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1. 发明申请

US20140239995A1 TEST PROBES 有权
标题翻译：测试问题
公开(公告)号：US20140239995A1
公开(公告)日：2014-08-28
申请号：US13976448
申请日：2011-12-31
申请人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
发明人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
IPC分类号： G01R1/067
CPC分类号： G01R1/06711 , G01R1/07357 , G01R3/00
摘要： The formation of test probe structures is described. One test probe structure includes a tip portion and a handle portion spaced a distance away from the tip portion. The test probe structure also includes a body bend portion positioned between the tip portion and the handle portion, and an intermediate portion positioned between the body bend portion and the handle portion. The body bend portion may include a curved shape extending from the intermediate portion to the tip portion. The tip portion may be formed to be offset from a longitudinal axis defined by the intermediate portion. The test probe structure defines a length and includes a cross-sectional area that is different at a plurality of positions along the length. Other embodiments are described and claimed.
摘要翻译：描述了测试探针结构的形成。一个测试探针结构包括尖端部分和与尖端部分间隔开距离的手柄部分。测试探针结构还包括位于尖端部分和手柄部分之间的身体弯曲部分，以及位于身体弯曲部分和手柄部分之间的中间部分。身体弯曲部分可以包括从中间部分延伸到尖端部分的弯曲形状。尖端部分可以形成为从由中间部分限定的纵向轴线偏移。测试探针结构限定长度并且包括在沿着长度的多个位置处不同的横截面面积。描述和要求保护其他实施例。

2. 发明授权

US09279830B2 Test probe structures and methods including positioning test probe structures in a test head 有权
标题翻译：测试探头结构和方法，包括在测试头中定位测试探头结构
公开(公告)号：US09279830B2
公开(公告)日：2016-03-08
申请号：US13976448
申请日：2011-12-31
申请人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
发明人： Roy E. Swart , Warren S. Crippen , Charlotte C. Kwong , David Shia
IPC分类号： G01R31/00 , G01R1/067 , G01R1/073 , G01R3/00
CPC分类号： G01R1/06711 , G01R1/07357 , G01R3/00
摘要： The formation of test probe structures is described. One test probe structure includes a tip portion and a handle portion spaced a distance away from the tip portion. The test probe structure also includes a body bend portion positioned between the tip portion and the handle portion, and an intermediate portion positioned between the body bend portion and the handle portion. The body bend portion may include a curved shape extending from the intermediate portion to the tip portion. The tip portion may be formed to be offset from a longitudinal axis defined by the intermediate portion. The test probe structure defines a length and includes a cross-sectional area that is different at a plurality of positions along the length. Other embodiments are described and claimed.
摘要翻译：描述了测试探针结构的形成。一个测试探针结构包括尖端部分和与尖端部分间隔开距离的手柄部分。测试探针结构还包括位于尖端部分和手柄部分之间的身体弯曲部分，以及位于身体弯曲部分和手柄部分之间的中间部分。身体弯曲部分可以包括从中间部分延伸到尖端部分的弯曲形状。尖端部分可以形成为从由中间部分限定的纵向轴线偏移。测试探针结构限定长度并且包括在沿着长度的多个位置处不同的横截面面积。描述和要求保护其他实施例。

3. 发明申请

US20120074975A1 MICRO POSITIONING TEST SOCKET AND METHODS FOR ACTIVE PRECISION ALIGNMENT AND CO-PLANARITY FEEDBACK 有权
标题翻译：微型定位测试插座和主动精度对齐与平面反馈的方法
公开(公告)号：US20120074975A1
公开(公告)日：2012-03-29
申请号：US12888579
申请日：2010-09-23
申请人： Abram M. Detofsky , Todd P. Albertson , David Shia
发明人： Abram M. Detofsky , Todd P. Albertson , David Shia
IPC分类号： G01R31/28 , G01B11/14 , H01R13/64
CPC分类号： G01R1/0408 , G01B7/31 , G01R1/0483 , G01R1/06794 , G01R31/2891 , H05K1/0268 , H05K2203/162 , H05K2203/166
摘要： Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.
摘要翻译：描述了用于测试微电子封装结构/器件的方法和结构。这些方法可以包括将设备放置在浮动载体中，其中浮动载体通过设置在插座壳体的四个角落中的销钉联接到插座壳体，并且其中至少两个致动马达设置在插座壳体内，并且微型通过利用电容耦合或光纤对准系统来调节装置，其中设置在插座壳体中的对准结构和设置在装置内的对准封装球之间的最大测量电容或最大测量强度表示装置的最佳对准。方法还包括通过使用电容耦合技术进行有源共平面检测的方法。

