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1. 发明申请

WO2006017035A1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES 审中-公开
标题翻译：光敏电介质树脂组合物及其用途
公开(公告)号：WO2006017035A1
公开(公告)日：2006-02-16
申请号：PCT/US2005/023369
申请日：2005-07-01
申请人： PROMERUS LLC , AMOROSO, Dino , BEDWELL, Brian , BELL, Andrew , ELCE, Edmund , GAN, Daoji , KANG, Seok, Ho , MAKABE, Hiroaki , PUTHENKOVILAKOM, Rajesh, Raja , RAVIKIRAN, Ramakrishna , SHICK, Robert , TAKAHASHI, Yasunori , ETSU, Takeuchi , WU, Xiaoming
发明人： AMOROSO, Dino , BEDWELL, Brian , BELL, Andrew , ELCE, Edmund , GAN, Daoji , KANG, Seok, Ho , MAKABE, Hiroaki , PUTHENKOVILAKOM, Rajesh, Raja , RAVIKIRAN, Ramakrishna , SHICK, Robert , TAKAHASHI, Yasunori , ETSU, Takeuchi , WU, Xiaoming
IPC分类号： C08G61/00 , G03F7/00
CPC分类号： G03F7/0395 , C08F232/08 , C08G61/02 , C08G61/06 , C08G61/12 , C08L65/00 , G03F7/0046 , G03F7/0233 , G03F7/038 , Y10S430/106
摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
摘要翻译：根据本发明的一些实施方案涉及降冰片烯型聚合物和由其形成的光敏介电树脂组合物。其它实施方案涉及由这种组合物形成的膜以及包含这种膜的诸如电子，电子和光电子器件的器件。

2. 发明申请

US20120228782A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE 审中-公开
标题翻译：制造电子器件的方法，电子设备，制造电子器件封装的方法和电子器件封装
公开(公告)号：US20120228782A1
公开(公告)日：2012-09-13
申请号：US13510744
申请日：2010-11-19
申请人： Masakazu Kawata , Etsu Takeuchi , Junya Kusunoki , Hiromichi Sugiyama
发明人： Masakazu Kawata , Etsu Takeuchi , Junya Kusunoki , Hiromichi Sugiyama
IPC分类号： H01L21/56 , H01L23/28
CPC分类号： H01L25/105 , H01L21/565 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L24/16 , H01L24/48 , H01L24/73 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a method for manufacturing an electronic device, the method including: placing an electronic component on a substrate 11; forming standing portions 13 on the surface of the substrate 11 on which the electronic component 10 is placed, the standing portions 13 comprising a thermally decomposable resin; applying an encapsulating material 14 so as to encapsulate the electronic component 10 and cover around the standing portions 13 while exposing a portion of each of the standing portions 13 from the surface of the encapsulating material 14; heating the standing portions 13 to decompose and remove the standing portions 13, thereby forming holes 141 through the encapsulating material 14; and placing a conductive material 15 in the holes 141.
摘要翻译：公开了一种电子设备的制造方法，该方法包括：将电子部件放置在基板11上; 在其上放置电子部件10的基板11的表面上形成立起部13，立起部13包括可热分解树脂; 施加封装材料14以便将电子部件10封装并且围绕立起部13覆盖，同时使每个竖直部分13的一部分暴露于封装材料14的表面; 加热立起部分13以分解和取出竖立部分13，从而通过封装材料14形成孔141; 并将导电材料15放置在孔141中。

