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1. 发明授权

US06774174B2 Flame-retardant polyamide compositions 有权
标题翻译：阻燃聚酰胺组合物
公开(公告)号：US06774174B2
公开(公告)日：2004-08-10
申请号：US09957798
申请日：2001-09-21
申请人： Marvin Michael Martens , Reiko Koshida , Jennifer L. Bohan , William Ray Fielding
发明人： Marvin Michael Martens , Reiko Koshida , Jennifer L. Bohan , William Ray Fielding
IPC分类号： C08L7700
CPC分类号： C08L77/00 , C08L25/08 , C08L25/18 , C08L77/02 , C08L77/06 , C08L25/00
摘要： This invention deals with the development of improved SMT performance flame retardant polyamide compositions. The compositions include replacing the poly bromostyrene or brominated polystyrene with a copolymer of a halostyrene and glycidyl(meth)acrylate. The resulting composition results in greatly improved blistering performance in Surface Mounting Technology Applications.
摘要翻译：本发明涉及改进的SMT性能阻燃聚酰胺组合物的发展。组合物包括用卤代苯乙烯和（甲基）丙烯酸缩水甘油酯的共聚物代替聚溴苯乙烯或溴化聚苯乙烯。所得组合物在表面安装技术应用中显着提高了起泡性能。

2. 发明授权

US06733853B2 Polyester-based resin composition and shaped articles 有权
标题翻译：聚酯类树脂组合物和成型制品
公开(公告)号：US06733853B2
公开(公告)日：2004-05-11
申请号：US10081217
申请日：2002-02-25
申请人： Masahiko Takashima , Koji Yamamoto , Hiroyuki Nanba
发明人： Masahiko Takashima , Koji Yamamoto , Hiroyuki Nanba
IPC分类号： C08L7700
CPC分类号： C08L67/02 , Y10T428/1352 , Y10T428/31725 , Y10T428/31739 , C08L77/00
摘要： The polyester-based resin composition of the present invention comprises a melt blend (C) consisting of a polyamide resin (A) and a polyester resin (B). The polyester-based resin composition satisfies the following formulas 1 and 2: P×C/100≦25 (1) Y/X×100≧90 (2) wherein P is a concentration, ppm, of a phosphorus compound in the polyamide resin (A) in terms of phosphorus atom; C is a content, % by mass, of the polyamide resin (A) in the melt blend (C); X is a lightness of a 2-mm thick plate which is molded only from the polyester resin (B); and Y is a lightness of a 2-mm thick plate which is molded from the melt blend (C). By regulating the phosphorus concentration and the polyamide resin (A) content so as to meet the limitation of formula 1, the polyester-based resin composition and a shaped article or packaging container made thereof are effectively prevented from the darkening due to the deposition of antimony metal despite the blending of a polyamide resin, thereby attaining a high clearness as defined by formula 2.
摘要翻译：本发明的聚酯类树脂组合物包含由聚酰胺树脂（A）和聚酯树脂（B）组成的熔融共混物（C）。聚酯类树脂组合物满足下式1和2：其中P是聚磷酰胺树脂（A）中磷化合物的磷原子浓度，ppm; C是熔融共混物（C）中的聚酰胺树脂（A）的含量％质量％。 X是仅由聚酯树脂（B）成型的2mm厚的板的亮度; Y是由熔融共混物（C）成型的2mm厚的板的亮度。通过调节磷浓度和聚酰胺树脂（A）含量以满足式1的限制，可以有效地防止聚酯类树脂组合物及其制成的成型制品或包装容器由于沉积锑而变黑尽管混合了聚酰胺树脂，从而获得如式2所定义的高清晰度。

