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1. 发明授权

US06559666B2 Method and device for semiconductor testing using electrically conductive adhesives 失效
标题翻译：使用导电胶粘剂进行半导体测试的方法和装置
公开(公告)号：US06559666B2
公开(公告)日：2003-05-06
申请号：US09875246
申请日：2001-06-06
申请人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
发明人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , H01L2224/45144 , H01L2224/81385 , H01L2224/83101 , H05K3/321 , H01L2924/00
摘要： A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium. After the palladium-plated ECA is brought into contact with aluminum pads, palladium-coated aluminum pads, or even C4 solder bumps, conductive dendrites are formed on the palladium-treated ECA bumps.
摘要翻译：一种用于测试和燃烧半导体电路的方法和装置。该方法和装置允许通过使用导电粘合剂（ECA）将晶片临时附接到测试基板来测试整个晶片。 ECA符合晶片和测试基板的接触点的共平面偏差，同时在每个点提供质量电连接。 ECA材料可以沉积在晶片触点或衬底焊盘上。此外，ECA可以沉积在C4凸点或锡盖铅基上。该方法和装置的变化包括用ECA填充非导电插入件的通孔。可以通过在测试焊盘上形成导电枝晶而增加电连接，同时将ECA沉积在晶片触点上。为了进一步增强电连接，可以对ECA材料进行等离子体蚀刻以除去其一些聚合物基质并使一面上的导电颗粒暴露，然后用钯镀覆。在镀钯的ECA与铝焊盘，钯涂覆的铝焊盘或甚至C4焊料凸块接触之后，在钯处理的ECA凸块上形成导电枝晶。

2. 发明授权

US06268739B1 Method and device for semiconductor testing using electrically conductive adhesives 失效
公开(公告)号：US06268739B1
公开(公告)日：2001-07-31
申请号：US09478678
申请日：2000-01-06
申请人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
发明人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , H01L2224/45144 , H01L2224/81385 , H01L2224/83101 , H05K3/321 , H01L2924/00
摘要： A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium. After the palladium-plated ECA is brought into contact with aluminum pads, palladium-coated aluminum pads, or even C4 solder bumps, conductive dendrites are formed on the palladium-treated ECA bumps.

3. 发明授权

US06288559B1 Semiconductor testing using electrically conductive adhesives 失效
标题翻译：使用导电胶的半导体测试
公开(公告)号：US06288559B1
公开(公告)日：2001-09-11
申请号：US09050820
申请日：1998-03-30
申请人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
发明人： William E. Bernier , Michael A. Gaynes , Wayne J. Howell , Mark V. Pierson , Ajit K. Trivedi , Charles G. Woychik
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , H01L2224/45144 , H01L2224/81385 , H01L2224/83101 , H05K3/321 , H01L2924/00
摘要： A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium. After the palladium-plated ECA is brought into contact with aluminum pads, palladium-coated aluminum pads, or even C4 solder bumps, conductive dendrites are formed on the palladium-treated ECA bumps.
摘要翻译：一种用于测试和燃烧半导体电路的方法和装置。该方法和装置允许通过使用导电粘合剂（ECA）将晶片临时附接到测试基板来测试整个晶片。 ECA符合晶片和测试基板的接触点的共平面偏差，同时在每个点提供质量电连接。 ECA材料可以沉积在晶片触点或衬底焊盘上。此外，ECA可以沉积在C4凸点或锡盖铅基上。该方法和装置的变化包括用ECA填充非导电插入件的通孔。可以通过在测试焊盘上形成导电枝晶而增加电连接，同时将ECA沉积在晶片触点上。为了进一步增强电连接，可以对ECA材料进行等离子体蚀刻以除去其一些聚合物基质并使一面上的导电颗粒暴露，然后用钯镀覆。在镀钯的ECA与铝焊盘，钯涂覆的铝焊盘或甚至C4焊料凸块接触之后，在钯处理的ECA凸块上形成导电枝晶。

4. 发明授权

US06517662B2 Process for making semiconductor chip assembly 失效
标题翻译：半导体芯片组装工艺
公开(公告)号：US06517662B2
公开(公告)日：2003-02-11
申请号：US09397739
申请日：1999-09-16
申请人： Thomas M. Culnane , Michael A. Gaynes , Ramesh R. Kodnani , Mark V. Pierson , Charles G. Woychik
发明人： Thomas M. Culnane , Michael A. Gaynes , Ramesh R. Kodnani , Mark V. Pierson , Charles G. Woychik
IPC分类号： B29C6502
CPC分类号： H01L23/49572 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/1532
摘要： A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.
摘要翻译：一种半导体芯片载体组件，其包括在其表面之一上具有与半导体芯片电连通的金属化路径的柔性基板。加强件邻近所述柔性基底设置并通过粘合剂组合物与其结合。将包含可固化粘合剂的微孔膜的粘合剂组合物设置在柔性基材和加强件之间。盖板粘合到半导体芯片和加强件上。还描述了将柔性基底设置在其中放置粘合剂组合物和加强件的真空固定装置中，随后施加热和压力以固化可固化粘合剂的方法。

