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    • 2. 发明授权
    • Printed wiring board and semiconductor device and processes to prepare the same
    • 印刷电路板和半导体器件及其制备方法
    • US06709804B2
    • 2004-03-23
    • US10368960
    • 2003-02-19
    • Yusuke TajimaKazuo TakeuchiYasuo ShigemitsuEtsu Takeuchi
    • Yusuke TajimaKazuo TakeuchiYasuo ShigemitsuEtsu Takeuchi
    • G03C173
    • B82Y15/00B82Y30/00G03F7/0387H05K1/023H05K3/4676Y10S430/116Y10S430/121
    • A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with a photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprises coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition forms a resin layer having excellent heat resistance.
    • 印刷电路板,用于配置半导体芯片的基板和通过用包含氧敏感剂和顺式二烯取代的聚酰胺酸或聚酰亚胺的感光性树脂组合物涂布基板而制备的半导体装置,并通过暴露于辐射形成精细图案。 用于制造印刷线路板的方法,用于设置半导体芯片的基板和半导体器件,其包括用感光性树脂组合物涂布基材并通过与通过氧气曝光产生的单线态氧化缩聚反应顺式二烯来形成精细图案 敏化剂对辐射。 感光性树脂组合物为负型,显示出高灵敏度,高分辨率。 感光性树脂组合物形成耐热性优异的树脂层。