专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06412971B1 Light source including an array of light emitting semiconductor devices and control method 有权
标题翻译：光源包括一组发光半导体器件和控制方法
公开(公告)号：US06412971B1
公开(公告)日：2002-07-02
申请号：US09258935
申请日：1999-03-01
申请人： Robert John Wojnarowski , Barry Scott Whitmore , William Paul Kornrumpf
发明人： Robert John Wojnarowski , Barry Scott Whitmore , William Paul Kornrumpf
IPC分类号： H01L3300
CPC分类号： H01L24/10 , F21K9/232 , F21Y2107/30 , F21Y2115/10 , H01L21/3043 , H01L21/76898 , H01L21/78 , H01L24/13 , H01L25/0652 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/48227 , H01L2224/48465 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , Y10S362/80 , H01L2924/00 , H01L2224/05599
摘要： A light source includes a substrate; an array of un-packaged light emitting semiconductor devices (LESDs), each of the LESDs having at least one surface for emitting light and a substrate surface being attached to the substrate; and a plurality of electrical connections, each electrical connection coupled for providing electrical power to a respective LESD. The LESDs are arranged on the substrate with sufficient density and light generating capability to provide a predetermined irradiation from the light source.
摘要翻译：光源包括基板; 一组未封装的发光半导体器件（LESD），每个LESD具有至少一个用于发光的表面和一个衬底表面附着于衬底; 以及多个电连接，每个电连接用于向相应的LESD提供电力。 LESD被布置在具有足够的密度和光产生能力的基板上，以提供来自光源的预定辐射。

2. 发明授权

US06262573B1 Electromagnetic system for railroad track crack detection and traction enhancement 失效
标题翻译：铁路轨道裂纹检测和牵引力增强电磁系统
公开(公告)号：US06262573B1
公开(公告)日：2001-07-17
申请号：US09397839
申请日：1999-09-17
申请人： Robert John Wojnarowski , Kenneth Brakeley Welles, II , William Paul Kornrumpf
发明人： Robert John Wojnarowski , Kenneth Brakeley Welles, II , William Paul Kornrumpf
IPC分类号： B61K910
CPC分类号： B61L23/044 , B61K9/10 , B61L3/121 , B61L25/025 , B61L2205/04 , G01M5/0025 , G01M5/0033 , G01M5/0091 , G01N27/82
摘要： An electromagnetic system for detecting cracked rail and enhancing traction when necessary, includes wiring coils around wheel axles, and a corresponding power source for supplying power to the coils for producing electromagnetic flux. The produced electromagnetic flux is routed through the wheel axles, wheels and rails in a closed circuit. When a cracked rail is encountered along the route, the circuit will be interrupted or open, resulting in a changed flux pattern. This pattern change is detected by a flux sensor, and the geographic location of the crack in the rail is determined. The electromagnetic system further includes an electromagnetic wheel loading means for generating an attraction to the rails. The generated attraction to the rails increases friction between the wheels and the rails, thereby increasing traction to enable hauling greater loads up steep grades.
摘要翻译：一种用于检测裂纹轨道并在必要时增强牵引力的电磁系统包括轮轴周围的线圈线圈和用于向线圈供电以产生电磁通量的相应电源。所产生的电磁通量在闭合回路中通过轮轴，轮子和轨道。沿着路线遇到破裂的轨道时，电路将被中断或打开，导致通量变化曲线的变化。这种模式变化由通量传感器检测，并确定轨道中裂纹的地理位置。电磁系统还包括用于产生对轨道的吸引力的电磁轮加载装置。所产生的对轨道的吸引力增加了车轮和轨道之间的摩擦，从而增加了牵引力，从而能够将更大的载荷牵引到陡坡上。

