimensional coordinate axes orthogonal to said opposing sides, and creating a histogram on said coordinate axis by projecting and adding the positions of center repeatedly obtained onto said coordinate axis, and a fourth step for detecting the peak position of the histogram obtained from the result of processing of said third step, and determining a line passing through the peak position and parallel to said opposing sides as the centerline of component.

2. 发明授权

US5872863A Component detection method 失效
标题翻译：元件检测方法
公开(公告)号：US5872863A
公开(公告)日：1999-02-16
申请号：US69203
申请日：1998-04-29
申请人： Yasutaka Tsuboi , Junichi Hada , Masamichi Morimoto
发明人： Yasutaka Tsuboi , Junichi Hada , Masamichi Morimoto
IPC分类号： G01B11/00 , G06T1/00 , G06T7/60 , H01L21/60 , H01L21/68 , G06K9/00
CPC分类号： G06T7/606 , G06T2207/30108
摘要： It is intended to accurately detect the centerline or center of electronic component by relieving effects of brightness or darkness or the like caused by the shape or color of the component, irregularity on the surface or how illuminance is projected on the component through statistical processing. To this end, the present invention comprises a first step for determining edge points of opposing sides of said component, a second step for determining two-dimensional coordinate axes which are established to make a deflection angle of said component zero, a third step for projecting the center position of two edge points in total each of which is arbitrarily selected from each side to a coordinate axis of said two-dimensional coordinate axes orthogonal to said opposing sides, and creating a histogram on said coordinate axis by projecting and adding the positions of center repeatedly obtained onto said coordinate axis, and a fourth step for detecting the peak position of the histogram obtained from the result of processing of said third step, and determining a line passing through the peak position and parallel to said opposing sides as the centerline of component.
摘要翻译：旨在通过减轻由组件的形状或颜色，表面上的不规则性或如何通过统计处理在组件上投射照明而引起的亮度或黑暗等的影响来精确地检测电子部件的中心线或中心。为此，本发明包括用于确定所述部件的相对侧边缘点的第一步骤，用于确定建立以使所述零件零偏转角度建立的二维坐标轴的第二步骤，用于突出所述零件的偏转角度的第三步骤总共两个边缘点的中心位置，每个边缘点从每侧相互垂直于所述相对侧的所述二维坐标轴的坐标轴任意选择，并且通过投影和添加所述坐标轴的位置来创建直方图重复获得的中心到所述坐标轴上的第四步骤，以及用于检测从所述第三步骤的处理结果获得的直方图的峰值位置的第四步骤，并且确定通过峰值位置并平行于所述相对侧的线作为中心线零件。

3. 发明申请

US20120262567A1 COMPONENT MOUNTING APPARATUS, ILLUMINATING APPARATUS USED IN IMAGING AND ILLUMINATING METHOD 审中-公开
标题翻译：组件安装设备，成像和照明方法中使用的照明设备
公开(公告)号：US20120262567A1
公开(公告)日：2012-10-18
申请号：US13517152
申请日：2011-08-04
申请人： Yasutaka Tsuboi , Toshihiko Tsujikawa , Ken Ishimatsu
发明人： Yasutaka Tsuboi , Toshihiko Tsujikawa , Ken Ishimatsu
IPC分类号： H04N7/18 , F21V9/10
CPC分类号： H05K13/0812
摘要： A component mounting apparatus, an illuminating apparatus used in imaging in the component mounting apparatus and an illuminating method are provided which can support various recognition objects and can meet the requirement of downsizing by reducing the occupied space. In the component mounting apparatus which performs an operation for mounting a component on a board (3), when illumination light is irradiated to the board (3) at the time of imaging with a board recognition camera (12), and when the illumination light is irradiated from a light emitting panel (15) which is formed by laminating a light source portion (13) and a color liquid crystal panel (14) and in which a plurality of light emitting portions whose light emission states can be individually changed are orderly arranged, the color tone of the illumination light which is irradiated from the respective light emitting portions and the color tone distribution of the illumination light in the light emitting panel (15) are made to be changed on the basis of the imaging object. Therefore, while the imaging can be made on conditions suitably corresponding to various recognition objects, the requirement of downsizing can be met by reducing the occupied space of an illuminating portion (20).
摘要翻译：提供了一种部件安装装置，用于部件安装装置成像的照明装置和照明方法，其可以支持各种识别对象，并且可以通过减少占用空间来满足小型化的要求。在将部件安装在基板（3）上的部件安装装置中，在利用基板识别照相机（12）成像时照明光照射到基板（3）时，当照明光从通过层叠光源部（13）和彩色液晶面板（14）而形成的发光面板（15）照射，并且其中可以单独改变发光状态的多个发光部分是有序的根据成像对象，使从各个发光部照射的照明光的色调和发光面板（15）中的照明光的色调分布变化。因此，通过适当地对应于各种识别对象的条件进行成像，可以通过减少照明部（20）的占用空间来满足小型化的要求。