4. 发明申请

US20050117305A1 Integrated heat sink assembly 审中-公开
标题翻译：集成散热器总成
公开(公告)号：US20050117305A1
公开(公告)日：2005-06-02
申请号：US10725825
申请日：2003-12-01
申请人： Neal Ulen , David Shia , Sandeep Ahuja
发明人： Neal Ulen , David Shia , Sandeep Ahuja
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： Some disclosed embodiments include an integrated heat sink assembly having a standoff press disposed through the bottom of a bore in a support base of the heat sink, a screw disposed through the top of the bore in the support base of the heat sink, a spring adapted to bias the screw against the heat sink, wherein the screw and spring engage the standoff to attach the heat sink to the support base. The integrated heat sink assembly may be used to maintain contact between a heat sink and a processor on a motherboard. Other embodiments are disclosed and claimed.
摘要翻译：一些公开的实施例包括集成散热器组件，其具有穿过散热器的支撑底座中的孔的底部设置的支架压盖，穿过散热器的支撑基座中的孔的顶部设置的螺钉，适于以将所述螺钉偏置抵靠所述散热器，其中所述螺钉和弹簧接合所述支座以将所述散热器附接到所述支撑基座。集成散热器组件可用于保持散热器与主板上的处理器之间的接触。公开和要求保护其他实施例。

5. 发明授权

US06542367B2 Securing heat sinks 失效
公开(公告)号：US06542367B2
公开(公告)日：2003-04-01
申请号：US09871587
申请日：2001-05-31
申请人： David Shia , Thomas J. Wong
发明人： David Shia , Thomas J. Wong
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , Y10T29/4935 , H01L2924/00
摘要： A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.

6. 发明公开

US20240133945A1 MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESSOR SOCKETS 审中-公开
公开(公告)号：US20240133945A1
公开(公告)日：2024-04-25
申请号：US18401133
申请日：2023-12-29
申请人： Mohanraj Prabhugoud , David Shia , Lejie Liu , Silver Alfonso Rodriguez Estrada , Min Pei , Ralph V. Miele , Caleb Million Tessema
发明人： Mohanraj Prabhugoud , David Shia , Lejie Liu , Silver Alfonso Rodriguez Estrada , Min Pei , Ralph V. Miele , Caleb Million Tessema
IPC分类号： G01R31/28
CPC分类号： G01R31/2863 , G01R31/2808 , G01R31/2886
摘要： A low level contact resistance (LLCR) testing apparatus comprises a test board, an interface board, and a patch board. The test board comprises a processor socket. The interface board connects to both the test board and the patch board. The patch board connects to a contact resistance tester. An LLCR system comprising the LLCR testing apparatus and a contact resistance tester can be portable. The test board can accommodate thermal management solutions of varying sizes and types. Different test board designs can accommodate different socket-processor configurations and the different test boards can be easily accommodated by an LLCR testing apparatus due to its modular design.

