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1. 发明公开

US20240240688A1 MITIGATION OF SEISMIC EVENT EFFECTS ON LIQUID IMMERSION COOLING SYSTEMS 审中-公开
公开(公告)号：US20240240688A1
公开(公告)日：2024-07-18
申请号：US18620216
申请日：2024-03-28
申请人： Phil Geng , Prabhakar Subrahmanyam , Vishnu Prasadh Sugumar , Jacob McMillian , Ralph V. Miele , Ying-Feng Pang , David Shia
发明人： Phil Geng , Prabhakar Subrahmanyam , Vishnu Prasadh Sugumar , Jacob McMillian , Ralph V. Miele , Ying-Feng Pang , David Shia
IPC分类号： F16F9/50 , G01V1/36 , H05K7/20
CPC分类号： F16F9/50 , G01V1/36 , H05K7/20236 , H05K7/20272 , H05K7/20281 , F16F2230/08 , F16F2230/18 , G01V2210/144 , G01V2210/6222
摘要： In some embodiments, an immersion cooling system comprises a spring damper, a crumple block, a frictional layer, and/or preloaded spring-based mounts to mitigate the effects of seismic events. In other embodiments, the combined mass of liquids in the immersion tank and a compensation tank is kept constant to maintain the system's response to seismic events. In still other embodiments, an immersion cooling system comprises a tunable mass to provide an active response to seismic events. In yet other embodiments, an immersion tank is located within a housing pallet and is moveable within the palette. Spring dampers dampen tank movement within the pallet and shutoff switches housed in the pallet cause power to components in the tank to be shut off in response to tank movement. Cooling liquid can be transferred from the tank to a secondary reservoir to avoid cooling liquid loss and protect the tank.

2. 发明公开

US20240179832A1 MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE 审中-公开
公开(公告)号：US20240179832A1
公开(公告)日：2024-05-30
申请号：US18435821
申请日：2024-02-07
申请人： Phil Geng , Xiaoning Ye , Yipeng Zhong , Meng Wang , Hongfei Yan , Chuansheng Liu , Lejie Liu , Mohanraj Prabhugoud , Fernando Gonzalez Lenero , Dongwang Chen , Sanjoy Saha , Ralph Miele , Baris Bicen , David Shia , Jeffory Smalley , Eric Erike
发明人： Phil Geng , Xiaoning Ye , Yipeng Zhong , Meng Wang , Hongfei Yan , Chuansheng Liu , Lejie Liu , Mohanraj Prabhugoud , Fernando Gonzalez Lenero , Dongwang Chen , Sanjoy Saha , Ralph Miele , Baris Bicen , David Shia , Jeffory Smalley , Eric Erike
IPC分类号： H05K1/02
CPC分类号： H05K1/0263 , H05K2201/10189 , H05K2201/2009
摘要： A multi-entry socket power delivery structure is attachable to a printed circuit board to provide improved delivery of one or more power supply signals to a socket. The power delivery structure provides an additional path for power supply signals to be delivered to a socket (in addition to the “power corridor” of the printed circuit board). The power delivery structure comprises one or more portions, with individual portions comprising a printed circuit board connection portion that attaches to the printed circuit board to receive a power supply signal generated by a voltage regulator, and a socket connection portion that attaches to the printed circuit board to deliver the power supply signal to the socket via the printed circuit board. The power delivery structure can be located in the recess of a reinforced backplate that provides structural integrity to a processor stack and associated thermal management solution loading mechanism.

3. 发明授权

US09535095B2 Anti-rotation for wire probes in a probe head of a die tester 有权
标题翻译：在模具测试仪的探头中的线探头的防旋转
公开(公告)号：US09535095B2
公开(公告)日：2017-01-03
申请号：US14013422
申请日：2013-08-29
申请人： David Shia , Todd P. Albertson , Keith J. Martin
发明人： David Shia , Todd P. Albertson , Keith J. Martin
IPC分类号： G01R1/073 , G01R1/067 , G01R3/00
CPC分类号： G01R1/07371 , G01R1/06733 , G01R1/07357 , G01R3/00 , Y10T29/49124
摘要： Wire probes are described that resist rotation during assembly into a probe head of a die tester. One example includes probe wires with a protrusion at a pre-determined position along the length of the wire. A probe substrate with pads on one side each to attach to and electrically connect with a probe wire and a pads on the opposite side to connect to test equipment and a probe holder above the substrate with holes. Each hole holds a respective one of the probe wires against the probe substrate. Each hole also has a key to mate with a protrusion of a respective probe wire so that the protrusions engage the keys to prevent rotation of the respective wire.
摘要翻译：描述了在组装到模具测试器的探针头期间抵抗旋转的线探针。一个例子包括沿导线长度的预定位置具有突起的探针线。探针基板，其一侧具有焊盘，每个探针基板附接到探针线和相对侧上的电极，以连接到测试设备，并且在基板上方具有孔。每个孔将相应的探针线保持在探针基板上。每个孔还具有与相应探针线的突起配合的键，使得突起接合键以防止相应线的旋转。

