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1. 发明授权

US06360133B1 Method and apparatus for automatic routing for reentrant process 有权
标题翻译：用于可重入进程的自动路由的方法和装置
公开(公告)号：US06360133B1
公开(公告)日：2002-03-19
申请号：US09335405
申请日：1999-06-17
申请人： William Jarrett Campbell , Anthony J. Toprac , Christopher A. Bone
发明人： William Jarrett Campbell , Anthony J. Toprac , Christopher A. Bone
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , G05B2219/32265 , G05B2219/32324 , G05B2219/45031 , H01L21/67276 , Y02P90/20
摘要： The present invention provides for a method and an apparatus for automatic routing of semiconductor devices within a manufacturing area. Performance of a plurality of manufacturing tools is tracked while processing semiconductor devices. At least one optimal combination of the manufacturing tools is determined based upon the tracked performance of the manufacturing tools. A queuing system is implemented to attain the optimal combination of the manufacturing tools. A dispatch system is deployed in response to the queuing system for routing the semiconductor devices within the manufacturing area.
摘要翻译：本发明提供一种用于在制造区域内自动路由半导体器件的方法和装置。在处理半导体器件的同时跟踪多个制造工具的性能。基于制造工具的跟踪性能来确定制造工具的至少一个最佳组合。实施排队系统以实现制造工具的最佳组合。响应于用于在制造区域内布线半导体器件的排队系统部署调度系统。

2. 发明授权

US06529789B1 Method and apparatus for automatic routing for reentrant processes 有权
标题翻译：用于可重入流程的自动路由的方法和装置
公开(公告)号：US06529789B1
公开(公告)日：2003-03-04
申请号：US10097467
申请日：2002-03-14
申请人： William Jarrett Campbell , Anthony J. Toprac , Christopher A. Bone
发明人： William Jarrett Campbell , Anthony J. Toprac , Christopher A. Bone
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , G05B2219/32265 , G05B2219/32324 , G05B2219/45031 , H01L21/67276 , Y02P90/20
摘要： The present invention provides for a method and an apparatus for automatic routing of semiconductor devices within a manufacturing area. Performance of a plurality of manufacturing tools is tracked while processing semiconductor devices. At least one optimal combination of the manufacturing tools is determined based upon the tracked performance of the manufacturing tools. A queuing system is implemented to attain the optimal combination of the manufacturing tools. A dispatch system is deployed in response to the queuing system for routing the semiconductor devices within the manufacturing area.
摘要翻译：本发明提供一种用于在制造区域内自动路由半导体器件的方法和装置。在处理半导体器件的同时跟踪多个制造工具的性能。基于制造工具的跟踪性能来确定制造工具的至少一个最佳组合。实施排队系统以实现制造工具的最佳组合。响应于用于在制造区域内布线半导体器件的排队系统部署调度系统。

3. 发明授权

US06352867B1 Method of controlling feature dimensions based upon etch chemistry concentrations 有权
标题翻译：基于蚀刻化学浓度控制特征尺寸的方法
公开(公告)号：US06352867B1
公开(公告)日：2002-03-05
申请号：US09478181
申请日：2000-01-05
申请人： Terri A. Couteau , William Jarrett Campbell , Anthony J. Toprac
发明人： Terri A. Couteau , William Jarrett Campbell , Anthony J. Toprac
IPC分类号： H01L2100
CPC分类号： H01L21/32134
摘要： The present invention is directed to a method of controlling the width of a gate electrode based upon the etch rate of a chemical bath. In one illustrative embodiment, the method comprises determining an etching rate for a chemical bath, determining the manufactured width of the gate electrode, and varying the time duration of an etching process performed in the bath depending upon the etch rate of the bath and the width of the gate electrode.
摘要翻译：本发明涉及一种基于化学浴蚀刻速率来控制栅电极的宽度的方法。在一个说明性实施例中，该方法包括确定用于化学浴的蚀刻速率，确定制造的栅电极的宽度，并且根据镀液的蚀刻速率和宽度来改变在镀液中进行的蚀刻工艺的持续时间的栅电极。

4. 发明授权

US07181354B1 Method and apparatus for data stackification for run-to-run control 有权
标题翻译：用于运行控制的数据堆叠的方法和装置
公开(公告)号：US07181354B1
公开(公告)日：2007-02-20
申请号：US10227753
申请日：2002-08-26
申请人： Christopher A. Bone , Anthony J. Toprac
发明人： Christopher A. Bone , Anthony J. Toprac
IPC分类号： G01N37/00
CPC分类号： G05B19/41865 , G05B2219/32053 , G05B2219/37532 , G05B2219/45031 , H01L21/67276 , Y02P90/20
摘要： A method and an apparatus for organizing production data is provided. The method comprises performing at least one process run of semiconductor devices, and recording at least one manufacturing tag associated with the process run of semiconductor devices. The method further comprises performing metrology upon at least one process run of the semiconductor device for acquiring metrology data and for performing a metrology data stackification process upon the metrology data using the manufacturing tag for organizing and stacking the metrology data. The method further comprises modifying at least one control parameter is modified based upon the stacked metrology data.
摘要翻译：提供了一种用于组织生产数据的方法和装置。该方法包括执行半导体器件的至少一个工艺流程，以及记录与半导体器件的工艺流程相关联的至少一个制造标签。该方法还包括在用于采集度量数据的半导体器件的至少一个工艺运行中执行度量，并且使用用于组织和堆叠度量数据的制造标签对度量数据进行计量数据叠加处理。该方法还包括修改至少一个控制参数根据堆叠的度量数据进行修改。