4. 发明授权

US07516878B2 Bump formation method and bump forming apparatus for semiconductor wafer 失效
标题翻译：用于半导体晶片的凸起形成方法和凸块形成装置
公开(公告)号：US07516878B2
公开(公告)日：2009-04-14
申请号：US11317146
申请日：2005-12-27
申请人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
发明人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
IPC分类号： B23K37/00 , B23K37/04
CPC分类号： H01L23/544 , B23K20/007 , H01L24/11 , H01L24/12 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/45144 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.
摘要翻译：提供了一种用于半导体晶片的凸块形成方法和凸块形成装置，其中与常规技术相比，提高了在半导体晶片上形成凸块时的生产率。提供了凸块形成头，识别装置和控制装置。形成在半导体晶片上的IC被分成基本块。对于包含在一个基本块中的IC，连续执行凸块形成。只有当凸块形成操作从一个基本块移动到另一个基本块时，才执行其他基本块的位置识别。因此，与在每个IC上形成凸块时进行位置识别操作的现有技术相比，大大降低了执行位置识别的次数，从而可以提高生产率。

5. 发明授权

US07031509B2 Method and apparatus for correcting inclination of IC on semiconductor wafer 失效
标题翻译：用于校正半导体晶片上IC的倾斜度的方法和装置
公开(公告)号：US07031509B2
公开(公告)日：2006-04-18
申请号：US09988704
申请日：2001-11-20
申请人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
发明人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
IPC分类号： G06K9/00
CPC分类号： G06T1/0007 , G06T7/0002 , G06T7/0004 , G06T7/73 , G06T2207/30148 , H01L21/681 , H01L23/544 , H01L24/11 , H01L2223/54473 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/45144 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： There are provided a recognition device, a wafer turning member, a turning device, and a control device. A first detection point for recognition and a second detection point for recognition are recognized, on the basis of the result of which a semiconductor wafer is turned to correct the inclination of ICs on the semiconductor wafer. As a result, the recognition operation for detecting the inclination of the ICs when a position of the ICs is to be recognized for bump formation is eliminated. The number of times the recognition is performed is reduced in comparison with the conventional art, so that the productivity can be improved.
摘要翻译：提供了识别装置，晶片转动构件，转向装置和控制装置。基于转换半导体晶片以校正半导体晶片上的IC的倾斜度的结果，识别用于识别的第一检测点和用于识别的第二检测点。结果，消除了当识别用于凸块形成的IC的位置时用于检测IC的倾斜度的识别操作。与传统技术相比，执行识别的次数减少，从而可以提高生产率。

6. 发明授权

US06818975B1 ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE 失效
标题翻译：电荷生成半导体基板保存形成装置的方法，从电荷产生电子基板去除电荷的方法，用于从电荷产生半导体基板去除电荷和电荷产生半导体基板
公开(公告)号：US06818975B1
公开(公告)日：2004-11-16
申请号：US10019700
申请日：2002-01-02
申请人： Shoriki Narita , Yasutaka Tsuboi , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama
发明人： Shoriki Narita , Yasutaka Tsuboi , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama
IPC分类号： H01L2302
CPC分类号： H01L21/67144 , H01L21/67138
摘要： The present invention provides a bump forming apparatus (101, 501) which can prevent charge appearance semiconductor substrates (201, 202) from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer (202) because of the cooling is removed through direct contact with a post-forming bumps heating device (170), or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.
摘要翻译：本发明提供一种可防止电荷外观半导体衬底（201,202）发生热释电和物理故障的凸块形成装置（101,501），用于去除电荷外观半导体衬底的电荷的凸块形成装置执行的方法，用于电荷外观半导体衬底的电荷去除单元和电荷外观半导体衬底。至少当在晶片上连接凸起接合之后晶片被冷却时，由于冷却而积聚在晶片（202）上的电荷通过与后成形凸块加热装置（170）直接接触而被去除，或者电荷通过降低温度控制来去除，从而可以在非接触状态下去除电荷。因此，与传统技术相比，可以减少晶片的电荷量，从而防止晶片对晶片本身的热释电和损坏（例如断裂等）。

7. 发明授权

US07052984B2 Bump formation method and bump forming apparatus for semiconductor wafer 失效
公开(公告)号：US07052984B2
公开(公告)日：2006-05-30
申请号：US10415587
申请日：2001-11-16
申请人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
发明人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
IPC分类号： H01L21/44
CPC分类号： H01L23/544 , B23K20/007 , H01L24/11 , H01L24/12 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/45144 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.

