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1. 发明授权

US06995423B2 Memory device having a P+ gate and thin bottom oxide and method of erasing same 有权
标题翻译：具有P +栅极和薄底部氧化物的存储器件及其擦除方法
公开(公告)号：US06995423B2
公开(公告)日：2006-02-07
申请号：US10878091
申请日：2004-06-28
申请人： Wei Zheng , Chi Chang , Tazrien Kamal
发明人： Wei Zheng , Chi Chang , Tazrien Kamal
IPC分类号： H01L29/788 , H01L29/792
CPC分类号： H01L29/7923 , H01L29/7887
摘要： A non-volatile memory device includes a semiconductor substrate and an N-type source and drain within the substrate. An oxide-nitride-oxide (ONO) stack is formed over the substrate. The ONO stack includes a thin bottom oxide layer. A P+ polysilicon gate electrode is formed over the ONO stack. The memory device is operative to perform a channel erase operation in which a pair of charge storing cells within the nitride layer are erased simultaneously.
摘要翻译：非易失性存储器件包括衬底内的半导体衬底和N型源极和漏极。在衬底上形成氧化物 - 氧化物 - 氧化物（ONO）堆叠。 ONO堆叠包括薄的底部氧化物层。在ONO堆叠上形成P + SUPER多晶硅栅电极。存储器件可操作以执行其中同时擦除氮化物层内的一对电荷存储单元的通道擦除操作。

2. 发明授权

US06885590B1 Memory device having A P+ gate and thin bottom oxide and method of erasing same 有权
标题翻译：具有P +栅极和薄底部氧化物的存储器件及其擦除方法
公开(公告)号：US06885590B1
公开(公告)日：2005-04-26
申请号：US10341881
申请日：2003-01-14
申请人： Wei Zheng , Chi Chang , Tazrien Kamal
发明人： Wei Zheng , Chi Chang , Tazrien Kamal
IPC分类号： H01L29/788 , H01L29/792 , G11C16/04
CPC分类号： H01L29/7923 , H01L29/7887
摘要： A non-volatile memory device includes a semiconductor substrate and an N-type source and drain within the substrate. An oxide-nitride-oxide (ONO) stack is formed over the substrate. The ONO stack includes a thin bottom oxide layer. A P+ polysilicon electrode is formed over the ONO stack. The memory device is operative to perform a channel erase operation in which a pair of charge storing cells with the nitride layer are erased simultaneously.
摘要翻译：非易失性存储器件包括衬底内的半导体衬底和N型源极和漏极。在衬底上形成氧化物 - 氧化物 - 氧化物（ONO）堆叠。 ONO堆叠包括薄的底部氧化物层。在ONO堆叠上形成P + SUPER多晶硅电极。存储器件可操作以执行信道擦除操作，其中同时擦除具有氮化物层的一对电荷存储单元。

3. 发明授权

US07671403B2 P-channel NAND in isolated N-well 有权
标题翻译：隔离N阱中的P沟道NAND
公开(公告)号：US07671403B2
公开(公告)日：2010-03-02
申请号：US11567257
申请日：2006-12-06
申请人： Wei Zheng , Chi Chang , Mark Randolph , Satoshi Torii
发明人： Wei Zheng , Chi Chang , Mark Randolph , Satoshi Torii
IPC分类号： H01L29/792
CPC分类号： H01L27/115 , H01L27/11568
摘要： A device includes a substrate and multiple wells formed over the substrate and isolated from one another by dielectric trenches. The device further includes multiple memory elements formed over the wells, each of the memory elements extending approximately perpendicular to the wells and including a material doped with n-type impurities. The device also includes multiple source/drain regions, each source/drain region formed within one of multiple trenches and inside one of the plurality of wells between a pair of the memory elements, each of the source/drain regions implanted with p-type impurities. The device further includes a first substrate contact formed in a first one of the multiple trenches through a first one of the wells into the substrate and a second substrate contact formed in a second one of the multiple trenches through a second one of the wells into the substrate.
摘要翻译：一种器件包括衬底和形成在衬底上并由电介质沟槽彼此隔离的多个阱。该器件还包括形成在阱上的多个存储元件，每个存储元件大致垂直于阱延伸并且包括掺杂有n型杂质的材料。器件还包括多个源极/漏极区域，每个源极/漏极区域形成在多个沟槽中的一个内，并且在一对存储元件之间的多个阱中的一个内部，源极/漏极区域中的每一个注入p型杂质。所述器件还包括形成在所述多个沟槽中的第一个沟槽中的第一衬底接触件，穿过所述衬底中的第一孔，以及形成在所述多个沟槽中的第二个沟槽中的第二衬底接触件中的第二衬底接触入第基质。