3. 发明授权

US06723443B2 Nylon polymer blends and films made therefrom 失效
标题翻译：尼龙聚合物共混物和由其制成的薄膜
公开(公告)号：US06723443B2
公开(公告)日：2004-04-20
申请号：US09990222
申请日：2001-11-21
申请人： Mingliang L. Tsai , Murali K. Akkapeddi , Clark V. Brown , Darnell C. Worley, II
发明人： Mingliang L. Tsai , Murali K. Akkapeddi , Clark V. Brown , Darnell C. Worley, II
IPC分类号： C08L7700
CPC分类号： C08L79/02 , C08G2650/56 , C08L71/00 , C08L77/00 , C08L77/06 , Y10T428/31562 , Y10T428/31685 , Y10T428/31739 , C08L2666/20 , C08L79/08
摘要： This invention relates to blends of nylon homopolymers and copolymers with poly(hydroxyamino ether) polymers. More particularly, there are provided blends of nylon 6 and its copolymers with poly(hydroxyamino ether) which form films having high miscibility, high clarity and good processability.
摘要翻译：本发明涉及尼龙均聚物和共聚物与聚（羟基氨基醚）聚合物的共混物。更具体地，提供了尼龙6及其与聚（羟基氨基醚）的共聚物的混合物，其形成具有高混溶性，高透明度和良好加工性能的膜。

4. 发明授权

US06699929B2 Die attach adhesives with vinyl ether and carbamate or urea functionality 失效
标题翻译：用乙烯基醚和氨基甲酸酯或脲官能团附着粘合剂
公开(公告)号：US06699929B2
公开(公告)日：2004-03-02
申请号：US09927242
申请日：2001-08-10
申请人： Osama M. Musa , Donald E. Herr
发明人： Osama M. Musa , Donald E. Herr
IPC分类号： C08L7700
CPC分类号： C08G18/6715 , C09J175/16
摘要： Compounds with both vinyl ether and carbamate, thiocarbamate or urea functionality are suitable for use in microelectronics applications and show enhanced adhesive strength compared to compounds that do not contain carbamate, thiocarbamate or urea functionality.
摘要翻译：具有乙烯基醚和氨基甲酸酯，硫代氨基甲酸酯或脲官能团的化合物适用于微电子应用，并且与不含氨基甲酸酯，硫代氨基甲酸酯或脲官能团的化合物相比，具有增强的粘合强度。

5. 发明授权

US06673867B1 Heat-resistant engineering plastic resin composition and molded article obtained therefrom 有权
标题翻译：耐热工程塑料树脂组合物和由其获得的模塑制品
公开(公告)号：US06673867B1
公开(公告)日：2004-01-06
申请号：US09959891
申请日：2001-11-13
申请人： Hiroshi Hayami , Shinya Nishikawa
发明人： Hiroshi Hayami , Shinya Nishikawa
IPC分类号： C08L7700
CPC分类号： C08J7/123 , C08F257/02 , C08F283/00 , C08F283/04 , C08F283/08 , C08F285/00 , C08F289/00 , C08G63/916 , C08J3/24 , C08J3/246 , C08J3/28 , C08J7/12 , C08K5/0008 , C08K5/0025 , C08K5/37 , C08L25/08 , C08L25/12 , C08L33/14 , C08L35/06 , C08L51/003 , C08L51/08 , C08L67/02 , C08L71/12 , C08L71/126 , C08L101/02 , C08L101/06 , C08L25/06 , C08L2666/04 , C08L77/00 , C08L2666/02 , C08L2666/14 , C08L2666/22
摘要： A heat-resistant engineering-plastic composition that satisfies a soldering-heat resistance of 260° C. for 10 to 60 secs., that is less costly, that is free of problems in injection molding process, and that is excellent in heat-aging resistance. A heat-resistant molded product made with the heat-resistant engineering-plastic composition, such as a connector mounted on printed circuit board. The heat-resistant molded product is produced by (a) melt-kneading (a1) an engineering plastic either having or introduced an active site for reacting with a specific functional group and (a2) either an organic compound that has both the said specific functional group and a polymerizing functional group in the same molecule or polyolefin that has the said specific functional group described in (a1) to obtain a resin composition, (b) melt-molding the resin composition comprising of (a), and (c) irradiating the melt-molded resin composition with ionizing radiation.
摘要翻译：一种耐热工程塑料组合物，其耐候性为260℃，持续10至60秒，成本较低，注塑成型过程中没有问题，并且热老化性能优异抵抗性。由耐热工程塑料组合物制成的耐热成型产品，例如安装在印刷电路板上的连接器。耐热成型体通过（a）熔融捏合（a1）具有或引入与特定官能团反应的活性部位的工程塑料，（a2）具有所述特定官能团的有机化合物（a）中记载的具有上述特定官能团的聚合性官能团和聚合官能团，得到树脂组合物，（b）熔融成型由（a）和（c）照射的树脂组合物具有电离辐射的熔融模塑树脂组合物。

