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    • 8. 发明申请
    • Plasma processing apparatus
    • 等离子体处理装置
    • US20070137575A1
    • 2007-06-21
    • US10578184
    • 2004-11-02
    • Tadahiro OhmiToshihisa NozawaOsamu MoritaTamaki YuasaKoji Kotani
    • Tadahiro OhmiToshihisa NozawaOsamu MoritaTamaki YuasaKoji Kotani
    • C23F1/00C23C16/00
    • H01J37/32192C23C16/4411C23C16/45572C23C16/511H01J37/3244H01J37/32724
    • The present invention has an object of improving the cooling efficiency of the process gas supply part of a plasma processor and thereby suppressing an increase in the temperature of the process gas supply part. Therefore, used in the present invention is a plasma processor having a processing vessel having a holder holding a substrate to be processed, a microwave antenna provided on the processing vessel so as to oppose the substrate to be processed, and a processing gas supply part provided between the substrate to be processed on the holder and the microwave antenna so as to oppose the substrate to be processed, characterized in that the process gas supply part has multiple first openings through which plasma formed in the processing vessel passes, a process gas channel connectable to a process gas source, multiple second openings communicating with the process gas channel, and a cooling medium channel through which a cooling medium cooling the process gas supply part flows, wherein the cooling medium includes mist.
    • 本发明的目的是提高等离子体处理器的处理气体供给部的冷却效率,从而抑制处理气体供给部的温度上升。 因此,本发明中使用的是具有处理容器的等离子体处理容器,该处理容器具有保持待处理基板的保持器,设置在处理容器上的与要处理的基板相对的微波天线,以及设置有处理气体供给部 在待加工的基板与微波天线之间,以与待处理的基板相对,其特征在于,处理气体供给部具有多个第一开口,处理容器中形成的等离子体通过该第一开口,可连接的处理气体通道 处理气体源,与处理气体通道连通的多个第二开口以及冷却介质通道,冷却介质冷却工艺气体供应部分,冷却介质包括雾。