3. 发明申请

US20110263095A1 TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
标题翻译：用于半导体滤波器的临时粘结粘合剂和使用其制造半导体器件的方法
公开(公告)号：US20110263095A1
公开(公告)日：2011-10-27
申请号：US13126934
申请日：2010-06-15
申请人： Etsu Takeuchi , Junya Kusunoki , Hiromichi Sugiyama , Toshiharu Kuboyama , Masakazu Kawata
发明人： Etsu Takeuchi , Junya Kusunoki , Hiromichi Sugiyama , Toshiharu Kuboyama , Masakazu Kawata
IPC分类号： H01L21/762 , C09J155/00
CPC分类号： C09J169/00 , C08L2203/206 , C09J123/24 , C09J145/00 , H01L21/6836 , H01L2221/68327
摘要： To provide a temporary bonding adhesive for a semiconductor wafer that can reduce damage to the semiconductor wafer, is easily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using the same.A temporary bonding adhesive for a semiconductor device is provided, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition such that the difference between the 95% weight loss temperature and the 5% weight loss temperature is 1 degree Celsius≦(95% weight loss temperature)−(5% weight loss temperature)≦300 degrees Celsius.
摘要翻译：为了提供能够减少对半导体晶片的损伤的半导体晶片的临时粘合剂，易于拆卸，并且可以缩短热分解所需的时间，以及使用其的半导体器件的制造方法。提供了一种用于半导体器件的临时粘合粘合剂，其是用于将半导体晶片临时接合到支撑衬底上以便处理半导体晶片的临时粘结粘合剂，并且用于通过加工后的加热从支撑衬底分离半导体晶片，含有95重量％失重温度和5重量％失重温度之间的差异为1摄氏度/℃（95重量％失重温度） - （5重量％失重温度）＆amp; NlE; 300摄氏度的树脂组合物。

4. 发明申请

US20090215976A1 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films 有权
公开(公告)号：US20090215976A1
公开(公告)日：2009-08-27
申请号：US12387025
申请日：2009-04-27
申请人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Daoji Gan , Etsu Takeuchi , Seok Ho Kang
发明人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Daoji Gan , Etsu Takeuchi , Seok Ho Kang
IPC分类号： C08G77/04 , C08G63/66
CPC分类号： G03F7/0395 , C08F232/08 , C08G61/02 , C08G61/06 , C08G61/12 , C08L65/00 , G03F7/0046 , G03F7/0233 , G03F7/038 , Y10S430/106
摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

5. 发明申请

US20060008734A1 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films 有权
公开(公告)号：US20060008734A1
公开(公告)日：2006-01-12
申请号：US11171391
申请日：2005-07-01
申请人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Kang
发明人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Kang
IPC分类号： G03C1/492
CPC分类号： G03F7/0395 , C08F232/08 , C08G61/02 , C08G61/06 , C08G61/12 , C08L65/00 , G03F7/0046 , G03F7/0233 , G03F7/038 , Y10S430/106
摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

6. 发明授权

US06709804B2 Printed wiring board and semiconductor device and processes to prepare the same 失效
标题翻译：印刷电路板和半导体器件及其制备方法
公开(公告)号：US06709804B2
公开(公告)日：2004-03-23
申请号：US10368960
申请日：2003-02-19
申请人： Yusuke Tajima , Kazuo Takeuchi , Yasuo Shigemitsu , Etsu Takeuchi
发明人： Yusuke Tajima , Kazuo Takeuchi , Yasuo Shigemitsu , Etsu Takeuchi
IPC分类号： G03C173
CPC分类号： B82Y15/00 , B82Y30/00 , G03F7/0387 , H05K1/023 , H05K3/4676 , Y10S430/116 , Y10S430/121
摘要： A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with a photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprises coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition forms a resin layer having excellent heat resistance.
摘要翻译：印刷电路板，用于配置半导体芯片的基板和通过用包含氧敏感剂和顺式二烯取代的聚酰胺酸或聚酰亚胺的感光性树脂组合物涂布基板而制备的半导体装置，并通过暴露于辐射形成精细图案。用于制造印刷线路板的方法，用于设置半导体芯片的基板和半导体器件，其包括用感光性树脂组合物涂布基材并通过与通过氧气曝光产生的单线态氧化缩聚反应顺式二烯来形成精细图案敏化剂对辐射。感光性树脂组合物为负型，显示出高灵敏度，高分辨率。感光性树脂组合物形成耐热性优异的树脂层。

