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1. 发明授权

US4740657A Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained 失效
标题翻译：各向异性导电粘合剂组合物，使用其的电路的连接方法以及由此获得的连接的电路结构
公开(公告)号：US4740657A
公开(公告)日：1988-04-26
申请号：US13904
申请日：1987-02-12
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yoshikatsu Mikami , Kuniteru Muto , Yoshiyuki Ikezoe
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yoshikatsu Mikami , Kuniteru Muto , Yoshiyuki Ikezoe
IPC分类号： H01B1/22 , H01R4/04 , H05K3/32 , H05K3/36 , H01B1/16 , H01R43/00
CPC分类号： H01R4/04 , H01B1/22 , H05K3/323 , H01L2224/293 , H01L2224/29399 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/01019 , H01L2924/01079 , H05K2201/0221 , H05K2201/0233 , H05K2201/068 , H05K3/361 , Y10T29/49194
摘要： Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.

2. 发明授权

US5001542A Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips 失效
标题翻译：用于电路连接的组合，使用其的连接方法以及半导体芯片的连接结构
公开(公告)号：US5001542A
公开(公告)日：1991-03-19
申请号：US443169
申请日：1989-11-30
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
IPC分类号： H01R4/04 , C09J163/00 , G06K19/077 , H01B1/00 , H01B1/20 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/482 , H01L23/498 , H05K3/32
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L23/49883 , H01L24/05 , H01L24/29 , H05K3/323 , H01L2224/0401 , H01L2224/05571 , H01L2224/274 , H01L2224/2919 , H01L2224/29339 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/82365 , H01L2224/83101 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/0106 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/15151 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321
摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

3. 发明授权

US5120665A Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits 失效
标题翻译：使用具有压力可变电极性颗粒的电阻连接电路的均匀电极粘合剂的方法
公开(公告)号：US5120665A
公开(公告)日：1992-06-09
申请号：US671472
申请日：1991-03-19
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
IPC分类号： H01R4/04 , C09J163/00 , G06K19/077 , H01B1/00 , H01B1/20 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/482 , H01L23/498 , H05K3/32
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L23/49883 , H01L24/05 , H01L24/29 , H05K3/323 , H01L2224/0401 , H01L2224/05571 , H01L2224/274 , H01L2224/2919 , H01L2224/29339 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/82365 , H01L2224/83101 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/0106 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/15151 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321
摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

4. 发明授权

US6113728A Process for connecting circuits and adhesive film used therefor 失效
标题翻译：用于连接电路和粘合膜的方法
公开(公告)号：US6113728A
公开(公告)日：2000-09-05
申请号：US464118
申请日：1995-06-05
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L23/482 , H05K3/32 , B32B31/00 , C09J5/10
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L24/13 , H01L24/29 , H05K3/323 , H01L2224/13019 , H01L2224/16225 , H01L2224/274 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29399 , H01L2224/29499 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83136 , H01L2224/83191 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/15151 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321 , Y10T156/1075 , Y10T29/4913
摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.
摘要翻译：一种粘合膜，其包含（a）液体环氧树脂，（b）具有一个或多个官能团的固体树脂，（c）微胶囊型固化剂，并且如果需要（d）偶联剂，对于连接半导体芯片是有效的和加热和压力下的接线板。

5. 发明授权

US5843251A Process for connecting circuits and adhesive film used therefor 失效
公开(公告)号：US5843251A
公开(公告)日：1998-12-01
申请号：US853868
申请日：1992-03-20
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L23/482 , H05K3/32 , B32B31/00
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L24/13 , H01L24/29 , H05K3/323 , H01L2224/13019 , H01L2224/16225 , H01L2224/274 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29399 , H01L2224/29499 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83136 , H01L2224/83191 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/15151 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321 , Y10T156/1075 , Y10T29/4913
摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

6. 发明授权

US5155906A Process for repairing circuit connections 失效
标题翻译：修复电路连接的过程
公开(公告)号：US5155906A
公开(公告)日：1992-10-20
申请号：US672110
申请日：1991-03-19
申请人： Yasushi Goto , Atsuo Nakajima , Isao Tsukagoshi , Tomohisa Ohta , Yutaka Yamaguchi
发明人： Yasushi Goto , Atsuo Nakajima , Isao Tsukagoshi , Tomohisa Ohta , Yutaka Yamaguchi
IPC分类号： H01R43/00 , H05K3/22 , H05K3/28 , H05K3/32 , H05K3/36
CPC分类号： H05K3/225 , H05K3/288 , H05K2203/0769 , H05K2203/0783 , H05K2203/176 , H05K3/321 , H05K3/361 , Y10T29/49155 , Y10T29/49721
摘要： Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.

