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    • 2. 发明授权
    • Capacitance-type pressure sensor
    • 电容式压力传感器
    • US06640642B1
    • 2003-11-04
    • US09653808
    • 2000-09-01
    • Yasuo OnoseAtsuo WatanabeSeiji KuryuShinya SatouJunichi HorieSatoshi Shimada
    • Yasuo OnoseAtsuo WatanabeSeiji KuryuShinya SatouJunichi HorieSatoshi Shimada
    • G01L912
    • G01L9/0042G01L1/146G01L9/0073
    • A pressure sensor of electric capacitance type which includes a plurality of pressure sensor units connected in parallel with one another and each formed on a substrate by an electrode, a cavity region and a diaphragm having an electrically conductive film which is disposed in opposition to the electrode with the cavity region intervening between the electrode and the diaphragm, wherein diaphragm fixing portions are disposed internally of the cavity region so that a single sheet of the diaphragm is partitionarily and regionally allotted to regions of the plural pressure sensor units, respectively. With this structure of the capacitance-type pressure sensor, ineffective region for capacitance detection is minimized and hence the parasitic capacitance can be reduced with the detection accuracy of the sensor being improved.
    • 一种电容式压力传感器,其包括彼此并联连接的多个压力传感器单元,每个压力传感器单元通过电极形成在基板上,空腔区域和具有导电膜的隔膜,所述导电膜设置成与电极相对设置 其中腔区插入在电极和隔膜之间,其中隔膜固定部分设置在空腔区域的内部,使得隔膜的单片分别地分区地分配到多个压力传感器单元的区域。 利用电容型压力传感器的这种结构,电容检测的无效区域被最小化,因此可以随着传感器的检测精度提高而降低寄生电容。
    • 10. 发明申请
    • THIN FILM FORMATION METHOD AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
    • 薄膜形成方法和半导体器件的制造方法
    • US20090253264A1
    • 2009-10-08
    • US12189335
    • 2008-08-11
    • Junichi Horie
    • Junichi Horie
    • H01L21/311
    • H01L22/12H01L22/26
    • A method of forming a thin film including a first portion having a first film thickness and a second portion having a second film thickness thinner than the first film thickness. A thin film having the first film thickness is formed on a substrate, an interference waveform upon film formation from reflected light by irradiating with laser light is acquired, the second portion of the thin film is etched, an interference waveform upon etching is acquired by irradiating, with laser light, the second portion, and calculating an interference waveform upon target etching on condition that the second portion has the second film thickness, based on the interference waveform upon film formation. The etching is stopped when the interference waveform upon etching becomes the same as the interference waveform upon target etching.
    • 一种形成薄膜的方法,所述薄膜包括具有第一薄膜厚度的第一部分和具有比第一薄膜厚度薄的第二薄膜厚度的第二部分。 在基板上形成具有第一膜厚度的薄膜,通过照射激光获得反射光成膜时的干涉波形,蚀刻第二部分薄膜,通过照射获得蚀刻时的干涉波形 基于成膜时的干涉波形,在第二部分具有第二膜厚的条件下,利用激光照射第二部分,并且在目标蚀刻时计算干涉波形。 当蚀刻时的干涉波形与目标蚀刻时的干涉波形相同时,停止蚀刻。