专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06707289B2 Method and apparatus for automatic registration for a board 失效
标题翻译：板自动注册方法和装置
公开(公告)号：US06707289B2
公开(公告)日：2004-03-16
申请号：US10310779
申请日：2002-12-06
申请人： Satoshi Yamauchi , Toshihiko Tsujikawa , Masayuki Kajiyama , Suehiro Tanaka
发明人： Satoshi Yamauchi , Toshihiko Tsujikawa , Masayuki Kajiyama , Suehiro Tanaka
IPC分类号： G01R1512
CPC分类号： G01N21/95607 , G01N2021/95638
摘要： A high-precision inspection apparatus and method for inspecting a large board with a line sensor camera, the coordinate positions of correction marks on a pair of holding members are read by the camera and compared with predetermined coordinates, and an amount of positional discrepancy of the board is computed. The board is adjusted according to the positional discrepancy, if necessary, and then scanned.
摘要翻译：一种用线检测摄像机检查大型板的高精度检查装置和方法，通过照相机读取一对保持构件上的校正标记的坐标位置，并与预定坐标进行比较，并且与板计算。如果需要，根据位置差异对板进行调整，然后进行扫描。

2. 发明授权

US6167149A Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component 失效
标题翻译：在电子元件的安装线中检查奶油焊膏的部件或打印状态的状态
公开(公告)号：US6167149A
公开(公告)日：2000-12-26
申请号：US327555
申请日：1999-06-08
申请人： Toshihiko Tsujikawa , Seiji Mizuoka , Masao Nagamoto
发明人： Toshihiko Tsujikawa , Seiji Mizuoka , Masao Nagamoto
IPC分类号： G06T7/00 , H05K1/02 , H05K3/12 , G06K9/00
CPC分类号： G06T7/0006 , G06T7/70 , G06T2207/30141 , G06T2207/30152 , H05K1/0269 , H05K3/1233 , H05K2203/163 , H05K2203/167
摘要： An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted on a printed circuit board by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective. The inspecting apparatus includes an input device for taking data of the mounting state of the component to be inspected or the printing state of the cream solder to be inspected, a comparing device for comparing the data of the mounting state or the printing state input through the input device with an absolute decision criterion having a predetermined allowable range to decide whether the mounting state or the printing state is non-defective or defective and an operating state criterion which is within and narrower than the allowable range of the absolute decision criterion, and a deciding device for deciding an operating state of the mounting apparatus or the cream solder printing apparatus in the precedent process based data within the absolute decision criterion and outside the operating state criterion. An automatic position setting device is operable for setting a relative position of a metal mask and the printed circuit board. Further, a method for inspecting printing states of cream solders includes setting a window in a picked up image, performing color extraction of an element within the window and detecting predetermined patterns, calculating positions and/or areas of the elements, and deciding a defective or nondefective state by comparing the calculated position and/or area with respective reference data.
摘要翻译：检查装置设置在电子部件安装线上，用于通过在先前的处理中的安装装置或通过膏状焊料印刷装置的膏状焊料的印刷状态来检查安装在印刷电路板上的部件的安装状态先例是无缺陷或有缺陷的。检查装置包括用于获取要检查的部件的安装状态的数据或要检查的膏状焊料的打印状态的数据的输入装置，用于比较安装状态的数据或通过具有绝对决定标准的输入装置，具有预定的允许范围，以决定安装状态或打印状态是否为缺陷或缺陷;以及操作状态标准，该操作状态标准在绝对判定标准的允许范围内并且窄于绝对判定标准的允许范围; 决定装置，用于在所述绝对决定准则内和所述操作状态标准之外的先前处理的数据中确定所述安装装置或所述膏状焊料印刷装置的操作状态。自动位置设定装置可操作用于设定金属掩模和印刷电路板的相对位置。此外，用于检查奶油焊料的打印状态的方法包括设置拾取图像中的窗口，执行窗口内的元素的颜色提取并检测预定图案，计算元素的位置和/或区域，以及确定缺陷或通过将计算的位置和/或面积与相应的参考数据进行比较来获得非缺陷状态。

