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1. 发明授权

US09360502B2 Increasing current carrying capability through direct liquid cooling of test contacts 有权
标题翻译：通过测试触点的直接液体冷却来提高载流能力
公开(公告)号：US09360502B2
公开(公告)日：2016-06-07
申请号：US13976013
申请日：2011-12-31
申请人： Warren S. Crippen , Brett Grossman , Roy E. Swart , Pooya Tadayon
发明人： Warren S. Crippen , Brett Grossman , Roy E. Swart , Pooya Tadayon
IPC分类号： G01R31/10 , G01R1/44 , G01R31/28 , G01R1/067
CPC分类号： G01R1/44 , G01R1/067 , G01R31/2877
摘要： Testing methods and systems are described. One method for testing an electronic device includes providing a probe in electrical contact with a device. The method also includes positioning an interface of the probe and the device in a liquid medium. The method also includes transmitting a current from the probe through the interface while the interface is in the liquid medium. Other embodiments are described and claimed.
摘要翻译：描述测试方法和系统。用于测试电子设备的一种方法包括提供与设备电接触的探针。该方法还包括将探针和装置的界面定位在液体介质中。该方法还包括当界面处于液体介质中时通过界面从探针传输电流。描述和要求保护其他实施例。

2. 发明申请

US20140210499A1 INCREASING CURRENT CARRYING CAPABILITY THROUGH DIRECT LIQUID COOLING OF TEST CONTACTS 有权
标题翻译：通过直接液体冷却测试联系来提高当前承载能力
公开(公告)号：US20140210499A1
公开(公告)日：2014-07-31
申请号：US13976013
申请日：2011-12-31
申请人： Warren S. Crippen , Brett Grossman , Roy E. Swart , Pooya Tadayon
发明人： Warren S. Crippen , Brett Grossman , Roy E. Swart , Pooya Tadayon
IPC分类号： G01R1/44 , G01R1/067
CPC分类号： G01R1/44 , G01R1/067 , G01R31/2877
摘要： Testing methods and systems are described. One method for testing an electronic device includes providing a probe in electrical contact with a device. The method also includes positioning an interface of the probe and the device in a liquid medium. The method also includes transmitting a current from the probe through the interface while the interface is in the liquid medium. Other embodiments are described and claimed.
摘要翻译：描述测试方法和系统。用于测试电子设备的一种方法包括提供与设备电接触的探针。该方法还包括将探针和装置的界面定位在液体介质中。该方法还包括当界面处于液体介质中时通过界面从探针传输电流。描述和要求保护其他实施例。

3. 发明申请

US20140239995A1 TEST PROBES 有权
标题翻译：测试问题
公开(公告)号：US20140239995A1
公开(公告)日：2014-08-28
申请号：US13976448
申请日：2011-12-31
申请人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
发明人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
IPC分类号： G01R1/067
CPC分类号： G01R1/06711 , G01R1/07357 , G01R3/00
摘要： The formation of test probe structures is described. One test probe structure includes a tip portion and a handle portion spaced a distance away from the tip portion. The test probe structure also includes a body bend portion positioned between the tip portion and the handle portion, and an intermediate portion positioned between the body bend portion and the handle portion. The body bend portion may include a curved shape extending from the intermediate portion to the tip portion. The tip portion may be formed to be offset from a longitudinal axis defined by the intermediate portion. The test probe structure defines a length and includes a cross-sectional area that is different at a plurality of positions along the length. Other embodiments are described and claimed.
摘要翻译：描述了测试探针结构的形成。一个测试探针结构包括尖端部分和与尖端部分间隔开距离的手柄部分。测试探针结构还包括位于尖端部分和手柄部分之间的身体弯曲部分，以及位于身体弯曲部分和手柄部分之间的中间部分。身体弯曲部分可以包括从中间部分延伸到尖端部分的弯曲形状。尖端部分可以形成为从由中间部分限定的纵向轴线偏移。测试探针结构限定长度并且包括在沿着长度的多个位置处不同的横截面面积。描述和要求保护其他实施例。

4. 发明授权

US09279830B2 Test probe structures and methods including positioning test probe structures in a test head 有权
标题翻译：测试探头结构和方法，包括在测试头中定位测试探头结构
公开(公告)号：US09279830B2
公开(公告)日：2016-03-08
申请号：US13976448
申请日：2011-12-31
申请人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
发明人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
IPC分类号： G01R31/00 , G01R1/067 , G01R1/073 , G01R3/00
CPC分类号： G01R1/06711 , G01R1/07357 , G01R3/00
摘要： The formation of test probe structures is described. One test probe structure includes a tip portion and a handle portion spaced a distance away from the tip portion. The test probe structure also includes a body bend portion positioned between the tip portion and the handle portion, and an intermediate portion positioned between the body bend portion and the handle portion. The body bend portion may include a curved shape extending from the intermediate portion to the tip portion. The tip portion may be formed to be offset from a longitudinal axis defined by the intermediate portion. The test probe structure defines a length and includes a cross-sectional area that is different at a plurality of positions along the length. Other embodiments are described and claimed.
摘要翻译：描述了测试探针结构的形成。一个测试探针结构包括尖端部分和与尖端部分间隔开距离的手柄部分。测试探针结构还包括位于尖端部分和手柄部分之间的身体弯曲部分，以及位于身体弯曲部分和手柄部分之间的中间部分。身体弯曲部分可以包括从中间部分延伸到尖端部分的弯曲形状。尖端部分可以形成为从由中间部分限定的纵向轴线偏移。测试探针结构限定长度并且包括在沿着长度的多个位置处不同的横截面面积。描述和要求保护其他实施例。