7. 发明授权

US06528231B1 PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE 失效
标题翻译：感光性树脂组合物，印刷线路板，用于处理半导体芯片的基板，用于制造印刷电路板的半导体器件和工艺，用于处理半导体器件的衬底和半导体器件
公开(公告)号：US06528231B1
公开(公告)日：2003-03-04
申请号：US09490627
申请日：2000-01-24
申请人： Yusuke Tajima , Kazuo Takeuchi , Yasuo Shigemitsu , Etsu Takeuchi
发明人： Yusuke Tajima , Kazuo Takeuchi , Yasuo Shigemitsu , Etsu Takeuchi
IPC分类号： G03C173
CPC分类号： B82Y15/00 , B82Y30/00 , G03F7/0387 , H05K1/023 , H05K3/4676 , Y10S430/116 , Y10S430/121
摘要： A photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or a polyimide. A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with the photosensitive resin composition and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprise coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition can form a resin layer having excellent heat resistance.
摘要翻译：包含氧敏感剂和顺式二烯取代的聚酰胺酸或聚酰亚胺的感光性树脂组合物。印刷电路板，用于设置半导体芯片的基板和通过用感光性树脂组合物涂布基板而制备的半导体器件，并且通过暴露于辐射形成精细图案。制造印刷电路板的方法，用于设置半导体芯片的基板和半导体装置，其包括用感光性树脂组合物涂布基板并通过与通过氧气曝光产生的单线态的氧化缩聚来交联顺式二烯而形成精细图案敏化剂对辐射。感光性树脂组合物为负型，显示出高灵敏度，高分辨率。感光性树脂组合物可以形成耐热性优异的树脂层。

8. 发明申请

US20080194740A1 DIRECTLY PHOTODEFINABLE POLYMER COMPOSITIONS AND METHODS THEREOF 有权
标题翻译：直接可光聚合聚合物组合物及其方法
公开(公告)号：US20080194740A1
公开(公告)日：2008-08-14
申请号：US11949328
申请日：2007-12-03
申请人： Edmund Elce , Andrew Bell , Brian Knapp , Hendra Ng , Larry F. Rhodes , Robert Shick , Wei Zhang , William DiMenna , Saikumar Jayaraman , Jianyong Jin , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Xiaoming Wu , Etsu Takeuchi
发明人： Edmund Elce , Andrew Bell , Brian Knapp , Hendra Ng , Larry F. Rhodes , Robert Shick , Wei Zhang , William DiMenna , Saikumar Jayaraman , Jianyong Jin , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Xiaoming Wu , Etsu Takeuchi
IPC分类号： C08K5/45 , C08G73/00 , C08K5/1545
CPC分类号： C08G61/04 , C08F232/08 , G03F7/0388
摘要： A polymer includes a first type of repeat unit represented by Formula I: where X is selected from —CH2—, —CH2—CH2—, or —O—; m is an integer from 0 to about 5; and where for the first type of repeat unit one of R1, R2, R3, and R4 is one of a maleimide containing group and for the second type of repeat unit one of R1, R2, R3, and R4 is a hindered aromatic group, a C8 or greater alkyl group, a C4 or greater halohydrocarbyl or perhalocarbyl group, a C7 or greater aralkyl group, or a heteroatom hydrocarbyl or halohydrocarbyl group.
摘要翻译：聚合物包括由式I表示的第一类型的重复单元：其中X选自-CH 2 - ， - CH 2 -CH 2 > - 或-O-; m是0至约5的整数; 并且对于第一类型的重复单元，R 1，R 2，R 3和R 4中的一个，R 4， >是含有马来酰亚胺的基团之一，对于第二类型的重复单元，R 1，R 2，R 3和R 3中的一个，R 3，R 3，受阻芳族基团，C 8或更高级烷基，C 4或更大的卤代烃基或全卤代羰基，C _{7个或更大的芳烷基，或杂原子烃基或卤代烃基。}