3. 发明授权

US5555316A Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component 失效
标题翻译：在电子元件的安装线中检查奶油焊膏的部件或打印状态的状态
公开(公告)号：US5555316A
公开(公告)日：1996-09-10
申请号：US83700
申请日：1993-06-30
申请人： Toshihiko Tsujikawa , Seiji Mizuoka , Masao Nagamoto
发明人： Toshihiko Tsujikawa , Seiji Mizuoka , Masao Nagamoto
IPC分类号： G06T7/00 , H05K1/02 , H05K3/12 , G06K9/00
CPC分类号： G06T7/0006 , H05K3/1233 , G06T2207/30141 , G06T2207/30152 , H05K1/0269 , H05K2203/163 , H05K2203/167
摘要： An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective. The inspecting apparatus includes an input device for taking data of the mounting state of the component to be inspected or the printing state of the cream solder to be inspected, a comparing device for comparing the data of the mounting state or the printing state input through the input device with an absolute decision criterion having a predetermined allowable range to decide whether the mounting state or the printing state is non-defective or defective and an operating state criterion which is within and narrower than the allowable range of the absolute decision criterion and a deciding device for deciding an operating state of the mounting apparatus or the cream solder printing apparatus in the precedent process based the data which is both within the absolute decision criterion and outside the operating state criterion.
摘要翻译：检查装置设置在电子部件安装线上，用于检查先前处理中的由前述处理中的安装装置安装的部件的安装状态或通过膏状焊料印刷装置的膏状焊料的印刷状态是否为非先进工序，有缺陷或缺陷。检查装置包括用于获取要检查的部件的安装状态的数据或要检查的膏状焊膏的打印状态的数据的输入装置，用于比较安装状态的数据或通过具有绝对决定标准的输入装置，具有预定的允许范围，以决定安装状态或打印状态是否为缺陷或缺陷;以及操作状态标准，该操作状态标准在绝对判定标准的允许范围内且小于绝对判定标准该装置用于基于绝对决定标准和操作状态标准之外的数据来确定先前处理中的安装装置或膏状焊料印刷装置的操作状态。

4. 发明授权

US08300921B2 Inspection apparatus and inspection method 失效
标题翻译：检验仪器和检验方法
公开(公告)号：US08300921B2
公开(公告)日：2012-10-30
申请号：US12863776
申请日：2009-01-21
申请人： Takashi Iwahashi , Toshihiko Tsujikawa , Atsushi Katayama
发明人： Takashi Iwahashi , Toshihiko Tsujikawa , Atsushi Katayama
IPC分类号： G05B19/18 , G06K9/00 , G03H1/26
CPC分类号： G01B11/002
摘要： An object of the present invention is to provide an inspection apparatus and an inspection method for precisely detecting an amount of misalignment of a component mounted on a panel through an adhesive which contains conductive particles. An inspection apparatus according to an implementation of the present invention detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an ACF. The inspection apparatus includes: an infrared light illuminator which illuminates with an infrared light a panel recognition mark and a component recognition mark, the panel recognition mark being formed on the surface of the panel, and the component recognition mark being formed on a surface of the component; an IR camera which is provided opposite the infrared light illuminator in relation to the panel, and captures an image of the panel recognition mark and an image of the component recognition mark which are illuminated with the infrared light; and an amount of misalignment calculation unit which calculates, using the images captured by the IR camera, an amount of misalignment in a positional relationship between the panel recognition mark and the component recognition mark from a predetermined positional relationship, and an optical axis of the infrared light illuminator is inclined with respect to a normal found on the surfaces of the panel or the component.
摘要翻译：本发明的目的是提供一种通过包含导电颗粒的粘合剂精确检测安装在面板上的部件的未对准量的检查装置和检查方法。根据本发明的实施方式的检查装置通过ACF检测从安装在面板表面上的部件的预定安装位置的未对准量。检查装置包括：红外光照射器，其用红外光照射面板识别标记和部件识别标记，面板识别标记形成在面板的表面上，并且部件识别标记形成在面板识别标记的表面上零件; 红外线摄像机，其相对于面板与红外光照射器相对设置，并且捕获面板识别标记的图像和被红外光照射的部件识别标记的图像; 以及一定量的未对准计算单元，其计算使用由所述IR摄像机拍摄的图像，从所述面板识别标记和所述构件识别标记之间的位置关系的预定位置关系中的未对准量和所述红外线光照射器相对于在面板或部件的表面上发现的正常倾斜。