4. 发明授权

US09134343B2 Sort probe gripper 有权
标题翻译：分选探针夹具
公开(公告)号：US09134343B2
公开(公告)日：2015-09-15
申请号：US13630141
申请日：2012-09-28
申请人： David Shia , Todd P. Albertson
发明人： David Shia , Todd P. Albertson
IPC分类号： G01R31/00 , G01R1/067 , G01R3/00 , G01R1/073
CPC分类号： G01R1/06705 , G01R1/07307 , G01R3/00
摘要： An apparatus includes a robot and a sort probe gripper. The sort probe gripper includes a body, a jaw mount inserted into the body, a plurality of grippers mounted in the jaw mount and an actuator sleeve slidable along the body to engage the plurality of grippers.
摘要翻译：一种装置包括机器人和分选探针夹持器。分类探针夹持器包括主体，插入到主体中的卡爪安装件，安装在卡爪安装件中的多个夹具和可沿主体滑动以与多个夹持器接合的致动器套筒。

5. 发明授权

US08710858B2 Micro positioning test socket and methods for active precision alignment and co-planarity feedback 有权
标题翻译：微定位测试插座和主动精密对准和共平面反馈的方法
公开(公告)号：US08710858B2
公开(公告)日：2014-04-29
申请号：US12888579
申请日：2010-09-23
申请人： Abram M Detofsky , Todd P Albertson , David Shia
发明人： Abram M Detofsky , Todd P Albertson , David Shia
IPC分类号： G01R31/00
CPC分类号： G01R1/0408 , G01B7/31 , G01R1/0483 , G01R1/06794 , G01R31/2891 , H05K1/0268 , H05K2203/162 , H05K2203/166
摘要： Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.
摘要翻译：描述了用于测试微电子封装结构/器件的方法和结构。这些方法可以包括将设备放置在浮动载体中，其中浮动载体通过设置在插座壳体的四个角落中的销钉联接到插座壳体，并且其中至少两个致动马达设置在插座壳体内，并且微型通过利用电容耦合或光纤对准系统来调节装置，其中设置在插座壳体中的对准结构和设置在装置内的对准封装球之间的最大测量电容或最大测量强度表示装置的最佳对准。方法还包括通过使用电容耦合技术进行有源共平面检测的方法。

6. 发明公开

US20240133945A1 MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESSOR SOCKETS 审中-公开
公开(公告)号：US20240133945A1
公开(公告)日：2024-04-25
申请号：US18401133
申请日：2023-12-29
申请人： Mohanraj Prabhugoud , David Shia , Lejie Liu , Silver Alfonso Rodriguez Estrada , Min Pei , Ralph V. Miele , Caleb Million Tessema
发明人： Mohanraj Prabhugoud , David Shia , Lejie Liu , Silver Alfonso Rodriguez Estrada , Min Pei , Ralph V. Miele , Caleb Million Tessema
IPC分类号： G01R31/28
CPC分类号： G01R31/2863 , G01R31/2808 , G01R31/2886
摘要： A low level contact resistance (LLCR) testing apparatus comprises a test board, an interface board, and a patch board. The test board comprises a processor socket. The interface board connects to both the test board and the patch board. The patch board connects to a contact resistance tester. An LLCR system comprising the LLCR testing apparatus and a contact resistance tester can be portable. The test board can accommodate thermal management solutions of varying sizes and types. Different test board designs can accommodate different socket-processor configurations and the different test boards can be easily accommodated by an LLCR testing apparatus due to its modular design.