4. 发明申请

US20080142875A1 Memory cells having split charge storage nodes and methods for fabricating memory cells having split charge storage nodes 有权
标题翻译：具有分离电荷存储节点的存储单元和用于制造具有分离电荷存储节点的存储单元的方法
公开(公告)号：US20080142875A1
公开(公告)日：2008-06-19
申请号：US11639666
申请日：2006-12-15
申请人： Chungho Lee , Wei Zheng , Chi Chang , Unsoon Kim , Hiroyuki Kinoshita
发明人： Chungho Lee , Wei Zheng , Chi Chang , Unsoon Kim , Hiroyuki Kinoshita
IPC分类号： H01L29/792 , H01L21/336
CPC分类号： H01L21/28282 , H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/1037 , H01L29/1083 , H01L29/42332 , H01L29/42348 , H01L29/66537 , H01L29/7887 , H01L29/7923
摘要： Memory cells having split charge storage nodes and methods for fabricating memory cells having split charge storage nodes are disclosed. A disclosed method includes forming a first trench and an adjacent second trench in a semiconductor substrate, the first trench and the second trench each defining a first sidewall and a second sidewall respectively and forming a first source/drain region in the substrate and a second source/drain region in the substrate, where the first source/drain region and the second source/drain region are formed substantially under the first trench and the second trench in the semiconductor substrate respectively. Moreover, a method includes forming a bit line punch through barrier in the substrate between the first source/drain region and the second source drain region and forming a first storage element on the first sidewall of the first trench and a second storage element on the second sidewall of the second element. A word line is formed in contact with the first storage element and the second storage element.
摘要翻译：公开了具有分割电荷存储节点的存储单元和用于制造具有分离电荷存储节点的存储单元的方法。所公开的方法包括在半导体衬底中形成第一沟槽和相邻的第二沟槽，第一沟槽和第二沟槽分别限定第一侧壁和第二侧壁，并在衬底中形成第一源极/漏极区域，第二源极 /漏极区域，其中第一源极/漏极区域和第二源极/漏极区域分别基本上形成在半导体衬底中的第一沟槽和第二沟槽下方。此外，一种方法包括在第一源极/漏极区域和第二源极漏极区域之间的衬底中形成位线穿通阻挡层，并在第一沟槽的第一侧壁上形成第一存储元件，在第二沟槽的第二沟槽上形成第二存储元件第二元件的侧壁。形成与第一存储元件和第二存储元件接触的字线。

5. 发明申请

US20080135918A1 P-CHANNEL NAND IN ISOLATED N-WELL 有权
标题翻译： P-CHANNEL NAND在隔离N-WELL中
公开(公告)号：US20080135918A1
公开(公告)日：2008-06-12
申请号：US11567257
申请日：2006-12-06
申请人： Wei Zheng , Chi Chang , Mark Randolph , Satoshi Torii
发明人： Wei Zheng , Chi Chang , Mark Randolph , Satoshi Torii
IPC分类号： H01L27/115
CPC分类号： H01L27/115 , H01L27/11568
摘要： A device includes a substrate and multiple wells formed over the substrate and isolated from one another by dielectric trenches. The device further includes multiple memory elements formed over the wells, each of the memory elements extending approximately perpendicular to the wells and including a material doped with n-type impurities. The device also includes multiple source/drain regions, each source/drain region formed within one of multiple trenches and inside one of the plurality of wells between a pair of the memory elements, each of the source/drain regions implanted with p-type impurities. The device further includes a first substrate contact formed in a first one of the multiple trenches through a first one of the wells into the substrate and a second substrate contact formed in a second one of the multiple trenches through a second one of the wells into the substrate.
摘要翻译：一种器件包括衬底和形成在衬底上并由电介质沟槽彼此隔离的多个阱。该器件还包括形成在阱上的多个存储元件，每个存储元件大致垂直于阱延伸并且包括掺杂有n型杂质的材料。器件还包括多个源极/漏极区域，每个源极/漏极区域形成在多个沟槽中的一个内，并且在一对存储元件之间的多个阱中的一个内部，源极/漏极区域中的每一个注入p型杂质。所述器件还包括形成在所述多个沟槽中的第一个沟槽中的第一衬底接触件，穿过所述衬底中的第一孔，以及形成在所述多个沟槽中的第二个沟槽中的第二衬底接触件中的第二衬底接触入第基质。