6. 发明授权

US06548181B2 Flexible polyamide composition 有权
公开(公告)号：US06548181B2
公开(公告)日：2003-04-15
申请号：US09962146
申请日：2001-09-26
申请人： Guido P. C. Beusen
发明人： Guido P. C. Beusen
IPC分类号： C08L7700
CPC分类号： C08L77/00 , C08L13/00 , C08L77/02 , C08L77/06 , Y10T428/31728 , Y10T428/31732 , C08L2666/08
摘要： The invention relates to a flexible polyamide composition containing at least 50 parts by weight of non-cross-linked rubber per 50 parts by weight of polyamide and the production thereof. The polyamide has a molecular weight such that the melt viscosity at the processing temperature is at most 300 pa.s, preferably at most 200 pa.s. The rubber's Mooney viscosity is at least 40, most preferable is a rubber with a Mooney viscosity of at least 60. The rubber has been functionalized. Preferably a combination of a functionalized and a non-functionalized rubber is used. The rubber particles in the polyamide matrix have a particle size of at most 5 &mgr;m, preferably at most 3 &mgr;m.

7. 发明授权

US06414081B1 Compatibilized blends of non-polar thermoplastic elastomers and polar thermoplastic polymers 失效
标题翻译：非极性热塑性弹性体和极性热塑性聚合物的相容共混物
公开(公告)号：US06414081B1
公开(公告)日：2002-07-02
申请号：US09555036
申请日：2000-05-23
申请人： Trazollah Ouhadi
发明人： Trazollah Ouhadi
IPC分类号： C08L7700
CPC分类号： C08L53/02 , C08L23/10 , C08L23/16 , C08L23/28 , C08L27/16 , C08L51/06 , C08L53/025 , C08L75/08 , C08L77/00 , C08L2205/03 , C08L2205/035 , C08L2205/08 , C08L2666/24 , C08L2666/02 , C08L2666/20 , C08L2666/04 , C08L2666/14
摘要： The invention relates to compatibilized blends comprising a non-polar thermoplastic elastomer, a polar thermoplastic polymer selected from thermoplastic polyurethane (TPU), chloro containing polymers, fluoro containing polymers, polyesters, acrylonitrile-butadiene-styrene copolymers, styrene-acrylonitrile copolymers, styrene-maleic anhydride copolymer, polyacetal, polycarbonate, polyphenylene oxide, and a suitable compatibilizer.
摘要翻译：本发明涉及包含非极性热塑性弹性体的增容共混物，选自热塑性聚氨酯（TPU），含氯聚合物，含氟聚合物，聚酯，丙烯腈 - 丁二烯 - 苯乙烯共聚物，苯乙烯 - 丙烯腈共聚物，苯乙烯 - 马来酸的极性热塑性聚合物酸酐共聚物，聚缩醛，聚碳酸酯，聚苯醚和合适的增容剂。

8. 发明授权

US06414064B1 Polyamide resin composition 有权
标题翻译：聚酰胺树脂组合物
公开(公告)号：US06414064B1
公开(公告)日：2002-07-02
申请号：US09949908
申请日：2001-09-12
申请人： Hideharu Matsuoka , Hideaki Oka , Shigeru Sasaki
发明人： Hideharu Matsuoka , Hideaki Oka , Shigeru Sasaki
IPC分类号： C08L7700
CPC分类号： C08L77/00 , C08L25/18 , C08L77/02 , C08L77/06 , C08L25/00
摘要： The polyamide resin composition of the present invention comprises 100 parts by weight of a polyamide resin (A) having dicarboxylic acid units (a) comprising from 60 to 100 mol % of terephthalic acid repeat units and diamine units (b) comprising from 60 to 100 mol % of C6-18 aliphatic alkylenediamine repeat units, and from 1 to 100 parts by weight of a polybromostyrene (B), comprising from 0.5 to 100% by weight of a polybromostyrene having an epoxy group. Molded articles prepared from the polyamide resin composition of the present invention have good flame retardancy, good chemical resistance, good surface appearance and good blistering resistance.
摘要翻译：本发明的聚酰胺树脂组合物包含100重量份具有二羧酸单元（a）的聚酰胺树脂（A），其包含60至100摩尔％的对苯二甲酸重复单元和二胺单元（b），其包含60至100 mol％的C 6-18脂族亚烷基二胺重复单元，和1至100重量份的聚溴苯乙烯（B），其包含0.5至100重量％的具有环氧基的聚溴苯乙烯。由本发明的聚酰胺树脂组合物制备的模制品具有良好的阻燃性，良好的耐化学性，良好的表面外观和良好的起泡性。

