专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5155906A Process for repairing circuit connections 失效
标题翻译：修复电路连接的过程
公开(公告)号：US5155906A
公开(公告)日：1992-10-20
申请号：US672110
申请日：1991-03-19
申请人： Yasushi Goto , Atsuo Nakajima , Isao Tsukagoshi , Tomohisa Ohta , Yutaka Yamaguchi
发明人： Yasushi Goto , Atsuo Nakajima , Isao Tsukagoshi , Tomohisa Ohta , Yutaka Yamaguchi
IPC分类号： H01R43/00 , H05K3/22 , H05K3/28 , H05K3/32 , H05K3/36
CPC分类号： H05K3/225 , H05K3/288 , H05K2203/0769 , H05K2203/0783 , H05K2203/176 , H05K3/321 , H05K3/361 , Y10T29/49155 , Y10T29/49721
摘要： Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.

2. 发明授权

US5120665A Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits 失效
标题翻译：使用具有压力可变电极性颗粒的电阻连接电路的均匀电极粘合剂的方法
公开(公告)号：US5120665A
公开(公告)日：1992-06-09
申请号：US671472
申请日：1991-03-19
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
IPC分类号： H01R4/04 , C09J163/00 , G06K19/077 , H01B1/00 , H01B1/20 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/482 , H01L23/498 , H05K3/32
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L23/49883 , H01L24/05 , H01L24/29 , H05K3/323 , H01L2224/0401 , H01L2224/05571 , H01L2224/274 , H01L2224/2919 , H01L2224/29339 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/82365 , H01L2224/83101 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/0106 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/15151 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321
摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

3. 发明授权

US6113728A Process for connecting circuits and adhesive film used therefor 失效
标题翻译：用于连接电路和粘合膜的方法
公开(公告)号：US6113728A
公开(公告)日：2000-09-05
申请号：US464118
申请日：1995-06-05
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L23/482 , H05K3/32 , B32B31/00 , C09J5/10
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L24/13 , H01L24/29 , H05K3/323 , H01L2224/13019 , H01L2224/16225 , H01L2224/274 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29399 , H01L2224/29499 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83136 , H01L2224/83191 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/15151 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321 , Y10T156/1075 , Y10T29/4913
摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.
摘要翻译：一种粘合膜，其包含（a）液体环氧树脂，（b）具有一个或多个官能团的固体树脂，（c）微胶囊型固化剂，并且如果需要（d）偶联剂，对于连接半导体芯片是有效的和加热和压力下的接线板。

4. 发明授权

US5843251A Process for connecting circuits and adhesive film used therefor 失效
公开(公告)号：US5843251A
公开(公告)日：1998-12-01
申请号：US853868
申请日：1992-03-20
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L23/482 , H05K3/32 , B32B31/00
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L24/13 , H01L24/29 , H05K3/323 , H01L2224/13019 , H01L2224/16225 , H01L2224/274 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29399 , H01L2224/29499 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83136 , H01L2224/83191 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/15151 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321 , Y10T156/1075 , Y10T29/4913
摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

5. 发明授权

US5001542A Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips 失效
标题翻译：用于电路连接的组合，使用其的连接方法以及半导体芯片的连接结构
公开(公告)号：US5001542A
公开(公告)日：1991-03-19
申请号：US443169
申请日：1989-11-30
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
IPC分类号： H01R4/04 , C09J163/00 , G06K19/077 , H01B1/00 , H01B1/20 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/482 , H01L23/498 , H05K3/32
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L23/49883 , H01L24/05 , H01L24/29 , H05K3/323 , H01L2224/0401 , H01L2224/05571 , H01L2224/274 , H01L2224/2919 , H01L2224/29339 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/82365 , H01L2224/83101 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/0106 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/15151 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321
摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

6. 发明授权

US4740657A Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained 失效
标题翻译：各向异性导电粘合剂组合物，使用其的电路的连接方法以及由此获得的连接的电路结构
公开(公告)号：US4740657A
公开(公告)日：1988-04-26
申请号：US13904
申请日：1987-02-12
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yoshikatsu Mikami , Kuniteru Muto , Yoshiyuki Ikezoe
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yoshikatsu Mikami , Kuniteru Muto , Yoshiyuki Ikezoe
IPC分类号： H01B1/22 , H01R4/04 , H05K3/32 , H05K3/36 , H01B1/16 , H01R43/00
CPC分类号： H01R4/04 , H01B1/22 , H05K3/323 , H01L2224/293 , H01L2224/29399 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/01019 , H01L2924/01079 , H05K2201/0221 , H05K2201/0233 , H05K2201/068 , H05K3/361 , Y10T29/49194
摘要： Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.