5. 发明授权

US5973389A Semiconductor chip carrier assembly 失效
标题翻译：半导体芯片载体组件
公开(公告)号：US5973389A
公开(公告)日：1999-10-26
申请号：US844865
申请日：1997-04-22
申请人： Thomas M. Culnane , Michael A. Gaynes , Ramesh R. Kodnani , Mark V. Pierson , Charles G. Woychik
发明人： Thomas M. Culnane , Michael A. Gaynes , Ramesh R. Kodnani , Mark V. Pierson , Charles G. Woychik
IPC分类号： H01L21/60 , H01L23/12 , H01L23/495 , H01L23/02
CPC分类号： H01L23/49572 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/1532
摘要： A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.
摘要翻译：一种半导体芯片载体组件，其包括在其表面之一上具有与半导体芯片电连通的金属化路径的柔性基板。加强件邻近所述柔性基底设置并通过粘合剂组合物与其结合。将包含可固化粘合剂的微孔膜的粘合剂组合物设置在柔性基材和加强件之间。盖板粘合到半导体芯片和加强件上。还描述了将柔性基底设置在其中放置粘合剂组合物和加强件的真空固定装置中，随后施加热和压力以固化可固化粘合剂的方法。

6. 发明授权

US06199751B1 Polymer with transient liquid phase bondable particles 失效
标题翻译：具有瞬态液相可粘结颗粒的聚合物
公开(公告)号：US06199751B1
公开(公告)日：2001-03-13
申请号：US09533196
申请日：2000-03-23
申请人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
发明人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
IPC分类号： B23K2000
CPC分类号： H01L24/31 , B23K35/0244 , B23K35/26 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29409 , H01L2224/29411 , H01L2224/8319 , H01L2224/838 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H05K3/321 , H05K2201/0218 , H05K2203/0425 , Y10T428/12014 , Y10T428/12181 , Y10T428/12569 , Y10T428/12646 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , H01L2924/00 , H01L2924/00014
摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.
摘要翻译：提供了在两个表面上的焊盘之间形成冶金结合的技术。放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。第一和第二种金属包括低熔点成分。两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。核心金属和涂覆金属一起包括低熔点成分。以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相材料和贱金属进入涂料。

7. 发明授权

US5542602A Stabilization of conductive adhesive by metallurgical bonding 失效
标题翻译：通过冶金粘合稳定导电胶
公开(公告)号：US5542602A
公开(公告)日：1996-08-06
申请号：US366582
申请日：1994-12-30
申请人： Michael A. Gaynes , Kostas Papathomas , Giana M. Phelan , Charles G. Woychik
发明人： Michael A. Gaynes , Kostas Papathomas , Giana M. Phelan , Charles G. Woychik
IPC分类号： B23K1/00 , B23K1/20 , B23K20/02 , B23K35/00 , B23K35/02 , B23K35/30 , H01B1/22 , H05K3/32 , B23K20/00
CPC分类号： B23K20/023 , B23K35/007 , B23K35/0244 , B23K35/3006 , B23K35/3013 , H05K3/321 , B23K2201/32 , H01L2224/293 , H01L2924/01079 , H01L2924/01322 , H05K2201/0218 , H05K2203/0278 , H05K2203/0425
摘要： A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.
摘要翻译：可替代焊接工艺的冶金结合物通过在低温下通过瞬态液相（TLP）反应而形成金属与金属涂层的合金，该金属涂层施加到至少一个待结合的表面上。通过反复热循环可以稳定地进行电连接的贵金属的机械结合可以在特别低的温度下使用铟，锡或铅的涂层材料进行。各向异性或各向异性导电连接可以通过将包含导电颗粒的聚合物粘合剂施加到待粘合的至少一个表面上，并且通过在低于共晶合金的熔点的温度下固化聚合物粘合剂而在表面之间产生压缩力在允许进行TLP处理之前选择的金属系统。

8. 发明授权

US6087021A Polymer with transient liquid phase bondable particles 失效
标题翻译：具有瞬态液相可粘结颗粒的聚合物
公开(公告)号：US6087021A
公开(公告)日：2000-07-11
申请号：US86399
申请日：1998-05-28
申请人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
发明人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , H01L21/60 , H05K3/32 , B22F7/00
CPC分类号： H01L24/31 , B23K35/0244 , H01L24/29 , H01L24/83 , H05K3/321 , B23K35/26 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29409 , H01L2224/29411 , H01L2224/8319 , H01L2224/838 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H05K2201/0218 , H05K2203/0425 , Y10T428/12014 , Y10T428/12181 , Y10T428/12569 , Y10T428/12646 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903
摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.
摘要翻译：提供了在两个表面上的焊盘之间形成冶金结合的技术。放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。第一和第二种金属包括低熔点成分。两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。核心金属和涂覆金属一起包括低熔点成分。以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相材料和贱金属进入涂料。

9. 发明授权

US06770968B2 Method for bonding heat sinks to overmolds and device formed thereby 有权
标题翻译：用于将散热器连接到包覆成型体的方法和由此形成的装置
公开(公告)号：US06770968B2
公开(公告)日：2004-08-03
申请号：US10369778
申请日：2003-02-19
申请人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
发明人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
IPC分类号： H01L2334
CPC分类号： B29C59/14 , H01L21/56 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.
摘要翻译：一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加贴附物将物品粘合到表面上。通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。等离子体可以是氧等离子体，并且粘合剂可以选自具有金属氧化物填料的热固化的硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

10. 发明授权

US06576996B2 Method for bonding heat sinks to overmolds and device formed thereby 有权
公开(公告)号：US06576996B2
公开(公告)日：2003-06-10
申请号：US09757159
申请日：2001-01-09
申请人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
发明人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
IPC分类号： H01L2334
CPC分类号： B29C59/14 , H01L21/56 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

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