6. 发明授权

US06906959B2 Method and system for erasing a nitride memory device 有权
标题翻译：擦除氮化物存储器件的方法和系统
公开(公告)号：US06906959B2
公开(公告)日：2005-06-14
申请号：US10306252
申请日：2002-11-27
申请人： Mark W. Randolph , Chi Chang , Yi He , Wei Zheng , Edward F. Runnion , Zhizheng Liu
发明人： Mark W. Randolph , Chi Chang , Yi He , Wei Zheng , Edward F. Runnion , Zhizheng Liu
IPC分类号： G11C16/04 , G11C16/14 , H01L21/336 , H01L29/792
CPC分类号： H01L29/66833 , G11C16/0475 , G11C16/14 , H01L29/7923
摘要： The present invention is a method and system for erasing a nitride memory device. In one embodiment of the present invention, an isolated P-well is formed in a semiconductor substrate. A plurality of N-type impurity concentrations are formed in the isolated P-well and a nitride memory cell is fabricated between two of the N-type impurity concentrations. Finally, an electrical contact is coupled to the isolated P-well.
摘要翻译：本发明是一种擦除氮化物存储器件的方法和系统。在本发明的一个实施例中，在半导体衬底中形成隔离的P阱。在分离的P阱中形成多个N型杂质浓度，并且在两种N型杂质浓度之间制造氮化物存储单元。最后，电接点耦合到隔离的P阱。

7. 发明授权

US08742486B2 Flash memory cells having trenched storage elements 有权
标题翻译：具有沟槽存储元件的闪存单元
公开(公告)号：US08742486B2
公开(公告)日：2014-06-03
申请号：US11702846
申请日：2007-02-05
申请人： Wei Zheng , Chi Chang , Unsoon Kim
发明人： Wei Zheng , Chi Chang , Unsoon Kim
IPC分类号： H01L29/68
CPC分类号： H01L29/792 , H01L21/823418 , H01L27/115 , H01L27/11568 , H01L29/66833 , H01L29/7923
摘要： An embodiment of the present invention is directed to a memory cell. The memory cell includes a first trench formed in a semiconductor substrate and a second trench formed in said semiconductor substrate adjacent to said first trench. The first trench and the second trench each define a first side wall and a second sidewall respectively. The memory cell further includes a first storage element formed on the first sidewall of the first trench and a second storage element formed on the second sidewall of the second trench.
摘要翻译：本发明的实施例涉及存储单元。存储单元包括形成在半导体衬底中的第一沟槽和形成在与所述第一沟槽相邻的所述半导体衬底中的第二沟槽。第一沟槽和第二沟槽分别限定第一侧壁和第二侧壁。存储单元还包括形成在第一沟槽的第一侧壁上的第一存储元件和形成在第二沟槽的第二侧壁上的第二存储元件。

8. 发明授权

US08076712B2 Semiconductor memory comprising dual charge storage nodes and methods for its fabrication 有权
标题翻译：半导体存储器包括双电荷存储节点及其制造方法
公开(公告)号：US08076712B2
公开(公告)日：2011-12-13
申请号：US12840165
申请日：2010-07-20
申请人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
发明人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
IPC分类号： H01L29/788
CPC分类号： H01L29/42332 , H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/42348 , H01L29/7887 , H01L29/7923
摘要： A dual charge storage node memory device and methods for its fabrication are provided. In one embodiment a dielectric plug is formed comprising a first portion recessed into a semiconductor substrate and a second portion extending above the substrate. A layer of semiconductor material is formed overlying the second portion. A first layered structure is formed overlying a first side of the second portion of the dielectric plug, and a second layered structure is formed overlying a second side, each of the layered structures overlying the layer of semiconductor material and comprising a charge storage layer between first and second dielectric layers. Ions are implanted into the substrate to form a first bit line and second bit line, and a layer of conductive material is deposited and patterned to form a control gate overlying the dielectric plug and the first and second layered structures.
摘要翻译：提供了双电荷存储节点存储器件及其制造方法。在一个实施例中，形成包括凹入半导体衬底的第一部分和在衬底上延伸的第二部分的电介质插塞。在第二部分上形成一层半导体材料。第一层状结构形成在电介质塞的第二部分的第一侧上，并且第二层结构形成在第二侧上，每个层叠结构覆盖在半导体材料层上，并且包括第一和第二层之间的电荷存储层和第二电介质层。将离子注入到衬底中以形成第一位线和第二位线，并且沉积和图案化导电材料层以形成覆盖在电介质插塞和第一和第二分层结构上的控制栅极。

