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    • 2. 发明授权
    • Method for light exposure
    • 曝光方法
    • US06677108B2
    • 2004-01-13
    • US09907345
    • 2001-07-17
    • Nobuyuki MatsuzawaShigeo Irie
    • Nobuyuki MatsuzawaShigeo Irie
    • G03C556
    • G03F7/2039G03F7/2004Y10S430/167Y10S430/168
    • A light exposure method in which, when a resist layer is selectively exposed to one of X-rays containing soft X-rays, vacuum ultraviolet light rays and ultraviolet rays containing extreme ultraviolet light rays for patterning the resist layer to a pre-set shape, a high molecular material having pre-set oxygen content ratio (no) and density (&rgr;) is applied to form a resist layer having a film thickness not less than 250 nm. Since the high molecular material having the pre-set oxygen content ratio (no) and density (&rgr;) is used, a resist pattern of a better shape may be obtained even if the resist layer is of an increased thickness of not less than 250 nm. Since the film thickness of the resist layer is not less than 250 nm, it is possible to construct a lithographic process superior in etching resistance to realize ultra-fine machining than was heretofore possible.
    • 一种曝光方法,其中当将抗蚀剂层选择性地暴露于含有软X射线的X射线之一,真空紫外光线和包含用于将抗蚀剂层图案化为预定形状的极紫外光的紫外线时, 施加具有预设氧含量比(No)和密度(rho))的高分子材料以形成膜厚度不小于250nm的抗蚀剂层。 由于使用具有预设氧含量比(no)和密度(rho)的高分子材料,因此即使抗蚀剂层的厚度增加到不小于250nm,也可以获得更好形状的抗蚀剂图案 。 由于抗蚀剂层的膜厚度不小于250nm,因此可以构造抗蚀性优异的平版印刷工艺,以实现超细加工。
    • 4. 发明授权
    • Functional molecular device
    • 功能分子装置
    • US07679080B2
    • 2010-03-16
    • US11571135
    • 2005-06-23
    • Eriko MatsuiNobuyuki MatsuzawaAkio YasudaOliver Harnack
    • Eriko MatsuiNobuyuki MatsuzawaAkio YasudaOliver Harnack
    • H01L51/30
    • B82Y30/00B82Y10/00H01L27/283H01L51/005H01L51/0067H01L51/0512H01L51/0583H01L51/0595Y10S977/731Y10S977/791Y10S977/94Y10S977/943
    • A functional molecular device displaying its functions under the action of an electrical field is provided. A Louis base molecule, exhibiting positive dielectric constant anisotropy or exhibiting dipole moment along the long-axis direction of the Louis base molecule, is arrayed in the form of a pendant on an electrically conductive linear or film-shaped principal-axis molecule of a conjugated system, via a metal ion capable of acting as a Louis acid. The resulting structure is changed in conformation on application of an electrical field to exhibit its function. The electrically conductive linear or film-shaped principal-axis molecule and the Louis base molecule form a complex with the metal ion. On application of the electrical field, the Louis base molecule performs a swinging movement or a seesaw movement to switch the electrical conductivity of the principal-axis molecule. This molecule exhibits electrical characteristics which may be reversed depending on whether or not the molecule has been subjected to electrical field processing. A molecular device having a function equivalent to one of CMOS may be produced from one and the same material.
