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1. 发明专利

JP2013091595A Vacuum recycling apparatus and method for refining solar grade polysilicon 有权
标题翻译：真空回收装置和精制太阳能等离子体聚硅氧烷的方法
公开(公告)号：JP2013091595A
公开(公告)日：2013-05-16
申请号：JP2012227733
申请日：2012-10-15
申请人： Wen-Bin Sun , 孫文彬 , Huang Hsiu Min , 黄秀敏
发明人： SUN WEN-BIN
IPC分类号： C01B33/037
CPC分类号： C01B33/037 , H01L31/182 , Y02E10/546 , Y02P70/521
摘要： PROBLEM TO BE SOLVED: To provide a vacuum recycling apparatus and a method for refining solar grade polysilicon, capable of producing directly a polysilicon solution having a prescribed concentration, and shortening greatly the time and cost required for production of polysilicon.SOLUTION: This apparatus includes a vacuum degassing furnace and a circulation method vacuum processing furnace. A vacuum degassing furnace includes a vacuum chamber, a silicon storage part and a rare gas intake device. Among them, the vacuum chamber includes a first vacuum nozzle and a coupling hole. The silicon storage part is provided in the vacuum chamber, and arranged under the coupling hole. The rare gas intake device is provided in the silicon storage part. The circulation method vacuum processing furnace includes a second vacuum nozzle and a single nozzle communicating tube, and the single nozzle communicating tube is inserted into the silicon storage part via the coupling hole.
摘要翻译：要解决的问题：提供一种能够直接生产具有规定浓度的多晶硅溶液并且大大缩短生产多晶硅所需的时间和成本的太阳能级多晶硅的真空回收设备和方法。解决方案：该设备包括真空脱气炉和循环法真空处理炉。真空脱气炉包括真空室，硅储存部和稀有的进气装置。其中，真空室包括第一真空喷嘴和联接孔。硅存储部设置在真空室中，并且布置在耦合孔的下方。在硅储存部中设置稀有的进气装置。循环方式真空处理炉包括第二真空喷嘴和单个喷嘴连通管，并且单个喷嘴连通管经由联接孔插入硅储存部。版权所有（C）2013，JPO＆INPIT

2. 发明授权

US07525139B2 Image sensor with a protection layer 有权
标题翻译：具有保护层的图像传感器
公开(公告)号：US07525139B2
公开(公告)日：2009-04-28
申请号：US11025746
申请日：2004-12-29
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
IPC分类号： H01L31/062
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要翻译：图像传感器管芯包括衬底和形成在衬底上的图像传感器阵列。微透镜设置在图像传感器阵列上。在微透镜上形成保护层，以防止微透镜受到颗粒的抑制。

3. 发明申请

US20080044945A1 Filling paste structure and process for WL-CSP 有权
标题翻译： WL-CSP灌装浆料结构及工艺
公开(公告)号：US20080044945A1
公开(公告)日：2008-02-21
申请号：US11799923
申请日：2007-05-03
申请人： Wen-Kun Yang , Wen-Bin Sun , Hsi-Ying Yuan , Chun Hui Yu
发明人： Wen-Kun Yang , Wen-Bin Sun , Hsi-Ying Yuan , Chun Hui Yu
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L23/5389 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/8385 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01094 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
摘要翻译：公开了一种填充浆料结构和晶片级封装的工艺。该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。用粘合剂材料涂覆刚性基材以粘附骰子。然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。

4. 发明申请

US20050242409A1 Imagine sensor with a protection layer 有权
标题翻译：想象一下具有保护层的传感器
公开(公告)号：US20050242409A1
公开(公告)日：2005-11-03
申请号：US11025746
申请日：2004-12-29
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
IPC分类号： H01L27/14 , H01L21/00 , H01L21/50 , H01L21/56 , H01L23/12 , H01L23/50 , H01L27/144 , H01L27/146 , H01L29/06 , H01L31/00 , H01L31/0203 , H01L31/0232 , H01L31/10 , H04N5/225 , H05K1/18
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要翻译：图像传感器管芯包括衬底和形成在衬底上的图像传感器阵列。微透镜设置在图像传感器阵列上。在微透镜上形成保护层，以防止微透镜受到颗粒的抑制。

5. 发明授权

US07279782B2 FBGA and COB package structure for image sensor 有权
标题翻译：图像传感器的FBGA和COB封装结构
公开(公告)号：US07279782B2
公开(公告)日：2007-10-09
申请号：US11029929
申请日：2005-01-05
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Hui Yu , His-Ying Yuan
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Hui Yu , His-Ying Yuan
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L2224/48227 , H01L2924/10253 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00012
摘要： A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
摘要翻译：封装结构包括放置在印刷电路板上的管芯。将玻璃基板粘附在粘合膜图案上以在玻璃基板和芯片之间形成气隙区域。微透镜设置在芯片上。透镜架固定在印刷电路板上。玻璃基板可防止微透镜受到颗粒污染。