9. 发明授权

US5507903A Process for producing two-layered tape for tab 失效
标题翻译：生产双层胶带的方法
公开(公告)号：US5507903A
公开(公告)日：1996-04-16
申请号：US949543
申请日：1994-01-12
申请人： Yoshiyuki Yamamori , Shinichi Mikami , Toshio Nakao , Takuya Tochimoto , Etsu Takeuchi
发明人： Yoshiyuki Yamamori , Shinichi Mikami , Toshio Nakao , Takuya Tochimoto , Etsu Takeuchi
IPC分类号： H01L21/48 , H05K1/03 , H05K3/02 , H05K3/28 , H05K3/40 , B32B31/04 , B32B31/18 , B32B31/26
CPC分类号： H05K3/022 , H01L21/4846 , H05K3/4092 , H05K1/0346 , H05K1/036 , H05K2201/0154 , H05K2201/0355 , H05K2203/063 , H05K2203/066 , H05K3/281 , Y10T156/1056 , Y10T156/1057
摘要： There are provided a process for producing a two-layered tape for TAB, which comprises forming desired holes in a semi-cured polyamic acid film formed on a release film or in a semi-cured polyamic acid film subjected to stretching of 10% or more, then pressure-bonding the resulting film or film laminate to a conductor foil or a conductor foil on which a semi-cured light-transmittable polyamic acid film is formed, so that the polyamic acid film and the conductor foil contact with each other or the two polyamic acid films contact with each other, conducting imidization, and thereafter forming a desired pattern in the conductor foil; a process for producing a stretched polyamic acid film by subjecting a polyamic acid film to stretching of 10% or more; and a process for producing a flexible base board for printed circuit or a flexible printed circuit board with a cover layer, both using said stretched polyamic acid film.
摘要翻译： PCT No.PCT / JP92 / 00286 Sec。 371日期：1994年1月12日 102（e）日期1994年1月12日PCT 1991年3月11日PCT公布。出版物WO92 / 16970 PCT 提供了一种用于制造TAB的双层带的方法，其包括在形成在脱模膜上的半固化聚酰胺酸膜中或在半固化聚酰胺酸膜中形成所需的孔，拉伸10％以上，然后将得到的膜或膜层压体压接到其上形成有半固化的可透光聚酰胺酸膜的导体箔或导体箔，使得聚酰胺酸膜和导体彼此接触或两个聚酰胺酸膜彼此接触，进行酰亚胺化，然后在导体箔中形成所需图案; 通过使聚酰胺酸膜拉伸10％以上来制造拉伸聚酰胺酸膜的方法; 以及制造用于印刷电路的柔性基板或具有覆盖层的柔性印刷电路板的方法，两者都使用所述拉伸的聚酰胺酸膜。

10. 发明授权

US09399725B2 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same 有权
标题翻译：用于半导体晶片的临时粘合剂以及使用其的半导体器件的制造方法
公开(公告)号：US09399725B2
公开(公告)日：2016-07-26
申请号：US13126999
申请日：2010-06-15
申请人： Etsu Takeuchi , Junya Kusunoki , Hiromichi Sugiyama , Toshiharu Kuboyama , Masakazu Kawata
发明人： Etsu Takeuchi , Junya Kusunoki , Hiromichi Sugiyama , Toshiharu Kuboyama , Masakazu Kawata
IPC分类号： H01L21/31 , H01L21/469 , C09J169/00 , C09D177/00 , C09D179/08 , H01L21/683
CPC分类号： C09J169/00 , C09D177/00 , C09D179/08 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68386
摘要： To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this.A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.
摘要翻译：为了提供一种用于半导体晶片的临时粘合剂，其减少对半导体晶片的损伤，使其易于拆卸，并且可以缩短热分解所需的时间，并且使用该半导体器件的制造方法。一种用于半导体晶片的暂时粘结粘合剂，其是用于将半导体晶片临时接合到支撑基板上以便处理半导体晶片的临时粘合粘合剂，并且用于通过加工后的加热将半导体晶片从支撑基板上分离，通过活性能量射线照射后50％重量损失温度降低的树脂组合物。

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