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1. 发明申请

US20070137575A1 Plasma processing apparatus 审中-公开
标题翻译：等离子体处理装置
公开(公告)号：US20070137575A1
公开(公告)日：2007-06-21
申请号：US10578184
申请日：2004-11-02
申请人： Tadahiro Ohmi , Toshihisa Nozawa , Osamu Morita , Tamaki Yuasa , Koji Kotani
发明人： Tadahiro Ohmi , Toshihisa Nozawa , Osamu Morita , Tamaki Yuasa , Koji Kotani
IPC分类号： C23F1/00 , C23C16/00
CPC分类号： H01J37/32192 , C23C16/4411 , C23C16/45572 , C23C16/511 , H01J37/3244 , H01J37/32724
摘要： The present invention has an object of improving the cooling efficiency of the process gas supply part of a plasma processor and thereby suppressing an increase in the temperature of the process gas supply part. Therefore, used in the present invention is a plasma processor having a processing vessel having a holder holding a substrate to be processed, a microwave antenna provided on the processing vessel so as to oppose the substrate to be processed, and a processing gas supply part provided between the substrate to be processed on the holder and the microwave antenna so as to oppose the substrate to be processed, characterized in that the process gas supply part has multiple first openings through which plasma formed in the processing vessel passes, a process gas channel connectable to a process gas source, multiple second openings communicating with the process gas channel, and a cooling medium channel through which a cooling medium cooling the process gas supply part flows, wherein the cooling medium includes mist.
摘要翻译：本发明的目的是提高等离子体处理器的处理气体供给部的冷却效率，从而抑制处理气体供给部的温度上升。因此，本发明中使用的是具有处理容器的等离子体处理容器，该处理容器具有保持待处理基板的保持器，设置在处理容器上的与要处理的基板相对的微波天线，以及设置有处理气体供给部在待加工的基板与微波天线之间，以与待处理的基板相对，其特征在于，处理气体供给部具有多个第一开口，处理容器中形成的等离子体通过该第一开口，可连接的处理气体通道处理气体源，与处理气体通道连通的多个第二开口以及冷却介质通道，冷却介质冷却工艺气体供应部分，冷却介质包括雾。

2. 发明申请

US20070163502A1 Substrate processing apparatus 审中-公开
标题翻译：基板加工装置
公开(公告)号：US20070163502A1
公开(公告)日：2007-07-19
申请号：US10585408
申请日：2004-12-24
申请人： Toshihisa Nozawa , Osamu Morita , Tamaki Yuasa , Koji Kotani
发明人： Toshihisa Nozawa , Osamu Morita , Tamaki Yuasa , Koji Kotani
IPC分类号： C23C16/00 , C23C14/00 , B05C11/00
CPC分类号： H01L21/67109 , C23C16/4411 , H01J37/32522 , H01L21/67069
摘要： In a substrate processing apparatus for processing a substrate for manufacturing a semiconductor device, a mist passage (5) is formed to pass through a part of a processing vessel (2) as an object to be cooled. There are disposed a mist generator (64) that generates a mist, and a gas supply source (62) that supplies a carrier gas for carrying the generated mist. A temperature of the part to be cooled is detected by a temperature sensor (49). When the detected temperature exceeds a predetermined temperature, a water mist, for example, is allowed to flow into the mist passage so as to cool the processing vessel by a heat of evaporation of the mist. Thus, the temperature of the processing vessel can be promptly lowered, and thus a plasma process can be performed under an atmosphere of a stable temperature.
摘要翻译：在用于制造半导体器件用基板的基板处理装置中，形成有通过作为待冷却对象的处理容器（2）的一部分的雾通路（5）。设置有产生雾气的雾化器（64）和供给用于承载所产生的雾的载气的气体供给源（62）。待冷却部件的温度由温度传感器（49）检测。当检测到的温度超过预定温度时，例如允许水雾流入雾气通道，以便通过雾气的蒸发热来冷却处理容器。因此，能够迅速降低处理容器的温度，能够在稳定的温度的气氛下进行等离子体处理。

