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1. 发明申请

US20080261346A1 SEMICONDUCTOR IMAGE DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME 审中-公开
标题翻译：具有接收孔的DIEMIC半导体图像装置及其方法
公开(公告)号：US20080261346A1
公开(公告)日：2008-10-23
申请号：US12165876
申请日：2008-07-01
申请人： Wen-Kun Yang , Jui-Hsien Chang , Tung-chuan Wang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Tung-chuan Wang
IPC分类号： H01L31/18
CPC分类号： H01L27/14618 , H01L24/24 , H01L24/82 , H01L24/97 , H01L27/14627 , H01L27/14685 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2924/01019 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.
摘要翻译：本发明公开了一种包装结构，包括：具有模具接收通孔的基板，连接通孔结构和第一接触垫; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 以及第二接触焊盘，其形成在所述基板的下表面和所述连接通孔结构的下方。

2. 发明申请

US20080157312A1 Semiconductor image device package with die receiving through-hole and method of the same 有权
标题翻译：具有裸片接收通孔的半导体图像器件封装及其方法
公开(公告)号：US20080157312A1
公开(公告)日：2008-07-03
申请号：US11647217
申请日：2006-12-29
申请人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L24/24 , H01L24/82 , H01L24/97 , H01L27/14627 , H01L27/14685 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2924/01019 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.
摘要翻译：本发明公开了一种包装结构，包括：具有模具接收通孔的基板，连接通孔结构和第一接触垫; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 以及第二接触焊盘，其形成在所述基板的下表面和所述连接通孔结构的下方。

3. 发明授权

US07459729B2 Semiconductor image device package with die receiving through-hole and method of the same 有权
标题翻译：具有裸片接收通孔的半导体图像器件封装及其方法
公开(公告)号：US07459729B2
公开(公告)日：2008-12-02
申请号：US11647217
申请日：2006-12-29
申请人： Wen-Kun Yang , Jui-Hsien Chang , Tung-chuan Wang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Tung-chuan Wang
IPC分类号： H01L29/22 , H01L33/00 , H01L29/04 , H01L29/10 , H01L31/036 , H01L31/0376 , H01L31/20 , H01L29/15 , H01L29/80 , H01L31/112 , H01L31/062 , H01L31/0203
CPC分类号： H01L27/14618 , H01L24/24 , H01L24/82 , H01L24/97 , H01L27/14627 , H01L27/14685 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2924/01019 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： The present invention discloses a structure of package including: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.
摘要翻译：本发明公开了一种封装结构，包括：具有管芯接收通孔的基板，连接通孔结构和第一接触焊盘; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 以及第二接触焊盘，其形成在所述基板的下表面和所述连接通孔结构的下方。

4. 发明申请

US20080173792A1 Image sensor module and the method of the same 审中-公开
标题翻译：图像传感器模块及其方法相同
公开(公告)号：US20080173792A1
公开(公告)日：2008-07-24
申请号：US11656410
申请日：2007-01-23
申请人： Wen-Kun Yang , Jui-Hsien Chang , Tung-chuan Wang , Chihwei Lin , Hsien-Wen Hsu
发明人： Wen-Kun Yang , Jui-Hsien Chang , Tung-chuan Wang , Chihwei Lin , Hsien-Wen Hsu
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L24/24 , H01L24/82 , H01L27/14625 , H01L27/14634 , H01L27/14636 , H01L27/1469 , H01L2224/04105 , H01L2224/12105 , H01L2224/24195 , H01L2224/73267 , H01L2924/14 , H01L2924/15153 , H01L2924/19105 , H04N5/2253 , H04N5/2257 , H01L2924/00
摘要： The present invention provides an image sensor module structure comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate and a die having a micro lens disposed within the die receiving cavity. A dielectric layer is formed on the die and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.
摘要翻译：本发明提供了一种图像传感器模块结构，其包括具有形成在基板的上表面内的模具接收空腔的基板和基板内的导电迹线以及具有设置在模具接收腔内的微透镜的模具。在管芯和衬底上形成电介质层，在电介质层上形成再分配导电层（RDL），其中RDL耦合到管芯，并且导电迹线和电介质层具有露出微透镜。透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。滤光片安装在透镜和微透镜之间。该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