3. 发明授权

US06188301B1 Switching structure and method of fabrication 有权
标题翻译：开关结构和制造方法
公开(公告)号：US06188301B1
公开(公告)日：2001-02-13
申请号：US09192103
申请日：1998-11-13
申请人： William Paul Kornrumpf , Robert John Wojnarowski
发明人： William Paul Kornrumpf , Robert John Wojnarowski
IPC分类号： H01P110
CPC分类号： H01H1/0036 , H01H61/0107 , H01H2001/0042 , H01H2001/0073 , H01H2001/0084 , H01H2061/006 , Y10T29/49105 , Y10T29/49128 , Y10T29/49155
摘要： A switch structure having a base surface; a first high density interconnect (HDI) plastic interconnect layer overlying the base surface layer; a cavity within the HDI plastic interconnect layer; at least one patterned shape memory alloy (SMA) layer overlying the HDI plastic interconnect layer and the cavity, and at least one patterned conductive layer over the at least one patterned SMA layer; a fixed contact pad within the cavity and attached to the base surface and a movable contact pad attached to a portion of the first patterned SMA layer within the cavity such that when the first and second patterned SMA layers and the first and second patterned metallized layers are in a first stable position, the movable contact pad touches the fixed contact pad, thereby providing an electrical connection and forming a closed switch. The structure has a second stable position in which the SMA and metallized layers are flexed away from the cavity so that the contact pads are not in contact and form an open switch.
摘要翻译：具有基面的开关结构; 覆盖基底表面层的第一高密度互连（HDI）塑料互连层; HDI塑料互连层内的空腔; 覆盖HDI塑料互连层和空腔的至少一个图案形状记忆合金（SMA）层，以及至少一个图案化的SMA层上的至少一个图案化导电层; 空腔内的固定接触焊盘并附接到基体表面，以及可移动接触垫，其附接到空腔内的第一图案化SMA层的一部分，使得当第一和第二图案化SMA层和第一和第二图案化金属化层为在第一稳定位置，可动接触垫接触固定接触垫，由此提供电连接并形成闭合的开关。该结构具有第二稳定位置，其中SMA和金属化层从空腔弯曲，使得接触焊盘不接触并形成开放的开关。

4. 发明授权

US06655011B1 Method for fabricating a switch structure 有权
标题翻译：开关结构的制造方法
公开(公告)号：US06655011B1
公开(公告)日：2003-12-02
申请号：US09677718
申请日：2000-10-02
申请人： William Paul Kornrumpf , Robert John Wojnarowski
发明人： William Paul Kornrumpf , Robert John Wojnarowski
IPC分类号： H01H1100
CPC分类号： H01H1/0036 , H01H61/0107 , H01H2001/0042 , H01H2001/0073 , H01H2001/0084 , H01H2061/006 , Y10T29/49105 , Y10T29/49128 , Y10T29/49155
摘要： A switch structure having a base surface; a first high density interconnect (HDI) plastic interconnect layer overlying the base surface layer; a cavity within the HDI plastic interconnect layer; at least one patterned shape memory alloy (SMA) layer overlying the HDI plastic interconnect layer and the cavity, and at least one patterned conductive layer over the at least one patterned SMA layer; a fixed contact pad within the cavity and attached to the base surface and a movable contact pad attached to a portion of the first patterned SMA layer within the cavity such that when the first and second patterned SMA layers and the first and second patterned metallized layers are in a first stable position, the movable contact pad touches the fixed contact pad, thereby providing an electrical connection and forming a closed switch. The structure has a second stable position in which the SMA and metallized layers are flexed away from the cavity so that the contact pads are not in contact and form an open switch.
摘要翻译：具有基面的开关结构; 覆盖基底表面层的第一高密度互连（HDI）塑料互连层; HDI塑料互连层内的空腔; 覆盖HDI塑料互连层和空腔的至少一个图案形状记忆合金（SMA）层，以及至少一个图案化的SMA层上的至少一个图案化导电层; 空腔内的固定接触焊盘并附接到基体表面，以及可移动接触垫，其附接到空腔内的第一图案化SMA层的一部分，使得当第一和第二图案化SMA层和第一和第二图案化金属化层为在第一稳定位置，可动接触垫接触固定接触垫，由此提供电连接并形成闭合的开关。该结构具有第二稳定位置，其中SMA和金属化层从空腔弯曲，使得接触焊盘不接触并形成开放的开关。

5. 发明授权

US06987619B2 Lens array package and fabrication method 有权
标题翻译：透镜阵列封装及制作方法
公开(公告)号：US06987619B2
公开(公告)日：2006-01-17
申请号：US10815908
申请日：2004-03-31
申请人： William Paul Kornrumpf , Samhita Dasgupta , Brian Scott Leininger , Charles John Kryzak
发明人： William Paul Kornrumpf , Samhita Dasgupta , Brian Scott Leininger , Charles John Kryzak
IPC分类号： G02B27/10 , G02B6/36 , G02B6/32 , G01D5/34
CPC分类号： G02B3/0075 , G02B6/4206 , G02B6/4228 , G02B6/43 , H01S5/005 , H01S5/02284 , H01S5/423
摘要： An optical lens structure includes a substantially transparent substrate a lens array attached to the substrate with lenses of the lens array situated opposite the substrate and packaging material surrounding at least the periphery of the lens array, the packaging material including at least two alignment holes which are aligned with respect to positions of the lenses. In one example, the structure is fabricated by attaching a lens array to a substrate with lenses of the lens array situated opposite the substrate, surrounding a periphery of the lens array with a packaging material, the packaging material being attached to the substrate, planarizing the packaging material, and providing alignment holes through the packaging material.
摘要翻译：光学透镜结构包括基本上透明的基板，透镜阵列，其附接到基板，透镜阵列的透镜位于与基板相对的透镜阵列和至少围绕透镜阵列周围的包装材料上，该包装材料包括至少两个对准孔，对准镜片的位置。在一个示例中，通过将透镜阵列附接到基底上而制造结构，透镜阵列的透镜位于与基底相对的透镜阵列周围，用包装材料围绕透镜阵列的外围，该包装材料附着到基底上，包装材料，并提供穿过包装材料的对准孔。