3. 发明授权

US08567908B2 Liquid supply member, manufacturing method of liquid supply member, liquid discharge head, and manufacturing method of liquid discharge head 有权
标题翻译：液体供给部件，供液部件的制造方法，排液头以及排液头的制造方法
公开(公告)号：US08567908B2
公开(公告)日：2013-10-29
申请号：US12898197
申请日：2010-10-05
申请人： Kiyomitsu Kudo , Osamu Morita
发明人： Kiyomitsu Kudo , Osamu Morita
IPC分类号： B41J2/135 , B41J2/175
CPC分类号： B41J2/17559 , B29C65/08 , B29C65/1635 , B29C66/112 , B29C66/114 , B29C66/3022 , B29C66/543 , B29C66/547 , B29C66/5472 , B29C66/73161 , B29C66/836 , B29K2995/0027 , B29L2031/7678 , B41J2/17513
摘要： A liquid supply member for supplying a liquid to a liquid discharge head having a discharge port which discharges a liquid, includes: a first member consisting of a resin material; a second member consisting of a resin material; and a supply path formed by joining the first member and the second member to each other, the supplying path supplying a liquid to the liquid discharge head, wherein at least a part of an internal surface of the supply path is a smooth surface smoothed by melting the resin after being molded.
摘要翻译：一种用于将液体供给到具有排出液体的排出口的液体排放头的液体供应构件，包括：由树脂材料构成的第一构件; 由树脂材料构成的第二构件; 以及通过将所述第一构件和所述第二构件彼此接合而形成的供给路径，所述供给路径向所述排液头供给液体，所述供给路径的内表面的至少一部分是通过熔融而平滑的平滑表面模塑后的树脂。

4. 发明申请

US20130243453A1 IMAGE FORMING APPARATUS AND METHOD OF CONTROLLING THE SAME 有权
标题翻译：图像形成装置及其控制方法
公开(公告)号：US20130243453A1
公开(公告)日：2013-09-19
申请号：US13836197
申请日：2013-03-15
申请人： Takayuki Horie , Hideaki Hayashi , Masashi Saito , Hideki Hadano , Osamu Morita , Satoru Yoneda
发明人： Takayuki Horie , Hideaki Hayashi , Masashi Saito , Hideki Hadano , Osamu Morita , Satoru Yoneda
IPC分类号： G03G15/00 , G03G21/00
CPC分类号： G03G21/20 , G03G21/206
摘要： An image forming apparatus has an outline surrounded by a casing. The casing has an opening. The image forming apparatus includes a fixing unit configured to fix an image formed on a recording medium, and a control unit. The fixing unit includes a heating fixing member. The control unit is configured to control an opening degree of the opening based on temperature of a surface of or in the vicinity of the heating fixing member, so as to prevent emission of a substance by an air current to outside of the casing through the opening, during an image forming operation.
摘要翻译：图像形成装置具有由壳体包围的轮廓。外壳有开口。图像形成装置包括：固定单元，被配置为固定形成在记录介质上的图像;以及控制单元。定影单元包括加热固定构件。控制单元被配置为基于加热固定构件的表面或其附近的温度来控制开口的开度，以防止物质通过气流通过开口向壳体的外部发射，在图像形成操作期间。

5. 发明授权

US08430490B2 Ink jet printing apparatus 有权
标题翻译：喷墨打印设备
公开(公告)号：US08430490B2
公开(公告)日：2013-04-30
申请号：US12419091
申请日：2009-04-06
申请人： Osamu Morita
发明人： Osamu Morita
IPC分类号： B41J2/19 , B41J2/175 , B41J2/17
CPC分类号： B41J2/175 , B41J2/17596
摘要： An air pump is driven to supply air via an air supply tube to a sub tank, by which a predetermined quantity of the air is mixed inside the sub tank via a gas-liquid separation membrane. Next, a carriage is swayed to agitate the ink by using the air mixed inside the sub tank. Then, the air pump is driven to discharge the air inside the sub tank via the gas-liquid separation membrane. In the above-described agitating motions, since the air utilized for the agitation is discharged from an ink tank after agitation processing, it is possible to prevent the air from remaining inside the ink tank to inflate, thereby adversely influencing the pressure relationship with a printing head.
摘要翻译：驱动空气泵通过空气供给管向副罐供给空气，通过该副罐将预定量的空气经由气液分离膜混入副罐内。接下来，通过使用混合在副罐内的空气来摇动滑架来搅动墨。然后，驱动气泵，经由气液分离膜排出副罐内的空气。在上述搅拌运动中，由于用于搅拌的空气在搅拌处理之后从墨罐中排出，所以可以防止空气残留在墨罐内而膨胀，从而不利地影响与打印的压力关系头。