6. 发明申请

US20060145364A1 Filling paste structure and process for WL-CSP 有权
标题翻译： WL-CSP灌装浆料结构及工艺
公开(公告)号：US20060145364A1
公开(公告)日：2006-07-06
申请号：US11026488
申请日：2004-12-30
申请人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
发明人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
IPC分类号： H01L23/29
CPC分类号： H01L21/6835 , H01L23/5389 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/8385 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01094 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
摘要翻译：公开了一种填充浆料结构和晶片级封装的工艺。该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。用粘合剂材料涂覆刚性基材以粘附骰子。然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。

7. 发明申请

US20060145325A1 FBGA and COB package structure for image sensor 有权
标题翻译：图像传感器的FBGA和COB封装结构
公开(公告)号：US20060145325A1
公开(公告)日：2006-07-06
申请号：US11029929
申请日：2005-01-05
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Yu , His-Ying Yuan
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Yu , His-Ying Yuan
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L2224/48227 , H01L2924/10253 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00012
摘要： A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
摘要翻译：封装结构包括放置在印刷电路板上的管芯。将玻璃基板粘附在粘合膜图案上以在玻璃基板和芯片之间形成气隙区域。微透镜设置在芯片上。透镜架固定在印刷电路板上。玻璃基板可防止微透镜受到颗粒污染。

8. 发明授权

US07400037B2 Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP 有权
标题翻译：包装结构具有共面填充膏和骰子，并具有WL-CSP图案胶
公开(公告)号：US07400037B2
公开(公告)日：2008-07-15
申请号：US11026488
申请日：2004-12-30
申请人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
发明人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
IPC分类号： H01L23/34
CPC分类号： H01L21/6835 , H01L23/5389 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/8385 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01094 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
摘要翻译：公开了一种填充浆料结构和晶片级封装的工艺。该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。用粘合剂材料涂覆刚性基材以粘附骰子。然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。

9. 发明申请

US20070262051A1 METHOD OF PLASMA ETCHING WITH PATTERN MASK 审中-公开
标题翻译：等离子体蚀刻与图案掩模的方法
公开(公告)号：US20070262051A1
公开(公告)日：2007-11-15
申请号：US11382958
申请日：2006-05-12
申请人： Wen-Kun Yang , Jui-Hsien Chang , Wen-Bin Sun
发明人： Wen-Kun Yang , Jui-Hsien Chang , Wen-Bin Sun
IPC分类号： C03C25/68 , C23F1/00 , H01L21/306
CPC分类号： H01L21/321 , H01L21/31144
摘要： The present invention provides a method of plasma etching with pattern mask. There are two different devices in the two section of a wafer, comprising silicon and Gallium Arsenide (GaAs). The Silicon section is for general semiconductor. And the GaAs section is for RF device. The material of pad in the silicon is usually metal, and metal oxide is usually formed on the pads. The metal oxide is unwanted for further process; therefore it should be removed by plasma etching process. A film is attached to the surface of the substrate exposing the area need for etching. Then a mask is attached and aligned onto the film therefore exposing the area need for etching. Then plasma dry etching is applied on the substrate for removing the metal oxide.
摘要翻译：本发明提供了一种使用图案掩模进行等离子体蚀刻的方法。在晶片的两个部分中有两种不同的器件，包括硅和砷化镓（GaAs）。硅部分用于一般半导体。而GaAs部分用于RF器件。硅中的焊盘材料通常是金属，金属氧化物通常形成在焊盘上。金属氧化物对于进一步的处理是不需要的; 因此应该通过等离子体蚀刻工艺去除。将膜附着到衬底的表面，暴露出需要蚀刻的区域。然后将掩模附着并对准到膜上，从而暴露该区域对蚀刻的需要。然后在衬底上施加等离子体干蚀刻以去除金属氧化物。

10. 发明授权

US07224061B2 Package structure 有权
标题翻译：包装结构
公开(公告)号：US07224061B2
公开(公告)日：2007-05-29
申请号：US10918416
申请日：2004-08-16
申请人： Wen-Kun Yang , Shih-Li Chen , Wen-Bin Sun , Ming-Hui Lin , Chao-Nan Chou , Chih-Wei Lin
发明人： Wen-Kun Yang , Shih-Li Chen , Wen-Bin Sun , Ming-Hui Lin , Chao-Nan Chou , Chih-Wei Lin
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/3114 , H01L23/3128 , H01L24/19 , H01L2224/05001 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05548 , H01L2224/12105 , H01L2924/01029 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.
摘要翻译：提供包括器件，互连元件，焊盘和保护元件的封装结构。该装置通过焊盘与互连元件的第一端连接。保护元件覆盖焊盘和互连元件的第一端。

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