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    • 1. 发明授权
    • Method of programming, erasing and reading memory cells in a resistive memory array
    • 在电阻式存储器阵列中编程,擦除和读取存储单元的方法
    • US07355886B1
    • 2008-04-08
    • US11633791
    • 2006-12-05
    • Wei Daisy CaiSwaroop KazaColin S. BillMichael VanBuskirk
    • Wei Daisy CaiSwaroop KazaColin S. BillMichael VanBuskirk
    • G11C11/00
    • G11C13/0007G11C13/0069G11C2013/009G11C2213/32G11C2213/34G11C2213/72
    • The present approach is a method of writing (which may be programming or erasing) data to a selected memory cell of a memory array. The array includes a plurality of word lines, a plurality of bit lines, a plurality of memory cells each including a diode and a resistive memory device in series connecting a word line and a bit line, and a plurality of transistors, each having a first and second source/drain terminals and a gate, each transistor having a first source/drain terminal connected to a bit line. In the present method a voltage is applied to a selected word line, and a voltage is applied to the second source/drain terminal of a transistor having its first source/drain terminal connected to a selected bit line. The voltage applied to the selected word line is greater than the voltage applied to the second source/drain terminal of that transistor.
    • 本方法是将数据写入(其可以是编程或擦除)数据到存储器阵列的选定存储单元的方法。 阵列包括多个字线,多个位线,多个存储单元,每个存储单元包括串联连接字线和位线的二极管和电阻存储器件,以及多个晶体管,每个晶体管具有第一 和第二源极/漏极端子和栅极,每个晶体管具有连接到位线的第一源极/漏极端子。 在本方法中,对所选择的字线施加电压,并且将电压施加到其第一源极/漏极端子连接到选定位线的晶体管的第二源极/漏极端子。 施加到所选字线的电压大于施加到该晶体管的第二源极/漏极端子的电压。
    • 9. 发明授权
    • Temperature compensation of thin film diode voltage threshold in memory sensing circuit
    • 存储器感应电路中薄膜二极管电压阈值的温度补偿
    • US07145824B2
    • 2006-12-05
    • US11086884
    • 2005-03-22
    • Colin S. BillWei Daisy Cai
    • Colin S. BillWei Daisy Cai
    • G11C7/04
    • G11C13/0016B82Y10/00G11C7/04G11C11/5664G11C13/00G11C13/0014G11C2213/72Y10S977/943
    • Systems and methodologies are provided for temperature compensation of thin film diode voltage levels in memory sensing circuits. The subject invention includes a temperature sensitive bias circuit and an array core with a temperature variable select device. The array core can consist of a thin film diode in series with a nanoscale resistive memory cell. The temperature sensitive bias circuit can include a thin film diode in series with two resistors, and provides a temperature compensating bias voltage to the array core. The thin film diode of the temperature sensitive bias circuit tracks the diode of the array core, while the two resistors create a resistive ratio to mimic the effect of temperature and/or process variation(s) on the array core. The compensating bias reference voltage is generated by the temperature sensitive bias circuit, duplicated by a differential amplifier, and utilized to maintain a constant operation voltage level on the nanoscale resistive memory cell.
    • 提供了用于存储器感测电路中的薄膜二极管电压电平的温度补偿的系统和方法。 本发明包括温度敏感偏置电路和具有温度可变选择装置的阵列芯。 阵列芯可以由与纳米级电阻式存储单元串联的薄膜二极管组成。 温度敏感偏置电路可以包括与两个电阻器串联的薄膜二极管,并且向阵列芯提供温度补偿偏置电压。 温度敏感偏置电路的薄膜二极管跟踪阵列芯的二极管,而两个电阻产生电阻比,以模拟阵列芯上的温度和/或工艺变化的影响。 补偿偏置参考电压由温度敏感偏置电路产生,由差分放大器复制,并用于在纳米级电阻存储单元上维持恒定的工作电压电平。
    • 10. 发明授权
    • Flash memory device with external high voltage supply
    • 具有外部高压电源的闪存设备
    • US07626882B2
    • 2009-12-01
    • US11613383
    • 2006-12-20
    • Nian YangYonggang WuAaron LeeWei Daisy Cai
    • Nian YangYonggang WuAaron LeeWei Daisy Cai
    • G11C5/14
    • G11C16/12
    • A semiconductor memory device (104) selectably connectable to an external high voltage power supply (122) is provided. The semiconductor memory device (104) includes a switch (314), a detector (316) and a timing device (318). The switch (314) is connected to external voltage supply signals and selectably couples the external voltage supply signals to memory cells (305) of the semiconductor memory device (104) for memory operations thereof. The external voltage supply signals including a high voltage signal (412) provided from the external high voltage power supply (122) and an operational voltage signal Vcc (402). The detector (316) is connected to the external voltage supply signals for generating a timer activation signal (404) in response to detecting an operational voltage power-on period. The timing device (318) signals the switch (314) to decouple the high voltage signal (412) and the operational voltage signal (402) from the memory cells (305) in response to the timer activation signal (404) and to recouple the high voltage signal (412) and the operational voltage signal (402) to the memory cells (305) a time delay interval thereafter. The time delay interval is determined in response to the high voltage signal (412).
    • 提供可选择地连接到外部高压电源(122)的半导体存储器件(104)。 半导体存储器件(104)包括开关(314),检测器(316)和定时装置(318)。 开关(314)连接到外部电压源信号,并且可选择地将外部电压供应信号耦合到半导体存储器件(104)的存储单元(305),用于存储器操作。 包括从外部高压电源(122)提供的高电压信号(412)的外部电压供给信号和操作电压信号Vcc(402)。 检测器(316)连接到外部电压源信号,以响应于检测到工作电压通电周期而产生定时器激活信号(404)。 定时装置(318)响应于定时器启动信号(404),向开关314通知高压信号412和操作电压信号402与存储单元305的耦合, 高电压信号(412)和操作电压信号(402)到其后的时间延迟区间。 响应于高电压信号确定时间延迟间隔(412)。