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1. 发明授权

US06974915B2 Printed wiring board interposer sub-assembly and method 失效
标题翻译：印刷电路板插件子组件及方法
公开(公告)号：US06974915B2
公开(公告)日：2005-12-13
申请号：US10979366
申请日：2004-11-01
申请人： William Louis Brodsky , Benson Chan , Michael Anthony Gaynes , Voya Rista Markovich
发明人： William Louis Brodsky , Benson Chan , Michael Anthony Gaynes , Voya Rista Markovich
IPC分类号： H05K3/32 , H05K1/16
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译：描述印刷电路板（PWB）子组件的细节及其制造方法。子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。子组件可以作为原始组件的一部分。子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。

2. 发明授权

US06892451B2 Method of making an interposer sub-assembly in a printed wiring board 失效
标题翻译：在印刷电路板中制作插入件子组件的方法
公开(公告)号：US06892451B2
公开(公告)日：2005-05-17
申请号：US10361659
申请日：2003-02-10
申请人： William Louis Brodsky , Benson Chan , Michael Anthony Gaynes , Voya Rista Markovich
发明人： William Louis Brodsky , Benson Chan , Michael Anthony Gaynes , Voya Rista Markovich
IPC分类号： H05K3/32 , H05K3/30
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译：描述印刷电路板（PWB）子组件的细节及其制造方法。子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。子组件可以作为原始组件的一部分。子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。

3. 发明授权

US06545226B2 Printed wiring board interposer sub-assembly 有权
标题翻译：印刷电路板插件子组件
公开(公告)号：US06545226B2
公开(公告)日：2003-04-08
申请号：US09871556
申请日：2001-05-31
申请人： William Louis Brodsky , Benson Chan , Michael Anthony Gaynes , Voya Rista Markovich
发明人： William Louis Brodsky , Benson Chan , Michael Anthony Gaynes , Voya Rista Markovich
IPC分类号： H05K111
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译：描述印刷电路板（PWB）子组件的细节及其制造方法。子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。子组件可以作为原始组件的一部分。子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。

4. 发明授权

US5785535A Computer system with surface mount socket 失效
标题翻译：具有表面安装插座的计算机系统
公开(公告)号：US5785535A
公开(公告)日：1998-07-28
申请号：US591206
申请日：1996-01-17
申请人： William Louis Brodsky , Benson Chan , Glenn Edward Myrto , John Henry Sherman
发明人： William Louis Brodsky , Benson Chan , Glenn Edward Myrto , John Henry Sherman
IPC分类号： G06F1/18 , H01L23/32 , H01R4/26 , H01R12/51 , H01R12/57 , H01R33/76 , H05K3/32 , H05K7/10 , H01R9/09
CPC分类号： H01R12/57 , H01R12/79 , H05K3/325 , H05K7/1061 , H01R4/26
摘要： A computer system having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate mounted in the computer system enclosure, along with a power supply, a bus system, and connectors for communicating with units external to the enclosure. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.
摘要翻译：具有能够更换表面安装部件的能力的计算机系统。组件通过弹簧朝向安装在计算机系统外壳中的基板上的区域阵列位置以及电源，总线系统和用于与外壳外部的单元通信的连接器而偏置。部件和弹簧定位在邻近区域阵列部位的基座内并用联接器机械地保持下来。提供了一种用于其的互连结构。