    • 提供了在电场作用下显示其功能的功能分子装置。 在路易斯碱分子的长轴方向显示出正介电常数各向异性或显示偶极矩的路易斯碱基分子以共轭的导电线性或膜状主轴分子的侧基的形式排列 系统,通过能够作为路易斯酸的金属离子。 所产生的结构在施加电场以表现其功能的结构上改变。 导电线性或膜状主轴分子和路易斯碱分子与金属离子形成络合物。 在施加电场时,路易斯碱分子进行摆动运动或跷跷板运动以切换主轴分子的导电性。 该分子表现出电特性,其可以根据分子是否经受电场加工而反转。 具有与CMOS之一相当的功能的分子器件可以由同一材料制造。
    • 5. 发明授权
    • Antireflective film and exposure method
    • 防反射膜和曝光方法
    • US07582411B2
    • 2009-09-01
    • US11467983
    • 2006-08-29
    • Nobuyuki MatsuzawaYoko WatanabeBoontarika ThunnakartKen Ozawa
    • Nobuyuki MatsuzawaYoko WatanabeBoontarika ThunnakartKen Ozawa
    • H01L21/027G03F7/20G03F7/11
    • H01L21/0276G03F7/091G03F7/2041Y10S438/952
    • An antireflective film is provided between a resist layer and a silicon oxide layer formed on a surface of a silicon substrate, for exposure of the resist layer in an exposure system having a wavelength of 190 nm to 195 nm and a numerical aperture NA of 0.93 to 1.2. Assuming that the complex refractive indexes of upper and lower layers constituting the antireflective film are N1 (=n1−k1i) and N2 (=n2−k2i), respectively, and the thicknesses of both layers are d1 and d2, when a predetermined combination of values of [n10, k10, d10, n20, k20, d20] is selected, n1, k1, d1, n2, k2, and d2 satisfy the relational expression {(n1−n10)/(n1m−n10)}2+{(k1−k10)/(k1m−k10)}2+{(d1−d10)/(d1m−d10)}2+{(n2−n20)/(n2m−n20)}2+{(k2−k20)/(k2m−k20)}2+{(d2−d20)/(d2m−d20)}2≦1.
    • 在抗蚀剂层和形成在硅衬底的表面上的氧化硅层之间设置防反射膜,用于在波长为190nm至195nm的曝光系统中曝光抗蚀剂层,并将数值孔径NA为0.93至 1.2。 假设构成防反射膜的上层和下层的复折射率分别为N1(= n1-k1i)和N2(= n2-k2i),并且两层的厚度分别为d1和d2, 选择[n10,k10,d10,n20,k20,d20]的值,n1,k1,d1,n2,k2和d2满足关系式<?in-line-formula description =“In-line Formulas”end =“lead”→> {(n1-n10)/(n1m-n10)} 2 + {(k1-k10)/(k1m-k10)} 2 + {(d1-d10)/(d1m-d10)} 2 + {(n2-n20)/(n2m-n20)} 2 + {(k2-k20)/(k2m-k20)} 2 + {(d2-d20)/(d2m-d20)} 2 < ?in-line-formula description =“In-line Formulas”end =“tail”?>
    • 6. 发明授权
    • Resist material and exposure method
    • 抵抗材料和曝光方法
    • US06927010B2
    • 2005-08-09
    • US10317700
    • 2002-12-12
    • Nobuyuki Matsuzawa
    • Nobuyuki Matsuzawa
    • G03F7/032G03F7/004G03F7/038G03F7/039G03F7/20H01L21/027
    • G03F7/0046G03F7/0397Y10S430/108
    • The present invention employs a polymer material exhibiting a low absorbance in the wavelength range of a vacuum ultraviolet (VUV) light to allow the improved ultra-fine process to be realized. In an exposure method for selectively exposing a resist layer to an ultraviolet light to pattern the resist layer into a predetermined shape, a polymer material, to which a cyclopentane group is introduced, is used as a polymer material constituting the resist layer, wherein at least one hydrogen atom of the introduced cyclopentane group is substituted by at least one selected from the group consisting of a fluorine atom, a trifluoromethyl group and a difluoromethylene group.
    • 本发明采用在真空紫外(VUV)光的波长范围内表现出低吸光度的聚合物材料,以实现改进的超细工艺。 在将抗蚀剂层选择性地暴露于紫外线以将抗蚀剂层图案化成预定形状的曝光方法中,使用引入环戊烷基的聚合物材料作为构成抗蚀剂层的聚合物材料,其中至少 引入的环戊烷基中的一个氢原子被选自氟原子,三氟甲基和二氟亚甲基中的至少一个取代。