7. 发明授权

US09207258B2 Composite wire probes for testing integrated circuits 有权
标题翻译：用于测试集成电路的复合线探头
公开(公告)号：US09207258B2
公开(公告)日：2015-12-08
申请号：US13631599
申请日：2012-09-28
申请人： David Shia , Todd P. Albertson , Kip P. Stevenson
发明人： David Shia , Todd P. Albertson , Kip P. Stevenson
IPC分类号： G01R1/067 , G01R31/26 , G01R3/00 , G01R31/28
CPC分类号： G01R1/06761 , G01R3/00 , G01R31/2886
摘要： An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10−8 Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core. Between 10 to 30% of the outer cross-sectional dimension is provided by the low electrical resistivity layer.
摘要翻译：一个方面的电探针包括高屈服强度的线芯。高屈服强度线芯主要包括选自钨，钨 - 铜合金，钨 - 镍合金，铍 - 铜合金，钼，不锈钢及其组合中的一种或多种材料。高机械强度线芯在250℃的温度下具有至少1千兆帕（GPa）的屈服强度。电探针还包括围绕高屈服强度线芯同心的低电阻率层。同心层主要包括一种或多种选自银，金，铜及其组合的材料。低电阻率层的电阻率不超过2×10-8欧姆米。电探针具有不大于50微米的电探针的外横截面尺寸。外横截面尺寸的60％至85％是由高机械强度线芯提供的。外部横截面尺寸的10至30％由低电阻率层提供。

8. 发明授权

US08797053B2 Positioning and socketing for semiconductor dice 有权
标题翻译：半导体芯片的定位和插槽
公开(公告)号：US08797053B2
公开(公告)日：2014-08-05
申请号：US13114876
申请日：2011-05-24
申请人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
发明人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
IPC分类号： G01R31/00 , G01R1/073
CPC分类号： G01R1/0735 , G01R31/2891
摘要： Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.
摘要翻译：提供了用于测试裸机和封装的半导体晶片的器件和方法。随着集成电路芯片变得越来越小，并且越来越复杂，与芯片的电源和系统的其他组件的连接的接口所呈现的接口也变得越来越小，越来越复杂。本发明的实施例提供了用于细间距器件第一级互连区域的微米级精度对准能力。本发明的实施例采用空气轴承来实现被测设备的移动和对准与测试界面。另外，提供了包括由热流体支撑的膜的测试界面。

9. 发明申请

US20140176172A1 COMPOSITE WIRE PROBE TEST ASSEMBLY 有权
标题翻译：复合线探头测试总成
公开(公告)号：US20140176172A1
公开(公告)日：2014-06-26
申请号：US13725255
申请日：2012-12-21
申请人： Kip Stevenson , Todd P. Albertson , David Shia , Kamil Salloum
发明人： Kip Stevenson , Todd P. Albertson , David Shia , Kamil Salloum
IPC分类号： G01R31/28
CPC分类号： G01R1/06755 , G01R3/00 , G01R31/26 , G01R31/2886
摘要： An examples includes a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining at least one cavity extending to the conductive trace and an electrical probe disposed in the cavity, with solder coupling the electrical probe to the conductive trace. The electrical probe can include a high yield strength wire core including a refractory metal and a thin oxidation protection layer concentrically disposed around high yield strength wire core and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof, wherein the solder fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer.
摘要翻译：示例包括基板，其包括导电迹线和设置在导电迹线顶部上的层，该层限定延伸到导电迹线的至少一个空腔和设置在该空腔中的电探针，焊料将电探针耦合到导电痕迹电探针可以包括高屈服强度的线芯，包括耐火金属和同心地设置在高屈服强度线芯周围的薄氧化保护层，并提供电探针的外表面，薄氧化保护层主要包括一种或多种材料选自金，铂，钌，铑，钯，锇，铱，铬及其组合，其中焊料填充空腔并且耦合到设置在电探针和层之间的腔内的电探针。

10. 发明申请

US20140091828A1 Sort Probe Gripper 有权
标题翻译：排序探头夹爪
公开(公告)号：US20140091828A1
公开(公告)日：2014-04-03
申请号：US13630141
申请日：2012-09-28
申请人： David Shia , Todd P. Albertson
发明人： David Shia , Todd P. Albertson
IPC分类号： G01R1/067
CPC分类号： G01R1/06705 , G01R1/07307 , G01R3/00
摘要： A sort probe gripper includes a body, a jaw mount inserted into the body, a plurality of grippers mounted in the jaw mount and an actuator sleeve slidable along the body to engage the plurality of grippers.
摘要翻译：分类探针夹持器包括主体，插入到主体中的卡爪安装件，安装在卡爪安装件中的多个夹具和可沿主体滑动以与多个夹持器接合的致动器套筒。

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