5. 发明授权

US06386890B1 Printed circuit board to module mounting and interconnecting structure and method 失效
标题翻译：印刷电路板到模块安装和互连结构和方法
公开(公告)号：US06386890B1
公开(公告)日：2002-05-14
申请号：US09804529
申请日：2001-03-12
申请人： Anilkumar Chinuprasad Bhatt , William Louis Brodsky , Benson Chan
发明人： Anilkumar Chinuprasad Bhatt , William Louis Brodsky , Benson Chan
IPC分类号： G01R1200
CPC分类号： H05K3/325 , H01R12/7047
摘要： The present invention provides a method and structure for connecting a module to a printed circuit board, wherein a substantially rigid interposer having resilient conductors is disposed between a module and a printed circuit board. A clamping means urges the module and printed circuit board toward each other with compressive force upon an interposer positioned therebetween, preferably causing the module and printed circuit board to deform and thereby align their electrical contacts with the surfaces of the interposer. The interposer further comprises a plurality of apertures, each aperture further having a deformable resilient conductor means for connecting a module contact to a PCB contact. The conductor is deformable in shear, which may travel and, therefore, makeup the CTE dimensional mismatch between the module and the PCB. The conductors are detachable, electrically connecting the module and PCB contacts without the requirement of solder or other permanent means.
摘要翻译：本发明提供一种用于将模块连接到印刷电路板的方法和结构，其中具有弹性导体的基本上刚性的插入件设置在模块和印刷电路板之间。夹紧装置通过压缩力将模块和印刷电路板朝向彼此朝向插入器定位在其间的优选地引导模块和印刷电路板变形，从而使它们的电触点与插入器的表面对齐。插入器还包括多个孔，每个孔还具有用于将模块接触件连接到PCB触点的可变形的弹性导体装置。导体可以在剪切中变形，其可以移动，并因此补偿模块和PCB之间的CTE尺寸失配。导体是可拆卸的，电连接模块和PCB触点，而不需要焊料或其他永久手段。

6. 发明授权

US6015301A Surface mount socket 失效
标题翻译：表面贴装插座
公开(公告)号：US6015301A
公开(公告)日：2000-01-18
申请号：US121452
申请日：1998-07-23
申请人： William Louis Brodsky , Benson Chan , Glenn Edward Myrto , John Henry Sherman
发明人： William Louis Brodsky , Benson Chan , Glenn Edward Myrto , John Henry Sherman
IPC分类号： G06F1/18 , H01L23/32 , H01R4/26 , H01R12/51 , H01R12/57 , H01R33/76 , H05K3/32 , H05K7/10 , H01R9/09
CPC分类号： H01R12/57 , H01R12/79 , H05K3/325 , H05K7/1061 , H01R4/26
摘要： A surface mount socket having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.
摘要翻译：具有能够更换表面安装部件的能力的表面安装插座。组件通过弹簧偏向衬底上的区域阵列位置。部件和弹簧定位在邻近区域阵列部位的基座内并用联接器机械地保持下来。提供了一种用于其的互连结构。

7. 发明申请

US20130033827A1 ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERCONNECTS 有权
标题翻译：用于多层设备互连的电导体粘合剂（ECA）
公开(公告)号：US20130033827A1
公开(公告)日：2013-02-07
申请号：US13198756
申请日：2011-08-05
申请人： Rabindra N. Das , Voya R. Markovich , John M. Lauffer , Roy H. Magnuson , Konstantinos I. Papathomas , Benson Chan
发明人： Rabindra N. Das , Voya R. Markovich , John M. Lauffer , Roy H. Magnuson , Konstantinos I. Papathomas , Benson Chan
IPC分类号： H05K5/00 , H05K1/09 , B23K31/02 , H05K1/00 , H01B1/00 , H01B1/02
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.
摘要翻译：用于连接多级Z轴互连的多层导电粘合剂（ECA）混合物和形成连接多级Z轴互连的ECA的方法。具有多层能力的ECA包含允许糊料适应特定要求的组成成分的混合物，其中制造电路化衬底组件的方法，其中具有潜在不同的热膨胀系数（CTE）的两个或更多个子组件对齐，并且Z- 在连接期间创建轴互连。导体的冶金和多层导电浆料的冶金被有效地混合，并且在配合子组件之间使用的可流动的中间电介质流动以接合和围绕导体耦合。

