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1. 发明申请

US20100078661A1 MACHINED SURFACE LED ASSEMBLY 审中-公开
标题翻译：加工表面LED组件
公开(公告)号：US20100078661A1
公开(公告)日：2010-04-01
申请号：US12239470
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch , Michael Solomensky
发明人： Wei Shi , Alex Shaikevitch , Michael Solomensky
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/46 , H01L33/54 , H01L2224/48091 , H01L2224/48137 , H01L2224/49111 , H01L2224/49175 , H01L2924/00 , H01L2924/00014
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

2. 发明申请

US20100079994A1 MULTI-CUP LED ASSEMBLY 有权
标题翻译：多功能LED组件
公开(公告)号：US20100079994A1
公开(公告)日：2010-04-01
申请号：US12239552
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch , Shanquan Bao , Michael Solomensky
发明人： Wei Shi , Alex Shaikevitch , Shanquan Bao , Michael Solomensky
IPC分类号： H01L33/00 , F21V7/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L2224/48137 , H01L2224/49175 , H01L2924/00
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

3. 发明授权

US09252336B2 Multi-cup LED assembly 有权
标题翻译：多杯LED组件
公开(公告)号：US09252336B2
公开(公告)日：2016-02-02
申请号：US12239552
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch , Shanquan Bao , Michael Solomensky
发明人： Wei Shi , Alex Shaikevitch , Shanquan Bao , Michael Solomensky
IPC分类号： H01L33/00 , H01L33/48 , H01L25/075
CPC分类号： H01L33/486 , H01L25/0753 , H01L2224/48137 , H01L2224/49175 , H01L2924/00
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

4. 发明申请

US20100078663A1 TRANSPARENT SOLDER MASK LED ASSEMBLY 有权
标题翻译：透明焊接面罩LED组件
公开(公告)号：US20100078663A1
公开(公告)日：2010-04-01
申请号：US12239516
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch
发明人： Wei Shi , Alex Shaikevitch
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48137 , H01L2224/49175 , H05K1/0274 , H05K3/28 , H05K2201/0108 , H05K2201/10106 , H05K2201/2054 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

5. 发明授权

US08049236B2 Non-global solder mask LED assembly 有权
标题翻译：非全局焊接面罩LED组件
公开(公告)号：US08049236B2
公开(公告)日：2011-11-01
申请号：US12239494
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch
发明人： Wei Shi , Alex Shaikevitch
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H05K1/0274 , H05K3/28 , H05K2201/0989 , H05K2201/10106 , H05K2201/2054 , H01L2924/00 , H01L2924/00014
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

6. 发明授权

US08058664B2 Transparent solder mask LED assembly 有权
标题翻译：透明焊接面罩LED组件
公开(公告)号：US08058664B2
公开(公告)日：2011-11-15
申请号：US12239516
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch
发明人： Wei Shi , Alex Shaikevitch
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48137 , H01L2224/49175 , H05K1/0274 , H05K3/28 , H05K2201/0108 , H05K2201/10106 , H05K2201/2054 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

7. 发明申请

US20100078662A1 NON-GLOBAL SOLDER MASK LED ASSEMBLY 有权
标题翻译：非全球焊接面罩LED组件
公开(公告)号：US20100078662A1
公开(公告)日：2010-04-01
申请号：US12239494
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch
发明人： Wei Shi , Alex Shaikevitch
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H05K1/0274 , H05K3/28 , H05K2201/0989 , H05K2201/10106 , H05K2201/2054 , H01L2924/00 , H01L2924/00014
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

8. 发明授权

US09346791B2 Itraconazole analogs and use thereof 有权
标题翻译：伊曲康唑类似物及其用途
公开(公告)号：US09346791B2
公开(公告)日：2016-05-24
申请号：US14343040
申请日：2012-09-07
申请人： Jun O. Liu , Wei Shi , Kalyan Kumar Pasunooti
发明人： Jun O. Liu , Wei Shi , Kalyan Kumar Pasunooti
IPC分类号： C07D405/14 , A61K31/496 , A61K31/506
CPC分类号： C07D405/14 , A61K31/496 , A61K31/506
摘要： Provided herein are Itraconazole analogs. Also provided herein are methods of inhibition of Hedgehog pathway, vascular endothelial growth factor receptor 2 (VEGFR2) glycosylation, angiogenesis and treatment of disease with Itraconazole analogs.
摘要翻译：本文提供伊曲康唑类似物。本文还提供了抑制Hedgehog途径，血管内皮生长因子受体2（VEGFR2）糖基化，血管生成和伊曲康唑类似物治疗疾病的方法。

9. 发明申请

US20130301625A1 AGGREGATION OF INFORMATION UNITS IN A WIRELESS NETWORK 审中-公开
标题翻译：在无线网络中聚合信息单元
公开(公告)号：US20130301625A1
公开(公告)日：2013-11-14
申请号：US13470035
申请日：2012-05-11
申请人： Alexander Thoukydides , Fei Tong , Wei Shi
发明人： Alexander Thoukydides , Fei Tong , Wei Shi
IPC分类号： H04W84/12 , H04W84/02
CPC分类号： H04W28/06
摘要： The present application relates to a method for transmitting information from a wireless access point to one or more wireless stations. The method comprises aggregating a plurality of information units of compatible types, such as MAC protocol data units (MPDUs) or acknowledgements into a single data frame, modulating the single data frame and transmitting the modulated data frame containing the plurality of information units to the one or more wireless stations.
摘要翻译：本申请涉及一种从无线接入点向一个或多个无线站发送信息的方法。该方法包括将多个兼容类型的信息单元（例如MAC协议数据单元（MPDU）或确认）聚合到单个数据帧中，调制单个数据帧并将包含多个信息单元的调制数据帧发送到一个或更多的无线电台。

10. 发明授权

US08129144B2 Papilloma pseudovirus and preparation 失效
标题翻译：乳糜假病毒及其制备
公开(公告)号：US08129144B2
公开(公告)日：2012-03-06
申请号：US11784626
申请日：2007-04-09
申请人： Liang Qiao , Wei Shi , Yujun Huang , Jianzhong Liu
发明人： Liang Qiao , Wei Shi , Yujun Huang , Jianzhong Liu
IPC分类号： C12P21/06
CPC分类号： C12N7/00 , A61K2039/525 , C12N2710/20023 , C12N2710/20061
摘要： The invention involves a papilloma pseudovirus that can induce immune response after oral intake as well as its preparation. It is characterized in that HPV or BPV pseudovirus are made by disrupting HPV-VLP or BPV-VLP, mixing them with plasmids (plasmids or DNA vaccine), and reassembling them into the pseudoviruses (VLPs with plasmids inside). Oral administration of the pseudoviruses will result in delivery to mucosal and systemic lymphoid tissues and induce immune responses for disease prevention and treatment. The pseudovirus induces stronger immune response than DNA vaccines. Additionally, the pseudovirus can be applied in gene therapy by bringing the therapeutic genes into lymphoid tissues in the human body.
摘要翻译：本发明涉及一种乳头状假性假病毒，可在口服摄入后诱导免疫反应及其制备。其特征在于HPV或BPV假病毒通过破坏HPV-VLP或BPV-VLP，与质粒（质粒或DNA疫苗）混合并将其重新组装成假病毒（其中具有质粒的VLP）而制备。假性病毒的口服给药将导致输送到粘膜和系统性淋巴组织，并诱导用于疾病预防和治疗的免疫应答。假DNA病毒诱导比DNA疫苗更强的免疫应答。此外，假病毒可以通过将治疗基因引入人体的淋巴组织来应用于基因治疗。

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