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    • 8. 发明授权
    • Light exposure method, and light exposure apparatus
    • 曝光方法和曝光装置
    • US09291919B2
    • 2016-03-22
    • US13290204
    • 2011-11-07
    • Hiroaki Oizumi
    • Hiroaki Oizumi
    • G03F7/20
    • G03F7/70033G03F7/70916
    • There is provided an EUV exposure apparatus which restrains its optical systems or a mask used therein from being polluted by contaminations generated in its chamber. An energy beam generating source is arranged near a wafer stage set in the chamber of the EUV exposure apparatus to decompose an emission gas generated from a resist painted on the front surface of a wafer by an energy beam. In this manner, lightening mirrors configuring a lightening optical system as one of the optical systems, projection mirrors configuring a projection optical system as another of the optical systems, the mask, and others are protected from being polluted by contaminations.
    • 提供了一种EUV曝光装置,其限制其光学系统或其中使用的掩模被其室中产生的污染物污染。 能量束发生源设置在设置在EUV曝光装置的腔室中的晶片台附近,以通过能量束来分解由涂在晶片的前表面上的抗蚀剂产生的发射气体。 以这种方式,配置作为光学系统之一的减光光学系统的减光镜,构成作为另一个光学系统的投影光学系统的投影镜,掩模等被保护而不被污染物污染。
    • 9. 发明授权
    • Light exposure method
    • 曝光方法
    • US06613497B1
    • 2003-09-02
    • US09697736
    • 2000-10-27
    • Nobuyuki MatsuzawaHiroaki Oizumi
    • Nobuyuki MatsuzawaHiroaki Oizumi
    • G03C500
    • G03F7/2039G03F7/0757Y10S430/167Y10S430/168
    • A light exposure method for ultra-fine processing for a semiconductor in which light transmittance of a resist layer in a wavelength range of the extreme ultraviolet (EUV) light is improved to enable ultra-fine processing more elaborate than is possible with conventional methods. In selectively exposing a resist layer to X-rays, a high molecular material obtained by replacing at least a portion of hydrogen atoms of a pre-existing resist material by a substituent containing an alkyl group and/or a substituent containing an aromatic ring is used as a high molecular material of the resist layer. By replacing the hydrogen atoms of the high molecular materials with a substituent containing an alkyl group or a substituent containing an aromatic ring, the proportion of oxygen atoms in an atom of the high molecular materials becomes relatively smaller to suppress optical absorption of the entire high molecular material. The line absorption coefficient in an x-ray wavelength is 3.80&mgr;−1 or less.
    • 对于在极紫外(EUV)光的波长范围内的抗蚀剂层的透光率得到改善以使得超细加工比常规方法更加精细化的半导体的超细加工的曝光方法。 在将抗蚀剂层选择性地暴露于X射线时,使用通过用含有烷基和/或含有芳环的取代基取代含有烷基和/或取代基的原有抗原材料的至少一部分氢原子获得的高分子材料 作为抗蚀剂层的高分子材料。 通过用含有烷基或含有芳环的取代基取代高分子材料的氢原子,高分子材料的原子中氧原子的比例变得相对较小,以抑制整个高分子量的光吸收 材料。 X射线波长的线吸收系数为3.80mu-1以下。