9. 发明授权

US06372859B1 Thermoresistance adhesive and semiconductor device using the same 失效
标题翻译：耐热粘合剂和使用其的半导体器件
公开(公告)号：US06372859B1
公开(公告)日：2002-04-16
申请号：US09424550
申请日：1999-11-26
申请人： Touichi Sakata , Hiroshi Nishizawa , Keizo Hirai , Kenji Suzuki
发明人： Touichi Sakata , Hiroshi Nishizawa , Keizo Hirai , Kenji Suzuki
IPC分类号： C08L7700
CPC分类号： C09J9/00 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L2224/32014 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2924/01012 , H01L2924/01015 , H01L2924/01021 , H01L2924/01039 , H01L2924/01057 , H01L2924/01079 , H01L2924/10253 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermoresistance adhesive which does not dissolve in the sealer-composing resins at the sealer molding temperature and is capable of providing a semiconductor chip/lead frame adhesive strength under shear of 1 N/4 mm2 or greater, and including, for example, amide, imide, ester or ether linkage is suited for use in producing thermoresistance adhesive solutions and thermoresistance resin pastes, and the semiconductor chips, lead frames, films, etc., made by using such an adhesive are suited for providing low-cost semiconductor devices.
摘要翻译：一种热封粘合剂，其在密封件成型温度下不溶解在密封剂组合树脂中，并且能够在1N / 4mm 2或更大的剪切下提供半导体芯片/引线框架粘合强度，并且包括例如酰胺，酰亚胺，酯或醚键适用于生产耐热粘合剂溶液和耐热树脂浆料，并且使用这种粘合剂制成的半导体芯片，引线框架，薄膜等适于提供低成本的半导体器件。

10. 发明授权

US06355723B1 Dark colored thermoplastic compositions, articles molded therefrom, and article preparation methods 有权
标题翻译：深色热塑性组合物，由其模制的制品和制品制备方法
公开(公告)号：US06355723B1
公开(公告)日：2002-03-12
申请号：US09599659
申请日：2000-06-22
申请人： Harry van Baal , Jenny Z. Bu , Peter J. Codella , Robert R. Gallucci , Dennis A. Kopp , Martin J. Lindway , James R. Wilson
发明人： Harry van Baal , Jenny Z. Bu , Peter J. Codella , Robert R. Gallucci , Dennis A. Kopp , Martin J. Lindway , James R. Wilson
IPC分类号： C08L7700
CPC分类号： F21V7/22 , C08K5/0041 , F21S41/37
摘要： A molded article suitable for direct application of a reflective metal coating includes an amorphous thermoplastic or thermoplastic blend having a glass transition temperature greater than about 170° C. and at least one thermally stable colorant that contributes to the article's dark appearance. The article has excellent dimensional stability, and the surface to which a metal coating can be applied exhibits low gloss. Application of a metal coating to the molded article produces a metalized surface with high total reflectivity, low diffuse reflectivity, and low haze. Compositions and methods for forming the article are described.
摘要翻译：适于直接应用反射金属涂层的模塑制品包括玻璃化转变温度大于约170℃的无定型热塑性或热塑性共混物，以及有助于制品黑暗外观的至少一种热稳定着色剂。该制品具有优异的尺寸稳定性，并且可以施加金属涂层的表面显示低光泽度。将金属涂层应用于成型制品产生具有高总反射率，低漫反射率和低雾度的金属化表面。描述用于形成制品的组合物和方法。

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