5. 发明申请

US20140029150A1 INTERPOSER TO REGULATE CURRENT FOR WAFER TEST TOOLING 有权
标题翻译：用于调节流量测试工具的插件
公开(公告)号：US20140029150A1
公开(公告)日：2014-01-30
申请号：US13976970
申请日：2012-03-06
申请人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
发明人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
IPC分类号： H02H9/02
CPC分类号： H02H9/02 , G01R1/07385 , G01R1/36 , G01R31/2889
摘要： An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
摘要翻译：描述了内插器来调节晶圆测试工具中的电流。在一个示例中，插入器包括耦合到自动测试设备的第一连接焊盘和耦合到被测器件的第二连接焊盘。插入器还包括过电流限制电路，用于连接第一和第二连接焊盘，并且当第一和第二连接焊盘之间的电流超过预定量时，断开第一和第二连接焊盘。

6. 发明申请

US20130000117A1 LIQUID METAL INTERCONNECTS 有权
标题翻译：液体金属互连
公开(公告)号：US20130000117A1
公开(公告)日：2013-01-03
申请号：US13173933
申请日：2011-06-30
申请人： Rajashree Baskaran , Kimin Jun , Ting Zhong , Roy E. Swart , Paul B. Fischer
发明人： Rajashree Baskaran , Kimin Jun , Ting Zhong , Roy E. Swart , Paul B. Fischer
IPC分类号： H01R43/16
CPC分类号： G01R1/0416 , G01R1/06783 , H01R3/08 , Y10T29/49204
摘要： Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.
摘要翻译：本发明的实施例提供了使用液态金属形成电连接的方法。使用液态金属的电气连接对于半导体器件的测试和验证是有用的。通过液态金属区域在测试界面的探针和被测器件的电子接口之间形成电连接。在本发明的实施例中，液态金属互连由镓或镓的液态金属合金构成。为了可靠地进行电连接，使用液态金属触点不需要施加预定量的力。

7. 发明申请

US20150008950A1 MANUFACTURING ADVANCED TEST PROBES 审中-公开
标题翻译：制造高级测试探针
公开(公告)号：US20150008950A1
公开(公告)日：2015-01-08
申请号：US13977665
申请日：2011-12-31
申请人： Roy E. Swart , Paul B. Fischer , Charlotte C. Kwong
发明人： Roy E. Swart , Paul B. Fischer , Charlotte C. Kwong
IPC分类号： G01R3/00 , B23K26/38 , B23K26/18 , G01R1/067 , G01R1/073
CPC分类号： G01R3/00 , B23K26/18 , B23K26/38 , G01R1/067 , G01R1/073 , Y10T29/49156
摘要： Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.
摘要翻译：实施例涉及测试探针的形成。一种方法包括提供导电材料的散装片材。使用激光以预定图案切割散片，以形成测试探针。描述和要求保护其他实施例。

8. 发明授权

US08513966B2 Probes formed from semiconductor region vias 有权
标题翻译：探针由半导体区形成
公开(公告)号：US08513966B2
公开(公告)日：2013-08-20
申请号：US12854697
申请日：2010-08-11
申请人： Qing Ma , Roy E. Swart , Paul B. Fischer , Johanna M. Swan
发明人： Qing Ma , Roy E. Swart , Paul B. Fischer , Johanna M. Swan
IPC分类号： G01R31/20
CPC分类号： G01R1/06716 , G01R1/07314 , G01R3/00
摘要： Embodiments of the invention describe forming a set of probes using semiconductor regions each including a plurality of vias. A first set of probe segments may be formed from a first set of vias on a first semiconductor region. A second set of probe segments may be formed from a second set of vias on a second semiconductor region and bonded to the first set of probe segments. At least one spring comprising a dielectric material may be formed to couple the first set of probe segments, while a set of metal tips disposed on the second set of probe segments.
摘要翻译：本发明的实施例描述了使用包括多个通孔的半导体区形成一组探针。第一组探针段可以由第一半导体区上的第一组通孔形成。第二组探针段可以由第二半导体区上的第二组通孔形成并结合到第一组探针段上。包括电介质材料的至少一个弹簧可以形成为耦合第一组探针段，而一组设置在第二组探针段上的金属尖端。

9. 发明授权

US09835648B2 Liquid metal interconnects 有权
公开(公告)号：US09835648B2
公开(公告)日：2017-12-05
申请号：US13173933
申请日：2011-06-30
申请人： Rajashree Baskaran , Kimin Jun , Ting Zhong , Roy E. Swart , Paul B. Fischer
发明人： Rajashree Baskaran , Kimin Jun , Ting Zhong , Roy E. Swart , Paul B. Fischer
IPC分类号： G01R31/28 , G01R1/04 , H01R3/08 , G01R1/067
CPC分类号： G01R1/0416 , G01R1/06783 , H01R3/08 , Y10T29/49204
摘要： Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.

10. 发明授权

US09391447B2 Interposer to regulate current for wafer test tooling 有权
标题翻译：用于晶圆测试工具调节电流的插件
公开(公告)号：US09391447B2
公开(公告)日：2016-07-12
申请号：US13976970
申请日：2012-03-06
申请人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
发明人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
IPC分类号： H02H9/08 , H02H9/02 , G01R1/36 , G01R31/28 , G01R1/073
CPC分类号： H02H9/02 , G01R1/07385 , G01R1/36 , G01R31/2889
摘要： An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
摘要翻译：描述了内插器来调节晶圆测试工具中的电流。在一个示例中，插入器包括耦合到自动测试设备的第一连接焊盘和耦合到被测器件的第二连接焊盘。插入器还包括过电流限制电路，用于连接第一和第二连接焊盘，并且当第一和第二连接焊盘之间的电流超过预定量时，断开第一和第二连接焊盘。

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