6. 发明申请

US20120267048A1 PLASMA PROCESSING APPARATUS 有权
标题翻译：等离子体加工设备
公开(公告)号：US20120267048A1
公开(公告)日：2012-10-25
申请号：US13454513
申请日：2012-04-24
申请人： Kazuki Moyama , Kiyotaka Ishibashi , Osamu Morita , Takehiro Tanikawa , Naoki Matsumoto , Naoki Mihara , Wataru Yoshikawa
发明人： Kazuki Moyama , Kiyotaka Ishibashi , Osamu Morita , Takehiro Tanikawa , Naoki Matsumoto , Naoki Mihara , Wataru Yoshikawa
IPC分类号： B05C5/00
CPC分类号： H01J37/32192 , H01J37/32229 , H01J37/3244
摘要： A plasma processing apparatus includes a processing chamber, a stage, a dielectric member, a microwave introduction device, an injector, and an electric field shield. The processing chamber has a processing space therein. The stage is provided within the processing chamber. The dielectric member has a through hole and is provided to face the stage. The microwave introduction device is configured to introduce microwave into the processing space via the dielectric member. The injector has at least one through hole and is made of a dielectric material, e.g., a bulk dielectric material. The injector is provided within the dielectric member. The injector and the through hole of the dielectric member form a path for supplying a processing gas into the processing space. The electric field shield encloses the injector.
摘要翻译：等离子体处理装置包括处理室，载物台，电介质构件，微波引入装置，注射器和电场屏蔽。处理室在其中具有处理空间。工作台设置在处理室内。电介质构件具有通孔并且设置成面向台。微波引入装置经由电介质构件将微波引入处理空间。喷射器具有至少一个通孔，并且由介电材料制成，例如大体电介质材料。喷射器设置在电介质构件内。介电构件的注射器和通孔形成用于将处理气体供应到处理空间的路径。电场屏蔽封闭注射器。

7. 发明申请

US20120160809A1 PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：等离子体处理装置和基板处理方法
公开(公告)号：US20120160809A1
公开(公告)日：2012-06-28
申请号：US13391310
申请日：2010-08-16
申请人： Kiyotaka Ishibashi , Osamu Morita
发明人： Kiyotaka Ishibashi , Osamu Morita
IPC分类号： B44C1/22 , H01L21/3065 , H05H1/46 , C23C16/511
CPC分类号： H01J37/32192 , C23C16/455 , C23C16/511 , H01J37/3222 , H01J37/32229 , H01J37/3244 , H05H1/46 , H05H2001/463
摘要： A microwave supply unit 20 of a plasma processing apparatus 11 includes a stub member 51 configured to be extensible from the outer conductor 33 toward the inner conductor 32. The stub member 51 serves as a distance varying device for varying a distance in the radial direction between a part of the outer surface 36 of the inner conductor 32 and a facing member facing the part of the outer surface of the inner conductor 32 in the radial direction, i.e., the cooling plate protrusion 47. The stub member 51 includes a rod-shaped member 52 supported at the outer conductor 33 and configured to be extended in the radial direction; and a screw 53 as a moving distance adjusting member for adjusting a moving distance of the rod-shaped member 52 in the radial direction.
摘要翻译：等离子体处理装置11的微波供给单元20包括构造成可从外导体33向内导体32延伸的短截线构件51.短截线构件51用作变距装置，用于改变径向方向上的距离内导体32的外表面36的一部分和面向内径部分的内导体32的外表面的一部分的面对构件即冷却板突起47.短针构件51包括杆状构件52支撑在外导体33处并且构造成沿径向方向延伸; 以及作为用于调节棒状构件52在径向上的移动距离的移动距离调节构件的螺钉53。

8. 发明申请

US20110114207A1 LIQUID SUPPLY MEMBER, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD 失效
标题翻译：液体供应构件及其制造方法以及制造液体喷射头的方法
公开(公告)号：US20110114207A1
公开(公告)日：2011-05-19
申请号：US12905885
申请日：2010-10-15
申请人： Masaru Iketani , Osamu Morita
发明人： Masaru Iketani , Osamu Morita
IPC分类号： F15D1/00 , B23P17/00
CPC分类号： B41J2/1634 , B29C65/1616 , B29C65/1635 , B29C65/1664 , B29C65/1667 , B29C65/1677 , B29C65/1687 , B29C66/112 , B29C66/114 , B29C66/242 , B29C66/244 , B29C66/54 , B29C66/71 , B29C66/73921 , B29C66/8322 , B29L2031/767 , B41J2/16 , Y10T29/49401 , Y10T137/8593 , B29K2071/12
摘要： A method is provided for manufacturing a liquid supply member including a transmissive member and a transmissive member, one of which having a groove, and configured to supply liquid to a liquid ejection port. The method includes bringing the transmissive member and the absorptive member into contact, with the groove inside; forming a supply passage by radiating laser light, via the transmissive member, from a plurality of first laser light sources disposed along a longitudinal direction of the groove toward a first contact portion at a periphery of the groove to weld the transmissive member and the absorptive member; and radiating laser light, via the transmissive member, from a second laser light source provided in a vicinity of a laser light source at an end of the groove in the longitudinal direction toward a vicinity portion of the absorptive member.
摘要翻译：提供一种用于制造包括透射构件和透射构件的液体供应构件的方法，其中一个具有凹槽，并且构造成将液体供应到液体喷射口。该方法包括使透射构件和吸收构件与槽内接触; 通过所述透射构件从沿着所述凹槽的纵向方向设置的多个第一激光光源朝向所述凹槽的周边处的第一接触部分辐射激光以形成供应通道，以焊接所述透射构件和所述吸收构件 ; 并且经由所述透射构件从设置在所述凹槽的纵向方向上的激光光源附近的第二激光源朝向所述吸收部件的附近部分照射激光。