5. 发明申请

US20120257043A1 COMPONENT MOUNTING APPARATUS, ILLUMINATING APPARATUS USED IN IMAGING AND ILLUMINATING METHOD 有权
标题翻译：组件安装设备，成像和照明方法中使用的照明设备
公开(公告)号：US20120257043A1
公开(公告)日：2012-10-11
申请号：US13516843
申请日：2011-08-04
申请人： Yasutaka Tsuboi , Toshihiko Tsujikawa , Ken Ishimatsu
发明人： Yasutaka Tsuboi , Toshihiko Tsujikawa , Ken Ishimatsu
IPC分类号： H04N7/18
CPC分类号： H05K13/0413 , H05K13/0812
摘要： A component mounting apparatus, an illuminating apparatus used in imaging in the component mounting apparatus and an illuminating method are provided which can support various recognition objects and can meet the requirement of downsizing by reducing the occupied space. In the component mounting apparatus which performs an operation for mounting a component on a board (3), when illumination light is irradiated to the board (3) at the time of imaging with a board recognition camera (12), and when the illumination light is irradiated from a light emitting panel (15) which is formed by laminating a light source portion (13) and a color liquid crystal panel (14) and in which a plurality of light emitting portions whose light emission states can be individually changed are orderly arranged, the irradiation range of the illumination light which is irradiated from the respective light emitting portions are made to be changed on the basis of the imaging object. Therefore, while the imaging can be made on conditions suitably corresponding to various recognition objects, the requirement of downsizing can be met by reducing the occupied space of an illuminating portion (20).
摘要翻译：提供了一种部件安装装置，用于部件安装装置成像的照明装置和照明方法，其可以支持各种识别对象，并且可以通过减少占用空间来满足小型化的要求。在将部件安装在基板（3）上的部件安装装置中，在利用基板识别照相机（12）成像时照明光照射到基板（3）时，当照明光从通过层叠光源部（13）和彩色液晶面板（14）而形成的发光面板（15）照射，并且其中可以单独改变发光状态的多个发光部分是有序的基于成像对象，使从各个发光部照射的照明光的照射范围变化。因此，通过适当地对应于各种识别对象的条件进行成像，可以通过减少照明部（20）的占用空间来满足小型化的要求。

6. 发明授权

US07850800B2 Bonding sheet applying apparatus and method 有权
标题翻译：粘合片施加装置和方法
公开(公告)号：US07850800B2
公开(公告)日：2010-12-14
申请号：US11911164
申请日：2006-11-14
申请人： Tetsuro Ueno , Toshihiko Tsujikawa
发明人： Tetsuro Ueno , Toshihiko Tsujikawa
IPC分类号： B32B41/00
CPC分类号： H05K13/0469 , G02F1/1303 , G02F1/1345 , G02F2202/28 , H05K3/323
摘要： A bonding sheet applying apparatus of the present invention includes an applying stage for supporting a board, an applying unit having a bonding-sheet supplying device for supplying a bonding sheet to above the board supported by the applying stage and an applying head provided above the board so as to be movable up and down, for sequentially pressing the bonding sheet supplied by the bonding-sheet supplying device on a plurality of applying positions arranged on the board, a transfer device for transferring the applying unit, which has completed a bonding sheet applying operation for one of the applying positions, to a position upward above another applying position at which a bonding sheet applying operation has not been completed, and an inspection device for inspecting an applied state of the bonding sheet which has already been applied by the applying unit, while the applying unit is successively performing the bonding sheet applying operations.
摘要翻译：本发明的粘合片施加装置包括：用于支撑板的施加台，具有用于将粘合片供给到由施加台支撑的板上方的接合片供给装置的施加单元和设置在板上方的施加头为了顺序地将粘合片供给装置供给的粘合片依次按压在布置在基板上的多个施加位置上，用于转印施加单元的转印装置，该转印装置已经完成了施加的粘合片对于施加位置中的一个的操作，到达粘合片施加操作尚未完成的另一施加位置上方的位置，以及用于检查由施加单元施加的粘合片的施加状态的检查装置同时施加单元依次执行粘合片施加操作。