7. 发明授权

US4731282A Anisotropic-electroconductive adhesive film 失效
标题翻译：各向异性导电粘合膜
公开(公告)号：US4731282A
公开(公告)日：1988-03-15
申请号：US854808
申请日：1986-04-23
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Tadamitsu Nakayama
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Tadamitsu Nakayama
IPC分类号： H01L23/498 , H01R4/04 , H05K3/32 , H05K3/36 , B32B5/16 , C09J7/02
CPC分类号： H01L23/49883 , H01R4/04 , H05K3/323 , H01L2224/83101 , H01L2924/0002 , H05K2201/0129 , H05K2201/0133 , H05K2201/0266 , H05K3/361 , Y10S428/929 , Y10T428/23943 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/256 , Y10T428/28
摘要： An anisotropic-electroconductive adhesive film containing a small quantity of electroconductive particles having a special shape in an adhesive component layer which has a limited thickness is useful for connecting micro-sized circuits, etc. due to its anisotropy in electroconductivity and good transparency.
摘要翻译：含有少量导电粒子的各向异性导电粘合剂薄膜，由于其导电性的各向异性和良好的透明性而用于连接微小尺寸的电路等。

8. 发明授权

US09152034B2 Image display apparatus for displaying three-dimensional image and having a phase difference plate 有权
标题翻译：用于显示三维图像并具有相位差板的图像显示装置
公开(公告)号：US09152034B2
公开(公告)日：2015-10-06
申请号：US13330760
申请日：2011-12-20
申请人： Yutaka Yamaguchi
发明人： Yutaka Yamaguchi
IPC分类号： G03B35/26 , G02B27/26 , G03B21/14 , H04N9/31 , G02B27/22
CPC分类号： G03B35/26 , G02B27/2207 , G02B27/2228 , G02B27/2264 , G02B27/26 , G03B21/14 , G03B21/2066 , G03B21/2073 , H04N9/3167
摘要： An image display apparatus includes an image display element configured to modulate incident light from a light source, a polarization splitting element that has characteristics of transmitting first polarized light and reflecting second polarized light different from the first polarized light and that is configured to synthesize image light from the image display element to be introduced into a projection optical system, and a phase difference plate that is disposed at a side of the projection optical system relative to the polarization splitting element. The phase difference plate has an optic axis in a direction different from a surface normal direction and an in-plane direction of the phase difference plate.
摘要翻译：图像显示装置包括：调制来自光源的入射光的图像显示元件，具有透射第一偏振光并反射与第一偏振光不同的第二偏振光的特性的偏振分离元件，并且被配置为合成图像光从要被引入投影光学系统的图像显示元件和相对于偏振分离元件设置在投影光学系统的一侧的相位差板。相位差板具有与相位差板的表面法线方向和面内方向不同的方向的光轴。

9. 发明授权

US08449042B2 Adhesive wheel balance weight and process for producing the same 有权
标题翻译：胶轮平衡重量及其制造方法
公开(公告)号：US08449042B2
公开(公告)日：2013-05-28
申请号：US12805613
申请日：2010-08-10
申请人： Yutaka Yamaguchi , Osamu Yamaguchi
发明人： Yutaka Yamaguchi , Osamu Yamaguchi
IPC分类号： F16F15/32
CPC分类号： F16F15/328 , F16F15/324
摘要： The present invention provides an adhesive wheel balance weight capable of drastically reducing costs from those of conventional ones, and a process for producing the same. In an adhesive wheel balance weight (W) comprising a weight body (P) and an adhesive tape (T) for attaching the weight body (P) to a vehicle wheel, the weight body (P) comprises a folded weight comprising a folded metal plate piece. The folded weight of the present invention can be formed from a relatively inexpensive raw material sheet at a high yield rate. It is preferable that the raw material sheet is a zinc-coated steel sheet, because no rust-proofing aftertreatment is necessary and therefore further cost reduction is achieved, and its environmental burden is small.
摘要翻译：本发明提供一种能够显着地降低成本与传统轮胎平衡重的粘合轮平衡重及其制造方法。在包括用于将重量体（P）附接到车轮的重量体（P）和粘合带（T））的粘合轮平衡重（W）中，所述重量体（P）包括折叠重量，所述折叠重量包括折叠金属板块本发明的折叠重量可以由相对便宜的原料片以高产率形成。优选原料片是镀锌钢板，因为不需要防锈后处理，因此进一步降低成本，并且其环境负担小。

10. 发明授权

US08339708B2 Optical element and optical apparatus 有权
标题翻译：光学元件和光学设备
公开(公告)号：US08339708B2
公开(公告)日：2012-12-25
申请号：US13456090
申请日：2012-04-25
申请人： Daisuke Sano , Yutaka Yamaguchi
发明人： Daisuke Sano , Yutaka Yamaguchi
IPC分类号： G02B27/28
CPC分类号： G02B5/3083
摘要： An optical element including a first layer (011) made of a medium having optical anisotropy, wherein a difference between refractive indexes nh and nl (nh>nl) at a central wavelength λ for first and second polarized lights which enter the optical element and whose polarization directions are different from each other is at least 0.1, and wherein conditions (nt1−nl)·(nl−nt2)≦0 and nt1
摘要翻译：一种光学元件，包括由具有光学各向异性的介质制成的第一层（011），其中进入所述光学元件的第一和第二偏振光的中心波长λ处的折射率nh和nl（nh> nl）之间的差异，极化方向彼此不同的是至少为0.1，其中条件（nt1-n1）·（nl-nt2）＆nlE; 0和nt1

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式