6. 发明授权

US06559389B1 High-density cable and method therefor 有权
标题翻译：高密度电缆及其方法
公开(公告)号：US06559389B1
公开(公告)日：2003-05-06
申请号：US09617941
申请日：2000-08-25
申请人： William Paul Kornrumpf , Lowell Scott Smith , Douglas Glenn Wildes
发明人： William Paul Kornrumpf , Lowell Scott Smith , Douglas Glenn Wildes
IPC分类号： H05K103
CPC分类号： H05K1/118 , H01B7/0892 , Y10T29/49124
摘要： A high-density cable of a type suitable for transmitting ultrasound signals from an ultrasonic probe to multiplexing circuitry during a medical ultrasound procedure is provided. The cable includes one or more flexible circuits arranged within a flexible sheath that surrounds and confines the flexible circuits. Each flexible circuit includes an elongate flexible substrate with oppositely-disposed surfaces and multiple conductors on at least one of these surfaces. The opposing longitudinal ends of the substrate define integral connectors for connecting with respective output connectors and/or electronic devices, such as an ultrasonic probe or multiplexing circuitry.
摘要翻译：提供了一种适用于在医疗超声程序期间将超声波信号从超声波探头发射到复用电路的高密度电缆。电缆包括布置在柔性护套内的柔性电路，其围绕并限制柔性电路。每个柔性电路包括具有相对布置的表面的细长柔性基板和在这些表面中的至少一个上的多个导体。衬底的相对的纵向端部限定了用于与相应的输出连接器和/或诸如超声波探头或多路复用电路的电子设备连接的整体连接器。

7. 发明授权

US06916290B2 In situ tumor temperature profile measuring probe and method 失效
标题翻译：原位肿瘤温度曲线测量探针和方法
公开(公告)号：US06916290B2
公开(公告)日：2005-07-12
申请号：US10090576
申请日：2002-03-05
申请人： Kristina Helena Valborg Hedengren , William Paul Kornrumpf , Mark Lloyd Miller , Egidijus Edward Uzgiris
发明人： Kristina Helena Valborg Hedengren , William Paul Kornrumpf , Mark Lloyd Miller , Egidijus Edward Uzgiris
IPC分类号： A61B5/00 , A61B5/01 , G01K7/00
CPC分类号： A61B5/01
摘要： An in situ breast tumor temperature profile measuring probe includes a rod, thermal sensors and electrical output leads. The thermal sensors are formed in spaced apart holes in an outer insulating layer of the rod and a common electrical input lead to provide an electrical input signal to the thermal sensors is disposed below and has portions exposed at the holes and electrically connected to the thermal sensors. The thermal sensors receive the electrical input signal from the common electrical input lead, sense the temperature of biological matter adjacent to the thermal sensors and produce an electrical output signal correlated thereto. Each electrical output lead mounted to the outer insulating layer is in electrical contact with a different one of the thermal sensors to receive the electrical output signal from the one thermal sensor and output the same.
摘要翻译：原位乳腺肿瘤温度剖面测量探头包括杆，热传感器和电输出引线。热传感器形成在杆的外部绝缘层中的间隔开的孔中，并且公共电输入引线提供到热传感器的电输入信号设置在下方并且具有暴露在孔处的部分并电连接到热传感器。热传感器接收来自公共电输入引线的电输入信号，感测与热传感器相邻的生物物质的温度，并产生与之相关的电输出信号。安装到外绝缘层的每个电输出引线与不同的一个热传感器电接触，以接收来自一个热传感器的电输出信号并输出。