5. 发明授权

US06460002B1 Method and apparatus for data stackification for run-to-run control 有权
标题翻译：用于运行控制的数据堆叠的方法和装置
公开(公告)号：US06460002B1
公开(公告)日：2002-10-01
申请号：US09501494
申请日：2000-02-09
申请人： Christopher A. Bone , Anthony J. Toprac
发明人： Christopher A. Bone , Anthony J. Toprac
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , G05B2219/32053 , G05B2219/37532 , G05B2219/45031 , H01L21/67276 , Y02P90/20
摘要： In one embodiment, a method and apparatus is provided for data stackification for run-to-run control. A process run of semiconductor devices is processed. A manufacturing tag associated with the process run of semiconductor devices is recorded. Metrology data relating to the processed semiconductor devices is then acquired. The present invention calls for performing a metrology data stackification process upon the metrology data using the manufacturing tag for organizing and stacking the metrology data. The present invention provides for modifying at least one control parameter based upon the stacked metrology data.
摘要翻译：在一个实施例中，提供了用于运行到运行控制的数据叠加的方法和装置。处理半导体器件的工艺流程。记录与半导体器件的工艺流程相关联的制造标签。然后获取与处理的半导体器件有关的计量数据。本发明要求使用制造标签对计量数据执行计量数据叠加处理，以用于组织和堆叠度量数据。本发明提供了基于堆叠的度量数据来修改至少一个控制参数。

6. 发明授权

US06699727B1 Method for prioritizing production lots based on grade estimates and output requirements 有权
标题翻译：根据年龄估计和产出要求确定生产批次的方法
公开(公告)号：US06699727B1
公开(公告)日：2004-03-02
申请号：US09821675
申请日：2001-03-29
申请人： Anthony J. Toprac , Joyce S. Oey Hewett , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Anthony J. Toprac , Joyce S. Oey Hewett , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G01R3126
CPC分类号： H01L22/20 , G05B19/418 , G05B2219/32194 , G05B2219/32263 , Y02P90/02 , Y02P90/18 , Y02P90/20 , Y02P90/22
摘要： A method for prioritizing production flow includes processing a plurality of manufactured items in a process flow; measuring characteristics of a plurality of manufactured items in the process flow; estimating performance grades for the plurality of manufactured items based on the measured characteristics; grouping the manufactured items with like estimated performance grades; assigning priorities to groups of manufactured items with like estimated performance grades; and directing the plurality of manufactured items through the process flow based on the assigned priorities. A manufacturing system includes a plurality of processing tools adapted to process a plurality of manufactured items in a process flow, a metrology tool, and a process control server. The metrology tool is adapted to measure characteristics of a plurality of manufactured items in the process flow. The process control server is adapted to estimate performance grades for the plurality of manufactured items based on the measured characteristics, group the manufactured items with like estimated performance grades, assign priorities to groups of manufactured items with like estimated performance grades, and direct the plurality of manufactured items through the process flow based on the assigned priorities.
摘要翻译：一种用于确定生产流程优先级的方法包括在处理流程中处理多个制造的物品; 测量处理流程中的多个制成品的特性; 基于所测量的特性来估计所述多个制造物品的性能等级; 对具有相似估计性能等级的制成品进行分组; 将优先事项分配给具有类似估计绩效等级的制成品组; 以及基于所分配的优先级，通过所述处理流程来引导所述多个制造的物品。制造系统包括多个处理工具，其适用于处理流程中的多个制造物品，计量工具和过程控制服务器。计量工具适于测量处理流程中的多个制造物品的特性。过程控制服务器适于基于测量的特性来估计多个制造物品的性能等级，将具有相似估计性能等级的制造物品分组，将具有相似估计性能等级的制造商品组的优先级分配给多个基于分配的优先级，通过流程流程制造出的物品。

