会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明授权
    • Process for making a contact betwen a capacitor electrode disposed in a
trench and an MOS transistor source/drain region disposed outside the
trench
    • 在设置在沟槽中的电容器电极和设置在沟槽外部的MOS晶体管源极/漏极区之间进行接触的工艺
    • US5432115A
    • 1995-07-11
    • US284502
    • 1994-08-04
    • Wolfgang RosnerFranz HofmannLothar Risch
    • Wolfgang RosnerFranz HofmannLothar Risch
    • H01L21/76H01L21/8242H01L27/10H01L27/108
    • H01L27/10861H01L27/10829
    • To make a contact between a capacitor electrode (13) disposed in a trench (11) and an MOS transistor source/drain region disposed outside the trench, a shallow etching is carried out in a self-aligned manner with respect to a field-oxide region insulating the MOS transistor by producing the trench (11) in a substrate (1). After forming an Si.sub.3 N.sub.4 spacer (10) at the edge (8), laid bare during the etching, of the substrate (1) the part laid bare of the field-oxide region (2) is first removed with the aid of a mask and the trench (11) is completed in a further etching. The contact is produced after the formation of an SiO.sub.2 layer (12) at the surface of the trench (11) after removing the Si.sub.3 N.sub.4 spacer (10) and producing the capacitor electrode (13) at the edge (8), laid bare by removing the Si.sub.3 N.sub.4 spacer (10), of the substrate (1).
    • PCT No.PCT / DE93 / 00078 Sec。 371日期:1994年8月4日 102(e)日期1994年8月4日PCT提交1993年2月1日PCT公布。 出版物WO93 / 16490 日期:1993年8月19日。为了在布置在沟槽(11)中的电容器电极(13)和设置在沟槽外部的MOS晶体管源/漏区之间进行接触,以自对准的方式进行浅蚀刻 相对于通过在衬底(1)中产生沟槽(11)来绝缘MOS晶体管的场氧化物区域。 在蚀刻过程中在边缘(8)处形成Si3N4间隔物(10)之后,在衬底(1)上放置裸露的场氧化物区域(2)的部分首先借助掩模去除, 在另外的蚀刻中完成沟槽(11)。 在除去Si 3 N 4间隔物(10)之后在沟槽(11)的表面形成SiO 2层(12)并在边缘(8)处产生电容器电极(13),在通过去除 (1)的Si 3 N 4间隔物(10)。
    • 9. 发明授权
    • SRAM cell configuration and method for its fabrication
    • SRAM单元配置及其制造方法
    • US6038164A
    • 2000-03-14
    • US200071
    • 1998-11-25
    • Thomas SchulzThomas AeugleWolfgang RosnerLothar Risch
    • Thomas SchulzThomas AeugleWolfgang RosnerLothar Risch
    • H01L21/8244H01L27/11G11C11/00
    • H01L27/11H01L27/1104
    • The SRAM cell configuration has at least six transistors in each memory cell. Four of the transistors form a flip-flop and they are arranged at the corners of a quadrilateral. The flip-flop is driven by two of the transistors, which are disposed so as to adjoin diagonally opposite corners of the quadrilateral and outside the quadrilateral. Adjacent memory cells along a word line can be arranged in such a way that a first bit line and a second bit line of the adjacent memory cells coincide. The transistors are preferably vertical and are arranged at semiconductor structures (St1, St2, St3, St4, St5, St6) produced from a layer sequence. Two of the transistors having n-doped channel regions are preferably formed in each case on two semiconductor structures.
    • SRAM单元配置在每个存储单元中具有至少六个晶体管。 四个晶体管形成触发器,并且它们被布置在四边形的角部。 触发器由两个晶体管驱动,这些晶体管被设置为邻接四边形的对角线相对的角部并且在四边形之外。 沿着字线的相邻存储器单元可以以相邻存储器单元的第一位线和第二位线重合的方式布置。 晶体管优选是垂直的,并且被布置在从层序列产生的半导体结构(St1,St2,St3,St4,St5,St6)处。 在每种情况下,优选在两个半导体结构上形成具有n掺杂沟道区的两个晶体管。