5. 发明授权

US07498556B2 Image sensor module having build-in package cavity and the method of the same 有权
标题翻译：具有内置封装空腔的图像传感器模块及其方法
公开(公告)号：US07498556B2
公开(公告)日：2009-03-03
申请号：US11725041
申请日：2007-03-15
申请人： Wen-Kun Yang , Diann-Fang Lin , Jui-Hsien Chang , Tung-Chuan Wang
发明人： Wen-Kun Yang , Diann-Fang Lin , Jui-Hsien Chang , Tung-Chuan Wang
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L24/19 , H01L27/14625 , H01L27/14627 , H01L27/14643 , H01L27/14685 , H01L2224/05001 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05548 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/12105 , H01L2224/73267 , H01L2924/14 , H04N5/2253 , H04N5/2257 , H01L2924/00 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01028 , H01L2924/013
摘要： The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.
摘要翻译：本发明提供了一种具有内置封装空腔的图像传感器模块及其方法。一种图像传感器模块结构，包括具有形成在所述基板的上表面内的封装容纳腔的衬底和所述衬底内的导电迹线，以及具有设置在所述封装容纳腔内的具有微透镜的裸片的封装。在封装和基板上形成电介质层，在介电层上形成再分配导电层（RDL），其中RDL耦合到管芯，导电迹线和电介质层具有露出微透镜。透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。滤光片安装在透镜和微透镜之间。该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

6. 发明申请

US20080224248A1 Image sensor module having build-in package cavity and the method of the same 有权
标题翻译：具有内置封装空腔的图像传感器模块及其方法
公开(公告)号：US20080224248A1
公开(公告)日：2008-09-18
申请号：US11725041
申请日：2007-03-15
申请人： Wen-Kun Yang , Diann-Fang Lin , Jui-Hsien Chang , Tung-Chuan Wang
发明人： Wen-Kun Yang , Diann-Fang Lin , Jui-Hsien Chang , Tung-Chuan Wang
IPC分类号： H01L21/44 , H01L31/0203 , H01J40/14
CPC分类号： H01L27/14618 , H01L24/19 , H01L27/14625 , H01L27/14627 , H01L27/14643 , H01L27/14685 , H01L2224/05001 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05548 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/12105 , H01L2224/73267 , H01L2924/14 , H04N5/2253 , H04N5/2257 , H01L2924/00 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01028 , H01L2924/013
摘要： The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.
摘要翻译：本发明提供了一种具有内置封装空腔的图像传感器模块及其方法。一种图像传感器模块结构，包括具有形成在所述基板的上表面内的封装容纳腔的衬底和所述衬底内的导电迹线，以及具有设置在所述封装容纳腔内的具有微透镜的裸片的封装。在封装和基板上形成电介质层，在介电层上形成再分配导电层（RDL），其中RDL耦合到管芯，导电迹线和电介质层具有露出微透镜。透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。滤光片安装在透镜和微透镜之间。该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

7. 发明申请

US20080191333A1 Image sensor package with die receiving opening and method of the same 审中-公开
标题翻译：具有模具接收开口的图像传感器封装及其方法
公开(公告)号：US20080191333A1
公开(公告)日：2008-08-14
申请号：US11703663
申请日：2007-02-08
申请人： Wen-Kun Yang , Diann-Fang Lin , Jui-Hsien Chang , Tung-chuan Wang , Hsien-Wen Hsu
发明人： Wen-Kun Yang , Diann-Fang Lin , Jui-Hsien Chang , Tung-chuan Wang , Hsien-Wen Hsu
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L21/6835 , H01L24/48 , H01L24/85 , H01L24/97 , H01L27/14618 , H01L27/14627 , H01L27/14687 , H01L2224/48091 , H01L2224/48235 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/16235 , H01L2924/181 , H01L2924/18165 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. A protective layer is formed to cover the wire bonding. A transparent cover is disposed on the die within the die through hole by adhesion to expose the micro lens area. Conductive bumps are coupled to the terminal pads.
摘要翻译：本发明提供一种封装结构，其包括具有通孔的基板和在其上形成的接触通孔结构，其中端子焊盘形成在接触通孔结构下方，并且接触焊盘形成在基质。具有微透镜区域的模具通过粘附设置在模具通孔内。在芯片和基板上形成引线接合，其中引线接合耦合到管芯和接触焊盘。形成保护层以覆盖引线接合。通过粘合将透明盖设置在模具通孔内的模具上，以露出微透镜区域。导电凸块耦合到端子焊盘。

