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1. 发明授权

US06233149B1 High power inverter air cooling 失效
标题翻译：大功率变频器空气冷却
公开(公告)号：US06233149B1
公开(公告)日：2001-05-15
申请号：US08839113
申请日：1997-04-23
申请人： Ronald Barry Bailey , Vinod Kumar Singh , Wayne Alexander Kennedy , Eric Joseph Wildi
发明人： Ronald Barry Bailey , Vinod Kumar Singh , Wayne Alexander Kennedy , Eric Joseph Wildi
IPC分类号： H05K720
CPC分类号： H05K7/20918 , H01L25/115 , H01L2924/0002 , H02M7/003 , H01L2924/00
摘要： An electrically powered vehicle includes an inverter mounted in the vehicle, the inverter having a plurality of high power IGBT modules for converting DC power to AC power for application to a plurality of AC electric motors connected in driving relationship to wheels on the vehicle. Each of the IGBT modules is mounted in thermal transfer relationship to an electrically isolated base plate and each base plate has a plurality of closely spaced, parallel slots formed across one surface with a plurality of fins fitted into the slots and extending from the base plate. The system includes apparatus for mounting the IGBT modules to a wall separating an electronics compartment from an air supply and air exhaust compartment. Air from an air supply plenum in the air supply compartment is directed into the fins extending from the IGBT base plate and exhaust through an exhaust conduit. The vehicle includes a blower to force air to flow through the fins extending from the base plate.
摘要翻译：一种电动车辆包括安装在车辆中的逆变器，该逆变器具有多个用于将DC电力转换为AC电力的大功率IGBT模块，用于应用于与车辆上的车轮的驱动关系连接的多个AC电动机。每个IGBT模块以热传递关系安装到电隔离的基板，并且每个基板具有跨越一个表面形成的多个紧密间隔的平行的狭槽，其中多个翼片装配到槽中并从基板延伸。该系统包括用于将IGBT模块安装到将电子设备隔室与空气供应和排气隔间分隔开的壁的装置。空气供给室中的空气供给室的空气被引导到从IGBT基板延伸的散热片中，并通过排气导管排出。车辆包括鼓风机，以迫使空气流过从基板延伸的翅片。

2. 发明授权

US5653841A Fabrication of compact magnetic circulator components in microwave packages using high density interconnections 失效
标题翻译：使用高密度互连在微波封装中制造紧凑型磁环行器组件
公开(公告)号：US5653841A
公开(公告)日：1997-08-05
申请号：US421180
申请日：1995-04-13
申请人： Vikram Bidare Krishnamurthy , Kyung Wook Paik , Mario Ghezzo , William Paul Kornrumpf , Eric Joseph Wildi
发明人： Vikram Bidare Krishnamurthy , Kyung Wook Paik , Mario Ghezzo , William Paul Kornrumpf , Eric Joseph Wildi
IPC分类号： H01P1/387 , H01P11/00 , H05K1/02 , H05K1/16 , H05K1/18 , B29C65/48 , B05D5/12 , B32B31/12 , H01P1/383
CPC分类号： H01P1/387 , H01P11/00 , H05K1/0237 , H05K1/16 , H05K1/182 , Y10T29/4913 , Y10T29/49165
摘要： A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.
摘要翻译：使用微波高密度互连（HDI）结构将磁性循环器结合到多芯片模块中。预先包装的循环器可以插入现成的高密度互连多芯片模块中; 该预包装循环器可以使用具有在信号线上方和下方具有两个接地层的信号线的带状线设计，或者具有在信号线下方具有一个信号线和一个接地层的微带传输线设计。或者，循环器可以直接制造在具有带状线或微带传输线设计的高密度互连多芯片模块中。

3. 发明授权

US5776275A Fabrication of compact magnetic circulator components in microwave packages using high density interconnections 失效
标题翻译：使用高密度互连在微波封装中制造紧凑型磁环行器组件
公开(公告)号：US5776275A
公开(公告)日：1998-07-07
申请号：US734558
申请日：1996-10-21
申请人： Vikram Bidare Krishnamurthy , Kyung Wook Paik , Mario Ghezzo , William Paul Kornrumpf , Eric Joseph Wildi
发明人： Vikram Bidare Krishnamurthy , Kyung Wook Paik , Mario Ghezzo , William Paul Kornrumpf , Eric Joseph Wildi
IPC分类号： H01P1/387 , H01P11/00 , H05K1/02 , H05K1/16 , H05K1/18 , B29C65/48 , H01P1/383
CPC分类号： H01P1/387 , H01P11/00 , H05K1/0237 , H05K1/16 , H05K1/182 , Y10T29/4913 , Y10T29/49165
摘要： A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.
摘要翻译：使用微波高密度互连（HDI）结构将磁性循环器结合到多芯片模块中。预先包装的循环器可以插入现成的高密度互连多芯片模块中; 该预包装循环器可以使用具有在信号线上方和下方具有两个接地层的信号线的带状线设计，或者具有在信号线下方具有一个信号线和一个接地层的微带传输线设计。或者，循环器可以直接制造在具有带状线或微带传输线设计的高密度互连多芯片模块中。

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