7. 发明授权

US07708848B2 Component bonding method and component bonding device 有权
标题翻译：部件接合方法和部件接合装置
公开(公告)号：US07708848B2
公开(公告)日：2010-05-04
申请号：US12280705
申请日：2007-02-28
申请人： Toshihiko Tsujikawa , Hiroshi Uchiyama , Akira Yamada , Takashi Iwahashi
发明人： Toshihiko Tsujikawa , Hiroshi Uchiyama , Akira Yamada , Takashi Iwahashi
IPC分类号： H01J9/18 , G06F19/00
CPC分类号： G02F1/13452 , H05K1/0269 , H05K3/323 , H05K3/361 , H05K2201/09918 , H05K2203/0195 , H05K2203/0278 , H05K2203/166
摘要： Provided is a component bonding method with higher bonding precision in a process of bonding an electrode of a component to an electrode formed on a flat panel. A preliminary press bonding device includes: a control unit which includes a position displacement amount correction unit to which a position displacement amount after the press bonding process is fed back and which corrects the position displacement on the next component to be preliminarily bonded; and a component position determining unit which determines a position of the component using the fed back correction amount. On the other hand, a press bonding device includes a bonding recognition device for use in the recognition of positions of the electrodes on the flat panel and the component. The bonding recognition device includes a position displacement amount calculating unit which calculates the position displacement amount based on the recognized position information.
摘要翻译：提供了在将部件的电极与形成在平板上的电极接合的过程中具有更高的结合精度的部件接合方法。初步压接装置包括：控制单元，包括位置偏移量校正单元，压接过程之后的位置偏移量反馈到位置偏移量校正单元，并且校正要预先粘合的下一个分量的位置偏移; 以及分量位置确定单元，其使用所述反馈校正量来确定所述分量的位置。另一方面，压接装置包括用于识别电极在平板和部件上的位置的接合识别装置。接合识别装置包括位置偏移量计算单元，其基于识别的位置信息来计算位置偏移量。

8. 发明授权

US6081613A System for inspecting an appearance of a printed circuit board 失效
公开(公告)号：US6081613A
公开(公告)日：2000-06-27
申请号：US518812
申请日：1995-08-24
申请人： Kazuhiro Ikurumi , Masanori Yasutake , Osamu Nakao , Masaharu Tsujimura , Toshihiko Tsujikawa , Kenji Okamoto
发明人： Kazuhiro Ikurumi , Masanori Yasutake , Osamu Nakao , Masaharu Tsujimura , Toshihiko Tsujikawa , Kenji Okamoto
IPC分类号： G01N21/88 , G01N21/956 , G01R31/28 , G01R31/309 , G06T7/00 , H05K3/00 , H05K13/08 , G06K9/00
CPC分类号： G06T7/001 , G01R31/309 , G01R31/2813 , G06T2207/30141
摘要： A motion of a printed circuit board (1) is detected by an encoder (4) arranged aside a belt conveyer (2), and the encoder generates a detection signal (S.sub.3) which activates a timing signal generator unit (5) for generating an image pickup start timing signal which is fed to a time measuring unit (6) for measuring the image storing time which corresponds to the time interval of the image pickup start signal (S1). According to the image storing time, the image signal (S2) generated by the line CCD camera (3) is normalized by the normalizing calculation means (7), and thereafter, the mounting condition of the printed circuit board is judged by the image recognizing section (B) with the use of the image data (D) to thereby realize a simple and convenient mechanism at a low cost and at a high precision.