7. 发明授权

US06675058B1 Method and apparatus for controlling the flow of wafers through a process flow 有权
标题翻译：通过工艺流程控制晶片流动的方法和装置
公开(公告)号：US06675058B1
公开(公告)日：2004-01-06
申请号：US09821630
申请日：2001-03-29
申请人： Alexander J. Pasadyn , Anthony J. Toprac , Christopher A. Bode , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Alexander J. Pasadyn , Anthony J. Toprac , Christopher A. Bode , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , G05B2219/32272 , H01L21/67276 , Y02P90/18 , Y02P90/20 , Y02P90/86
摘要： A method for controlling the flow of wafers through a process flow includes monitoring operating states of a plurality of processing tools adapted to process wafers; measuring a characteristic of a particular incoming wafer; identifying a particular processing tool having an operating state complimentary to the measured characteristic; and routing the particular incoming wafer to the particular processing tool for processing. A manufacturing system includes a plurality of processing tools adapted to process wafers and a process control server. The process control server is adapted to access metrology data related to a characteristic of a particular incoming wafer, identify a particular processing tool having an operating state complimentary to the characteristic, and route the particular incoming wafer to the particular processing tool for processing.
摘要翻译：用于通过工艺流程控制晶片流动的方法包括监测适于处理晶片的多个处理工具的操作状态; 测量特定输入晶片的特性; 识别具有与测量特性相互补充的操作状态的特定加工工具; 并将特定进入的晶片路由到特定的处理工具进行处理。制造系统包括适于处理晶片的多个处理工具和过程控制服务器。过程控制服务器适于访问与特定输入晶片的特性相关的度量数据，识别具有与该特征相互补充的操作状态的特定处理工具，并将特定输入晶片路由到特定处理工具进行处理。

8. 发明授权

US06560506B2 Method and apparatus for control for semiconductor processing for reducing effects of environmental effects 失效
标题翻译：用于半导体处理的控制方法和装置，用于减少环境影响的影响
公开(公告)号：US06560506B2
公开(公告)日：2003-05-06
申请号：US09729412
申请日：2000-12-04
申请人： Anthony J. Toprac
发明人： Anthony J. Toprac
IPC分类号： G06F1900
CPC分类号： G05B19/41875 , G05B13/024 , G05B2219/32182 , G05B2219/32187 , G05B2219/45031 , H01L21/67276 , Y02P90/14 , Y02P90/22
摘要： The present invention provides for a method and an apparatus for reducing the effects of manufacturing environmental factors. At least one process run of semiconductor devices is processed. A manufacturing environmental data analysis is performed upon the process run of semiconductor devices. A control parameter modification sequence is implemented in response to the manufacturing environmental data analysis.
摘要翻译：本发明提供了减少制造环境因素的影响的方法和装置。处理半导体器件的至少一个工艺流程。在半导体器件的工艺运行中进行制造环境数据分析。响应于制造环境数据分析实施控制参数修改序列。

9. 发明授权

US06549822B1 Method and apparatus for control of multi-cup semiconductor manufacturing tracks 有权
标题翻译：用于控制多杯半导体制造轨道的方法和装置
公开(公告)号：US06549822B1
公开(公告)日：2003-04-15
申请号：US09625432
申请日：2000-07-25
申请人： Anthony J. Toprac
发明人： Anthony J. Toprac
IPC分类号： G06F1900
CPC分类号： H01L21/67276
摘要： The present invention provides for a method and an apparatus for controlling multiple semiconductor wafer cups. At least one process run of semiconductor devices is processed. A multi-wafer-cup process analysis is performed upon the processed semiconductor devices. At least one control parameter is modified for a subsequent process run of semiconductor devices using results from the multi-wafer-cup process analysis.
摘要翻译：本发明提供一种用于控制多个半导体晶片杯的方法和装置。处理半导体器件的至少一个工艺流程。对处理的半导体器件进行多晶圆杯处理分析。使用多晶圆杯过程分析的结果，修改至少一个控制参数用于半导体器件的后续处理运行。

10. 发明授权

US06511898B1 Method for controlling deposition parameters based on polysilicon grain size feedback 失效
标题翻译：基于多晶硅粒度反馈控制沉积参数的方法
公开(公告)号：US06511898B1
公开(公告)日：2003-01-28
申请号：US09577769
申请日：2000-05-24
申请人： Thomas Sonderman , Jeremy Lansford , Anthony J. Toprac
发明人： Thomas Sonderman , Jeremy Lansford , Anthony J. Toprac
IPC分类号： H01L2120
CPC分类号： H01L22/26 , H01L22/14
摘要： A processing line includes a deposition tool, a metrology tool and a controller. The deposition tool is adapted to form a polysilicon layer on a wafer in accordance with a recipe. The metrology tool is adapted to measure a grain size of the polysilicon layer. The controller is adapted to modify the recipe for subsequently formed polysilicon layers based on the measured grain size. A method for controlling a deposition process includes forming a polysilicon layer on a wafer in accordance with a recipe; measuring a grain size of the polysilicon layer; and changing the recipe for subsequently formed polysilicon layers based on the measured grain size.
摘要翻译：处理线包括沉积工具，计量工具和控制器。沉积工具适于根据配方在晶片上形成多晶硅层。测量工具适于测量多晶硅层的晶粒尺寸。控制器适于基于测量的晶粒尺寸修改随后形成的多晶硅层的配方。控制沉积工艺的方法包括根据配方在晶片上形成多晶硅层; 测量多晶硅层的晶粒尺寸; 并根据测得的晶粒尺寸改变随后形成的多晶硅层的配方。

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