8. 发明授权

US5865163A Dicing saw alignment for array ultrasonic transducer fabrication 失效
标题翻译：切割锯对准阵列超声波换能器制造
公开(公告)号：US5865163A
公开(公告)日：1999-02-02
申请号：US938795
申请日：1997-09-26
申请人： Douglas Glenn Wildes , Kenneth Brakeley Welles, II , William Paul Kornrumpf
发明人： Douglas Glenn Wildes , Kenneth Brakeley Welles, II , William Paul Kornrumpf
IPC分类号： B06B1/06 , H01L21/78 , B28D1/06
CPC分类号： H01L21/78 , B06B1/0622 , Y10T29/42 , Y10T29/49016
摘要： An array ultrasonic transducer precursor includes a body of piezoelectric material with a dielectric substrate bonded to a surface of the body. Circuit elements supported on the dielectric substrate include, in an active region, physically parallel signal conductors arranged in a pattern with spaces between adjacent ones of the conductors. Dicing saw cuts made in these spaces define individual circuit elements within the piezoelectric body. The circuit elements outside the active region include a set of resistive alignment elements in predetermined positions with reference to the pattern of signal conductors. The transducer precursor is mounted in a dicing saw fixture, and initial cuts made with the dicing saw remove portions of the resistive alignment elements. Locations of the initial cuts with reference to the resistive alignment elements are determined by measuring resistances of the resistive alignment elements after the initial cuts.
摘要翻译：阵列超声波换能器前体包括压电材料体，其中电介质基底结合到主体的表面。支撑在电介质基片上的电路元件在有源区域中包括物理上平行的信号导体，其布置成具有在相邻导体之间的间隔的图案。在这些空间中制成的切割锯切口限定了压电体内的各个电路元件。有源区域之外的电路元件包括参考信号导体图案的预定位置的一组电阻对准元件。换能器前体安装在切割锯夹具中，用切割锯制成的初始切口去除电阻对准元件的部分。参考电阻对准元件的初始切割的位置通过在初始切割之后测量电阻对准元件的电阻来确定。

9. 发明授权

US5653841A Fabrication of compact magnetic circulator components in microwave packages using high density interconnections 失效
标题翻译：使用高密度互连在微波封装中制造紧凑型磁环行器组件
公开(公告)号：US5653841A
公开(公告)日：1997-08-05
申请号：US421180
申请日：1995-04-13
申请人： Vikram Bidare Krishnamurthy , Kyung Wook Paik , Mario Ghezzo , William Paul Kornrumpf , Eric Joseph Wildi
发明人： Vikram Bidare Krishnamurthy , Kyung Wook Paik , Mario Ghezzo , William Paul Kornrumpf , Eric Joseph Wildi
IPC分类号： H01P1/387 , H01P11/00 , H05K1/02 , H05K1/16 , H05K1/18 , B29C65/48 , B05D5/12 , B32B31/12 , H01P1/383
CPC分类号： H01P1/387 , H01P11/00 , H05K1/0237 , H05K1/16 , H05K1/182 , Y10T29/4913 , Y10T29/49165
摘要： A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.
摘要翻译：使用微波高密度互连（HDI）结构将磁性循环器结合到多芯片模块中。预先包装的循环器可以插入现成的高密度互连多芯片模块中; 该预包装循环器可以使用具有在信号线上方和下方具有两个接地层的信号线的带状线设计，或者具有在信号线下方具有一个信号线和一个接地层的微带传输线设计。或者，循环器可以直接制造在具有带状线或微带传输线设计的高密度互连多芯片模块中。

10. 发明授权

US6084174A Method for detecting temperature gradients in biological tissue using a thermocouple array 有权
标题翻译：使用热电偶阵列检测生物组织温度梯度的方法
公开(公告)号：US6084174A
公开(公告)日：2000-07-04
申请号：US313531
申请日：1999-05-12
申请人： Kristina Helena Valborg Hedengren , William Paul Kornrumpf , Mark Lloyd Miller
发明人： Kristina Helena Valborg Hedengren , William Paul Kornrumpf , Mark Lloyd Miller
IPC分类号： G01K3/14 , G01K7/02 , H01L35/20 , H01L35/32 , H01L35/34
CPC分类号： G01K3/14 , G01K7/02 , H01L35/20 , H01L35/32
摘要： A thermocouple array includes a dielectric layer having via openings therethrough, a first patterned conductive layer facing one surface of the dielectric layer, and a second patterned conductive layer facing another surface of the dielectric layer. Portions of the second patterned conductive layer can extend through the via openings to couple respective portions of the first patterned conductive layer. The second patterned conductive layer has a different thermal emf than the first patterned conductive layer. The dielectric layer, the first patterned conductive layer, and the second patterned conductive layer can be surface-conformable.
摘要翻译：热电偶阵列包括具有穿过其中的通路开口的电介质层，面向电介质层的一个表面的第一图案化导电层和面向电介质层另一表面的第二图案化导电层。第二图案化导电层的一部分可以延伸穿过通路开口以耦合第一图案化导电层的相应部分。第二图案化导电层具有与第一图案化导电层不同的热emf。电介质层，第一图案化导电层和第二图案化导电层可以是表面一致的。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式