9. 发明申请

US20090065120A1 BONDING SHEET APPLYING APPARATUS AND METHOD 有权
标题翻译：应用装置和方法的粘结片
公开(公告)号：US20090065120A1
公开(公告)日：2009-03-12
申请号：US11911164
申请日：2006-11-14
申请人： Tetsuro Ueno , Toshihiko Tsujikawa
发明人： Tetsuro Ueno , Toshihiko Tsujikawa
IPC分类号： B32B38/00
CPC分类号： H05K13/0469 , G02F1/1303 , G02F1/1345 , G02F2202/28 , H05K3/323
摘要： A bonding sheet applying apparatus of the present invention includes an applying stage for supporting a board, an applying unit having a bonding-sheet supplying device for supplying a bonding sheet to above the board supported by the applying stage and an applying head provided above the board so as to be movable up and down, for sequentially pressing the bonding sheet supplied by the bonding-sheet supplying device on a plurality of applying positions arranged on the board, a transfer device for transferring the applying unit, which has completed a bonding sheet applying operation for one of the applying positions, to a position upward above another applying position at which a bonding sheet applying operation has not been completed, and an inspection device for inspecting an applied state of the bonding sheet which has already been applied by the applying unit, while the applying unit is successively performing the bonding sheet applying operations.
摘要翻译：本发明的粘合片施加装置包括：用于支撑板的施加台，具有用于将粘合片供给到由施加台支撑的板上方的接合片供给装置的施加单元和设置在板上方的施加头为了顺序地将粘合片供给装置供给的粘合片依次按压在布置在基板上的多个施加位置上，用于转印施加单元的转印装置，该转印装置已经完成了施加的粘合片对于施加位置中的一个的操作，到达粘合片施加操作尚未完成的另一施加位置上方的位置，以及用于检查由施加单元施加的粘合片的施加状态的检查装置同时施加单元依次执行粘合片施加操作。

10. 发明授权

US09036022B2 Component mounting apparatus, illuminating apparatus used in imaging and illuminating method 有权
标题翻译：组件安装装置，成像和照明方法中使用的照明装置
公开(公告)号：US09036022B2
公开(公告)日：2015-05-19
申请号：US13516843
申请日：2011-08-04
申请人： Yasutaka Tsuboi , Toshihiko Tsujikawa , Ken Ishimatsu
发明人： Yasutaka Tsuboi , Toshihiko Tsujikawa , Ken Ishimatsu
IPC分类号： H04N9/47 , H04N7/18 , G03B15/02 , H05K13/04
CPC分类号： H05K13/0413 , H05K13/0812
摘要： A component mounting apparatus, an illuminating apparatus used in imaging in the component mounting apparatus and an illuminating method are provided which can support various recognition objects and can meet the requirement of downsizing by reducing the occupied space. In the component mounting apparatus which performs an operation for mounting a component on a board (3), when illumination light is irradiated to the board (3) at the time of imaging with a board recognition camera (12), and when the illumination light is irradiated from a light emitting panel (15) which is formed by laminating a light source portion (13) and a color liquid crystal panel (14) and in which a plurality of light emitting portions whose light emission states can be individually changed are orderly arranged, the irradiation range of the illumination light which is irradiated from the respective light emitting portions are made to be changed on the basis of the imaging object. Therefore, while the imaging can be made on conditions suitably corresponding to various recognition objects, the requirement of downsizing can be met by reducing the occupied space of an illuminating portion (20).
摘要翻译：提供了一种部件安装装置，用于部件安装装置成像的照明装置和照明方法，其可以支持各种识别对象，并且可以通过减少占用空间来满足小型化的要求。在将部件安装在基板（3）上的部件安装装置中，在利用基板识别照相机（12）成像时照明光照射到基板（3）时，当照明光从通过层叠光源部（13）和彩色液晶面板（14）而形成的发光面板（15）照射，并且其中可以单独改变发光状态的多个发光部分是有序的基于成像对象，使从各个发光部照射的照明光的照射范围变化。因此，通过适当地对应于各种识别对象的条件进行成像，可以通过减少照明部（20）的占用空间来满足小型化的要求。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式