8. 发明申请

US20120257043A1 COMPONENT MOUNTING APPARATUS, ILLUMINATING APPARATUS USED IN IMAGING AND ILLUMINATING METHOD 有权
标题翻译：组件安装设备，成像和照明方法中使用的照明设备
公开(公告)号：US20120257043A1
公开(公告)日：2012-10-11
申请号：US13516843
申请日：2011-08-04
申请人： Yasutaka Tsuboi , Toshihiko Tsujikawa , Ken Ishimatsu
发明人： Yasutaka Tsuboi , Toshihiko Tsujikawa , Ken Ishimatsu
IPC分类号： H04N7/18
CPC分类号： H05K13/0413 , H05K13/0812
摘要： A component mounting apparatus, an illuminating apparatus used in imaging in the component mounting apparatus and an illuminating method are provided which can support various recognition objects and can meet the requirement of downsizing by reducing the occupied space. In the component mounting apparatus which performs an operation for mounting a component on a board (3), when illumination light is irradiated to the board (3) at the time of imaging with a board recognition camera (12), and when the illumination light is irradiated from a light emitting panel (15) which is formed by laminating a light source portion (13) and a color liquid crystal panel (14) and in which a plurality of light emitting portions whose light emission states can be individually changed are orderly arranged, the irradiation range of the illumination light which is irradiated from the respective light emitting portions are made to be changed on the basis of the imaging object. Therefore, while the imaging can be made on conditions suitably corresponding to various recognition objects, the requirement of downsizing can be met by reducing the occupied space of an illuminating portion (20).
摘要翻译：提供了一种部件安装装置，用于部件安装装置成像的照明装置和照明方法，其可以支持各种识别对象，并且可以通过减少占用空间来满足小型化的要求。在将部件安装在基板（3）上的部件安装装置中，在利用基板识别照相机（12）成像时照明光照射到基板（3）时，当照明光从通过层叠光源部（13）和彩色液晶面板（14）而形成的发光面板（15）照射，并且其中可以单独改变发光状态的多个发光部分是有序的基于成像对象，使从各个发光部照射的照明光的照射范围变化。因此，通过适当地对应于各种识别对象的条件进行成像，可以通过减少照明部（20）的占用空间来满足小型化的要求。

9. 发明申请

US20060102701A1 Bump formation method and bump forming apparatus for semiconductor wafer 失效
公开(公告)号：US20060102701A1
公开(公告)日：2006-05-18
申请号：US11317146
申请日：2005-12-27
申请人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
发明人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
IPC分类号： B23K31/02 , B23Q15/00 , B23K13/08 , B23K31/00
CPC分类号： H01L23/544 , B23K20/007 , H01L24/11 , H01L24/12 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/45144 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.

10. 发明授权

US06542238B1 Electronic component mounting apparatus 失效
标题翻译：电子元件安装装置
公开(公告)号：US06542238B1
公开(公告)日：2003-04-01
申请号：US09622825
申请日：2000-10-12
申请人： Yasutaka Tsuboi , Kazuyuki Nakano , Shozo Fukuda
发明人： Yasutaka Tsuboi , Kazuyuki Nakano , Shozo Fukuda
IPC分类号： G01B1100
CPC分类号： G01N21/8806 , H05K13/08
摘要： An electronic component mounting apparatus (1) includes a device for illuminating a mark (9) on a printed circuit board (14) for recognition. The illumination device (10) includes a light path adjustable member (5). This light path adjustable member (5) is disposed between an illumination source unit (2) and the object (9) to be illuminated. At least one of the light incidence side and the emission side of the light path adjustable member (5) is divided into a plurality of subareas (6), (7), (8), each having a different index of refraction. Each of the subareas (6), (7), (8) emits light at a respective different index of refraction. The emitted light can be collected on a specific area containing the object (9), and appropriate illumination light can thus be emitted to the object (9).
摘要翻译：电子部件安装装置（1）包括用于照亮印刷电路板（14）上用于识别的标记（9）的装置。照明装置（10）包括光路可调节部件（5）。该光路可调节构件（5）设置在照明源单元（2）和要照明的物体（9）之间。光路可调部件（5）的光入射侧和发射侧中的至少一个被分成多个分区（6），（7），（8），每个分区具有不同的折射率。每个子区域（6），（7），（8）以相应的不同折射率发光。发射的光可以被收集在包含物体（9）的特定区域上，并且适当的照明光可以被发射到物体（9）。

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