9. 发明申请

US20090263648A1 METHOD OF FORMING METAL OXIDE FILM, METAL OXIDE FILM AND OPTICAL ELECTRONIC DEVICE 审中-公开
标题翻译：形成金属氧化物膜，金属氧化物膜和光电子器件的方法
公开(公告)号：US20090263648A1
公开(公告)日：2009-10-22
申请号：US12090704
申请日：2006-10-18
申请人： Mitsuo Saitoh , Tomohiro Okumura , Osamu Morita
发明人： Mitsuo Saitoh , Tomohiro Okumura , Osamu Morita
IPC分类号： H05H1/00 , B32B9/00
CPC分类号： B32B9/04 , C01B13/32 , C03C17/25 , C03C2217/213 , C03C2218/322 , C23C8/02 , C23C8/36 , C23C16/402 , H01L21/02126 , H01L21/02131 , H01L21/02164 , H01L21/022 , H01L21/02282 , H01L21/0234 , H01L21/02359 , H01L21/31608 , Y10T428/265
摘要： A metal oxide film forming method includes mixing an organic metal compound that is a liquid at room temperature and an organic solvent to form a paste, applying the paste onto a substrate, and oxidizing a metal element in the paste while vaporizing organic substances in the paste by irradiating atmospheric pressure plasma to the paste applied onto the substrate to form a metal oxide film. A metal oxide film composed of three layers is formed on a substrate such as a glass substrate. Such a structure can be obtained by repeating the steps of mixing the organic metal compound that is a liquid at room temperature and the organic solvent to form the paste, applying the paste onto the substrate, and oxidizing the metal element while vaporizing the organic substances in the paste. Also contemplated is an optical electronic device using the metal oxide film.
摘要翻译：金属氧化物膜形成方法包括在室温下混合作为液体的有机金属化合物和有机溶剂以形成糊剂，将糊料施加到基材上，并且在糊料中氧化金属元素，同时蒸发糊料中的有机物质通过将大气压等离子体照射到施加到基板上的糊料以形成金属氧化物膜。在玻璃基板等基板上形成由三层构成的金属氧化膜。这样的结构可以通过重复以下步骤来获得：将室温下为液体的有机金属化合物和有机溶剂混合以形成糊料，将糊料施加到基材上，并将金属元素氧化，同时蒸发有机物质粘贴。还设想使用金属氧化物膜的光电子器件。

10. 发明申请

US20080053614A1 Surface Processing Apparatus 审中-公开
标题翻译：表面处理设备
公开(公告)号：US20080053614A1
公开(公告)日：2008-03-06
申请号：US11845135
申请日：2007-08-27
申请人： Yasumi Sago , Masayoshi Ikeda , Kazuaki Kaneko , Daisuke Kondo , Osamu Morita
发明人： Yasumi Sago , Masayoshi Ikeda , Kazuaki Kaneko , Daisuke Kondo , Osamu Morita
IPC分类号： C23F1/00 , C23C16/00 , H01L21/306
CPC分类号： C23C16/4557 , C23C16/45565 , C23C16/45572 , C23C16/5096 , H01J37/3244
摘要： A surface processing apparatus includes a process chamber including a gas ejection mechanism; an exhaust for exhausting the inside of said process chamber; and a gas supply for supplying a gas to the gas ejection mechanism. The gas ejection mechanism includes a a first gas distribution mechanism for distributing the gas into a cooling or heating mechanism, including a gas distribution plate placed in the frame member, the gas distribution plate having a plurality of holes that extend therethrough, the cooling or heating mechanism having multiple gas passages that extend therethrough, the plate having a number of outlets to eject the gas into the process chamber, wherein there are more outlets in the plate than there are gas passages, and the plate is fixed to a second gas distribution mechanism with a clamping member.
摘要翻译：表面处理装置包括：处理室，包括气体喷射机构; 用于排出所述处理室内部的废气; 以及用于向气体喷射机构供给气体的气体供给。气体喷射机构包括：第一气体分配机构，用于将气体分配到冷却或加热机构中，包括布置在框架构件中的气体分配板，气体分配板具有多个穿过其延伸的孔，冷却或加热机构具有延伸穿过其中的多个气体通道，所述板具有多个出口以将气体喷射到处理室中，其中板中的出口多于具有气体通道的多个出口，并且板被固定到第二气体分配机构，其具有夹紧构件。

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