8. 发明申请

US20120260063A1 MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM 审中-公开
标题翻译：具有计算机系统的模块化，可分离的计算机叶片
公开(公告)号：US20120260063A1
公开(公告)日：2012-10-11
申请号：US13082599
申请日：2011-04-08
申请人： Voya R. Markovich , How T. Lin , Benson Chan , Frank D. Egitto
发明人： Voya R. Markovich , How T. Lin , Benson Chan , Frank D. Egitto
IPC分类号： G06F15/76 , G06F9/02
CPC分类号： H05K3/365 , H01L2924/0002 , H05K1/148 , H05K2201/047 , H05K2201/10159 , H05K2201/209 , H01L2924/00
摘要： A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time.
摘要翻译：在表面上具有树状突起的可拆卸的逻辑叶片模块连接到集群接口板的表面上的凹陷区域。突起用于将逻辑模块设备电连接到集群接口板等，逻辑叶片的表面上的突起被灵活地和导电地连接到集群接口板的表面上的接收区域。逻辑叶片连接器是可移动的，不需要焊料软化热循环或特殊工具，并且允许在任何时间简单地移除或更换单个叶片。

9. 发明授权

US08196281B2 Method of applying force to electrical contacts on a printed circuit board 失效
标题翻译：对印刷电路板上的电触点施加力的方法
公开(公告)号：US08196281B2
公开(公告)日：2012-06-12
申请号：US13090676
申请日：2011-04-20
申请人： Benson Chan , Matthew J. Lauffer
发明人： Benson Chan , Matthew J. Lauffer
IPC分类号： H01S4/00
CPC分类号： H05K7/1061 , H05K7/1007 , Y10T29/49002 , Y10T29/49204 , Y10T29/49222 , Y10T29/53174 , Y10T29/53209 , Y10T29/53213 , Y10T29/53283 , Y10T29/53678
摘要： A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four recesses, formed therein. A threaded aperture is also formed in the backer plate. A compression plate is also provided. A second set of apertures is formed along the periphery of the compression plate. The lower surface of the compression plate has at least one compression plate recess, and at least one compression plate aperture. At least one compression spring is disposed between the backer plate and the compression plate. A screw tension release mechanism is screwed into the backer plate threaded aperture and inserted through the compression plate aperture. When the release mechanism is loosened, backer plate is forced downwardly, applying a uniform force to all electrical contacts on the printed circuit board or card to which the clamping mechanism is attached.
摘要翻译：弹簧致动夹紧机构具有带有上表面和下表面的支承板。沿着支撑板的周边形成一组孔。背板的上表面具有至少一个支承板凹部，最好在其中形成四个凹部。螺纹孔也形成在后板中。还提供压缩板。沿着压缩板的周边形成第二组孔。压缩板的下表面具有至少一个压缩板凹部和至少一个压缩板孔。至少一个压缩弹簧设置在支承板和压缩板之间。螺钉张力释放机构拧入支承板螺纹孔并插入通过压板孔。当释放机构松动时，支撑板向下受力，对夹紧机构所附着的印刷电路板或卡上的所有电触头施加均匀的力。

10. 发明授权

US07972178B2 High density connector for interconnecting fine pitch circuit packaging structures 有权
标题翻译：用于互连细间距电路封装结构的高密度连接器
公开(公告)号：US07972178B2
公开(公告)日：2011-07-05
申请号：US12789642
申请日：2010-05-28
申请人： Benson Chan , David J. Alcoe
发明人： Benson Chan , David J. Alcoe
IPC分类号： H01R31/06
CPC分类号： H05K7/1061 , Y10T29/49117
摘要： A pinned interposer and mating sockets to facilitate removable mounting of high connection density micro devices between a pair of substrates in compact electronic circuit packages. The pinned interposer has an inner set of contacts, typically in a rectangular array, that, in cooperation with a mating socket, allows pluggable connection of a micro device such as a MEMS device connected to a first printed circuit substrate. An outer set of contacts on the interposer provides electrical interconnection between the first substrate and a second substrate located atop the high connection density micro device, thereby effectively sandwiching the micro device between the first and second substrates. The outer set of contacts may be disposed in a circular array.
摘要翻译：插入式插入器和配合插座，以便于在紧凑型电子电路封装中的一对基板之间移除高连接密度微器件的安装。固定插入件具有一组通常为矩形阵列的内部触点，其与配合插座配合，允许诸如连接到第一印刷电路基板的MEMS装置的微型装置的可插拔连接。插入器上的外部一组触点提供位于高连接密度微器件顶部的第一衬底和第二衬底之间的电互连，从而将微器件有效地夹在第一和第二衬底之间。外套接触件可以以圆形阵列布置。

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