9. 发明授权

US07767517B2 Semiconductor memory comprising dual charge storage nodes and methods for its fabrication 有权
标题翻译：半导体存储器包括双电荷存储节点及其制造方法
公开(公告)号：US07767517B2
公开(公告)日：2010-08-03
申请号：US11613513
申请日：2006-12-20
申请人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
发明人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
IPC分类号： H01L21/8242
CPC分类号： H01L29/42332 , H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/42348 , H01L29/7887 , H01L29/7923
摘要： A dual charge storage node memory device and methods for its fabrication are provided. In one embodiment a dielectric plug is formed comprising a first portion recessed into a semiconductor substrate and a second portion extending above the substrate. A layer of semiconductor material is formed overlying the second portion. A first layered structure is formed overlying a first side of the second portion of the dielectric plug, and a second layered structure is formed overlying a second side, each of the layered structures overlying the layer of semiconductor material and comprising a charge storage layer between first and second dielectric layers. Ions are implanted into the substrate to form a first bit line and second bit line, and a layer of conductive material is deposited and patterned to form a control gate overlying the dielectric plug and the first and second layered structures.
摘要翻译：提供了双电荷存储节点存储器件及其制造方法。在一个实施例中，形成包括凹入半导体衬底的第一部分和在衬底上延伸的第二部分的电介质插塞。在第二部分上形成一层半导体材料。第一层状结构形成在电介质塞的第二部分的第一侧上，并且形成在第二侧上的第二层状结构，每个层叠结构覆盖在半导体材料层上，并且包括第一和第二层之间的电荷存储层和第二电介质层。将离子注入到衬底中以形成第一位线和第二位线，并且沉积和图案化导电材料层以形成覆盖在电介质插塞和第一和第二分层结构上的控制栅极。

10. 发明申请

US20080149999A1 SEMICONDUCTOR MEMORY COMPRISING DUAL CHARGE STORAGE NODES AND METHODS FOR ITS FABRICATION 有权
标题翻译：包含双电池存储器的半导体存储器及其制造方法
公开(公告)号：US20080149999A1
公开(公告)日：2008-06-26
申请号：US11613513
申请日：2006-12-20
申请人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
发明人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
IPC分类号： H01L29/792 , H01L21/336
CPC分类号： H01L29/42332 , H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/42348 , H01L29/7887 , H01L29/7923
摘要： A dual charge storage node memory device and methods for its fabrication are provided. In one embodiment a dielectric plug is formed comprising a first portion recessed into a semiconductor substrate and a second portion extending above the substrate. A layer of semiconductor material is formed overlying the second portion. A first layered structure is formed overlying a first side of the second portion of the dielectric plug, and a second layered structure is formed overlying a second side, each of the layered structures overlying the layer of semiconductor material and comprising a charge storage layer between first and second dielectric layers. Ions are implanted into the substrate to form a first bit line and second bit line, and a layer of conductive material is deposited and patterned to form a control gate overlying the dielectric plug and the first and second layered structures.
摘要翻译：提供了双电荷存储节点存储器件及其制造方法。在一个实施例中，形成包括凹入半导体衬底的第一部分和在衬底上延伸的第二部分的电介质插塞。在第二部分上形成一层半导体材料。第一层状结构形成在电介质塞的第二部分的第一侧上，并且形成在第二侧上的第二层状结构，每个层叠结构覆盖在半导体材料层上，并且包括第一和第二层之间的电荷存储层和第二电介质层。将离子注入到衬底中以形成第一位线和第二位线，并且沉积和图案化导电材料层以形成覆盖在电介质插塞和第一和第二分层结构上的控制栅极。

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