7. 发明授权

US5804882A Semiconductor device having a semiconductor chip electrically connected to a wiring substrate 失效
标题翻译：具有与布线基板电连接的半导体芯片的半导体装置
公开(公告)号：US5804882A
公开(公告)日：1998-09-08
申请号：US651954
申请日：1996-05-21
申请人： Isao Tsukagoshi , Hiroshi Matsuoka , Yukihisa Hirosawa , Yoshikatsu Mikami , Hisashi Dokochi
发明人： Isao Tsukagoshi , Hiroshi Matsuoka , Yukihisa Hirosawa , Yoshikatsu Mikami , Hisashi Dokochi
IPC分类号： H01L21/60 , H01L23/498 , H05K3/32 , H01L13/12 , H01L23/48
CPC分类号： H01L24/83 , H01L23/49838 , H01L24/29 , H01L24/81 , H01L2224/0401 , H01L2224/05551 , H01L2224/05552 , H01L2224/13011 , H01L2224/13144 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/81801 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H05K3/321
摘要： A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as surrounding projecting electrodes and at least one shape selected from circles and polygons when viewed from the top, within an area surrounded by the connected electrodes, has a high flexural strength and high reliability and can be used for information cards, and the like.
摘要翻译：一种半导体器件，包括半导体芯片，布线基板和优选地包含导电颗粒的粘合剂，在粘合剂层上或下方存在多个间隔元件，所述间隔元件具有与周围的突出电极几乎相同的高度，并且在在从连接的电极包围的区域内从顶部观察时，从圆形和多边形中选择的至少一种形状具有高抗弯强度和高可靠性，并且可以用于信息卡等。

8. 发明授权

US4731282A Anisotropic-electroconductive adhesive film 失效
标题翻译：各向异性导电粘合膜
公开(公告)号：US4731282A
公开(公告)日：1988-03-15
申请号：US854808
申请日：1986-04-23
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Tadamitsu Nakayama
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Tadamitsu Nakayama
IPC分类号： H01L23/498 , H01R4/04 , H05K3/32 , H05K3/36 , B32B5/16 , C09J7/02
CPC分类号： H01L23/49883 , H01R4/04 , H05K3/323 , H01L2224/83101 , H01L2924/0002 , H05K2201/0129 , H05K2201/0133 , H05K2201/0266 , H05K3/361 , Y10S428/929 , Y10T428/23943 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/256 , Y10T428/28
摘要： An anisotropic-electroconductive adhesive film containing a small quantity of electroconductive particles having a special shape in an adhesive component layer which has a limited thickness is useful for connecting micro-sized circuits, etc. due to its anisotropy in electroconductivity and good transparency.
摘要翻译：含有少量导电粒子的各向异性导电粘合剂薄膜，由于其导电性的各向异性和良好的透明性而用于连接微小尺寸的电路等。

9. 发明申请

US20100294329A1 MEMBER FOR CONDUCTOR CONNECTION, METHOD FOR MANUFACTURING THE SAME, CONNECTION STRUCTURE, AND SOLAR CELL MODULE 审中-公开
标题翻译：导体连接用构件，其制造方法，连接结构和太阳能电池模块
公开(公告)号：US20100294329A1
公开(公告)日：2010-11-25
申请号：US12680258
申请日：2008-09-25
申请人： Naoki Fukushima , Isao Tsukagoshi
发明人： Naoki Fukushima , Isao Tsukagoshi
IPC分类号： H01L31/042 , H01B5/00 , H01B13/00
CPC分类号： H01L31/0508 , H01L31/0512 , Y02E10/50
摘要： The member for conductor connection of the invention is a member for conductor connection having an adhesive layer 3 formed on at least one side of a metal foil 1, wherein the metal foil 1 comprises a plurality of projections 2 of substantially equal height integrated with the metal foil 1, on the side on which the adhesive layer 3 is formed, and the adhesive layer 3 is formed to a substantially uniform thickness along the projections 2.
摘要翻译：本发明的导体连接用构件是用于导体连接的构件，其具有形成在金属箔1的至少一侧上的粘合剂层3，其中金属箔1包括与金属一体化的基本相等高度的多个突起2 箔1，在其上形成有粘合剂层3的一侧，并且粘合剂层3沿着突起2形成为基本均匀的厚度。

10. 发明申请

US20070273342A1 ELECTRIC POWER SUPPLY APPARATUS AND METHOD OF SYNCHRONOUSLY OPERATING POWER CONVERTER 审中-公开
标题翻译：电力供应装置和同步运行电力转换器的方法
公开(公告)号：US20070273342A1
公开(公告)日：2007-11-29
申请号：US11753283
申请日：2007-05-24
申请人： Tadashi Kataoka , Shigeru Sakata , Takahide Ozawa , Isao Tsukagoshi , Zheng Dai
发明人： Tadashi Kataoka , Shigeru Sakata , Takahide Ozawa , Isao Tsukagoshi , Zheng Dai
IPC分类号： G05F1/10 , H02J3/12
CPC分类号： H02P9/006 , H02P2101/10
摘要： An electric power supply apparatus includes a distributed power generator such as a gas turbine generator and a power converter such as an inverter apparatus for converting electric power generated by the distributed power generator into AC electric power (alternating-current power) having a required frequency and a required voltage and supplying the AC electric power to a load. The electric power supply apparatus further includes a control unit having output voltage vs. output current characteristics for determining an output voltage corresponding to an output current of the power converter. The output voltage vs. output current characteristics has a first dropping characteristic for causing output electric power of the electric generator to be limited, between a first output current exceeding a power generation capability of the electric generator and a second output current exceeding a power converting capability of the power converter.
摘要翻译：电力供给装置包括燃气轮机发电机等分布式发电机和用于将由分散发电机产生的电力转换为具有所需频率的交流电力（交流电力）的逆变器装置的功率转换器，以及所需的电压并将AC电力提供给负载。电力供给装置还包括具有用于确定与功率转换器的输出电流对应的输出电压的输出电压与输出电流特性的控制单元。输出电压与输出电流特性之间具有第一下降特性，用于在超过发电机的发电能力的第一输出电流与超过功率转换能力的第二输出电流之间限制发电机的输出功率的功率转换器。

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