7. 发明授权

US09207258B2 Composite wire probes for testing integrated circuits 有权
标题翻译：用于测试集成电路的复合线探头
公开(公告)号：US09207258B2
公开(公告)日：2015-12-08
申请号：US13631599
申请日：2012-09-28
申请人： David Shia , Todd P. Albertson , Kip P. Stevenson
发明人： David Shia , Todd P. Albertson , Kip P. Stevenson
IPC分类号： G01R1/067 , G01R31/26 , G01R3/00 , G01R31/28
CPC分类号： G01R1/06761 , G01R3/00 , G01R31/2886
摘要： An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10−8 Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core. Between 10 to 30% of the outer cross-sectional dimension is provided by the low electrical resistivity layer.
摘要翻译：一个方面的电探针包括高屈服强度的线芯。高屈服强度线芯主要包括选自钨，钨 - 铜合金，钨 - 镍合金，铍 - 铜合金，钼，不锈钢及其组合中的一种或多种材料。高机械强度线芯在250℃的温度下具有至少1千兆帕（GPa）的屈服强度。电探针还包括围绕高屈服强度线芯同心的低电阻率层。同心层主要包括一种或多种选自银，金，铜及其组合的材料。低电阻率层的电阻率不超过2×10-8欧姆米。电探针具有不大于50微米的电探针的外横截面尺寸。外横截面尺寸的60％至85％是由高机械强度线芯提供的。外部横截面尺寸的10至30％由低电阻率层提供。

8. 发明授权

US08797053B2 Positioning and socketing for semiconductor dice 有权
标题翻译：半导体芯片的定位和插槽
公开(公告)号：US08797053B2
公开(公告)日：2014-08-05
申请号：US13114876
申请日：2011-05-24
申请人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
发明人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
IPC分类号： G01R31/00 , G01R1/073
CPC分类号： G01R1/0735 , G01R31/2891
摘要： Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.
摘要翻译：提供了用于测试裸机和封装的半导体晶片的器件和方法。随着集成电路芯片变得越来越小，并且越来越复杂，与芯片的电源和系统的其他组件的连接的接口所呈现的接口也变得越来越小，越来越复杂。本发明的实施例提供了用于细间距器件第一级互连区域的微米级精度对准能力。本发明的实施例采用空气轴承来实现被测设备的移动和对准与测试界面。另外，提供了包括由热流体支撑的膜的测试界面。

9. 发明申请

US20140176172A1 COMPOSITE WIRE PROBE TEST ASSEMBLY 有权
标题翻译：复合线探头测试总成
公开(公告)号：US20140176172A1
公开(公告)日：2014-06-26
申请号：US13725255
申请日：2012-12-21
申请人： Kip Stevenson , Todd P. Albertson , David Shia , Kamil Salloum
发明人： Kip Stevenson , Todd P. Albertson , David Shia , Kamil Salloum
IPC分类号： G01R31/28
CPC分类号： G01R1/06755 , G01R3/00 , G01R31/26 , G01R31/2886
摘要： An examples includes a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining at least one cavity extending to the conductive trace and an electrical probe disposed in the cavity, with solder coupling the electrical probe to the conductive trace. The electrical probe can include a high yield strength wire core including a refractory metal and a thin oxidation protection layer concentrically disposed around high yield strength wire core and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof, wherein the solder fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer.
摘要翻译：示例包括基板，其包括导电迹线和设置在导电迹线顶部上的层，该层限定延伸到导电迹线的至少一个空腔和设置在该空腔中的电探针，焊料将电探针耦合到导电痕迹电探针可以包括高屈服强度的线芯，包括耐火金属和同心地设置在高屈服强度线芯周围的薄氧化保护层，并提供电探针的外表面，薄氧化保护层主要包括一种或多种材料选自金，铂，钌，铑，钯，锇，铱，铬及其组合，其中焊料填充空腔并且耦合到设置在电探针和层之间的腔内的电探针。

10. 发明申请

US20140091828A1 Sort Probe Gripper 有权
标题翻译：排序探头夹爪
公开(公告)号：US20140091828A1
公开(公告)日：2014-04-03
申请号：US13630141
申请日：2012-09-28
申请人： David Shia , Todd P. Albertson
发明人： David Shia , Todd P. Albertson
IPC分类号： G01R1/067
CPC分类号： G01R1/06705 , G01R1/07307 , G01R3/00
摘要： A sort probe gripper includes a body, a jaw mount inserted into the body, a plurality of grippers mounted in the jaw mount and an actuator sleeve slidable along the body to engage the plurality of grippers.
摘要翻译：分类探针夹持器包括主体，插入到主体中的卡爪安装件，安装在卡爪安装件中的多个夹具和可沿主体滑动以与多个夹持器接合的致动器套筒。

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