8. 发明申请

US20080274579A1 Wafer level image sensor package with die receiving cavity and method of making the same 审中-公开
标题翻译：晶圆级图像传感器封装，带模具接收腔及其制作方法
公开(公告)号：US20080274579A1
公开(公告)日：2008-11-06
申请号：US12216641
申请日：2008-07-09
申请人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
IPC分类号： H01L21/00
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14685 , H01L31/02327 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a structure of package comprising a substrate with a die receiving cavity formed within an upper layer of the substrate, wherein terminal pads are formed on the upper surface of the substrate, the same plain as the micro lens. A die is disposed within the die receiving cavity by adhesion and a dielectric layer formed on the die and the substrate. A re-distribution metal layer (RDL) is formed on the dielectric layer and coupled to the die. An opening is formed within the dielectric layer and a top protection layer to expose the micro lens area of the die for Image Sensor chip. A protection layer (film) be coated on the micro lens area with water repellent and oil repellent to away the particle contamination. A transparent cover with coated IR filter is optionally formed over the micron lens area for protection.
摘要翻译：本发明提供一种封装结构，其包括：衬底，其具有形成在衬底的上层内的管芯容纳腔，其中端子衬垫形成在衬底的上表面上，与微透镜相同。通过粘合将模具设置在模具接收腔内，并且在模具和基板上形成介电层。在电介质层上形成再分配金属层（RDL）并与管芯耦合。在电介质层内形成一个开口和一个顶部保护层，以露出图像传感器芯片的芯片的微透镜区域。保护层（膜）涂覆在微透镜区域上，具有防水和防油性，以消除颗粒污染。可选地，在微透镜区域上形成具有涂覆的IR滤光器的透明盖，用于保护。

9. 发明申请

US20080197435A1 Wafer level image sensor package with die receiving cavity and method of making the same 审中-公开
公开(公告)号：US20080197435A1
公开(公告)日：2008-08-21
申请号：US11708476
申请日：2007-02-21
申请人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14685 , H01L31/02327 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a structure of package comprising a substrate with a die receiving cavity formed within an upper layer of the substrate, wherein terminal pads are formed on the upper surface of the substrate, the same plain as the micro lens. A die is disposed within the die receiving cavity by adhesion and a dielectric layer formed on the die and the substrate. A re-distribution metal layer (RDL) is formed on the dielectric layer and coupled to the die. An opening is formed within the dielectric layer and a top protection layer to expose the micro lens area of the die for Image Sensor chip. A protection layer (film) be coated on the micro lens area with water repellent and oil repellent to away the particle contamination. A transparent cover with coated IR filter is optionally formed over the micron lens area for protection.

10. 发明申请

US20080268647A1 METHOD OF PLASMA ETCHING WITH PATTERN MASK 审中-公开
标题翻译：等离子体蚀刻与图案掩模的方法
公开(公告)号：US20080268647A1
公开(公告)日：2008-10-30
申请号：US12134249
申请日：2008-06-06
申请人： Wen-Kun Yang , Jui-Hsien Chang , Wen-Bin Sun
发明人： Wen-Kun Yang , Jui-Hsien Chang , Wen-Bin Sun
IPC分类号： H01L21/302
CPC分类号： H01L21/321 , H01L21/31144
摘要： The present invention provides a method of plasma etching with pattern mask. There are two different devices in the two section of a wafer, comprising silicon and Gallium Arsenide (GaAs). The Silicon section is for general semiconductor. And the GaAs section is for RF device. The material of pad in the silicon is usually metal, and metal oxide is usually formed on the pads. The metal oxide is unwanted for further process; therefore it should be removed by plasma etching process. A film is attached to the surface of the substrate exposing the area need for etching. Then a mask is attached and aligned onto the film therefore exposing the area need for etching. Then plasma dry etching is applied on the substrate for removing the metal oxide.
摘要翻译：本发明提供了一种使用图案掩模进行等离子体蚀刻的方法。在晶片的两个部分中有两种不同的器件，包括硅和砷化镓（GaAs）。硅部分用于一般半导体。而GaAs部分用于RF器件。硅中的焊盘材料通常是金属，金属氧化物通常形成在焊盘上。金属氧化物对于进一步的处理是不需要的; 因此应该通过等离子体蚀刻工艺去除。将膜附着到衬底的表面，暴露出需要蚀刻的区域。然后将掩模附着并对准到膜上，从而暴露该区域对蚀刻的需要。然后在衬底上施加等离子体干蚀刻以去除金属氧化物。

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