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    • 3. 发明授权
    • Method to achieve STI planarization
    • 实现STI平坦化的方法
    • US06403484B1
    • 2002-06-11
    • US09803187
    • 2001-03-12
    • Victor Seng Keong LimLap ChanJames LeeChen FengWang Ling Goh
    • Victor Seng Keong LimLap ChanJames LeeChen FengWang Ling Goh
    • H01L2100
    • H01L21/31056H01L21/31053H01L21/76229
    • A method of forming shallow trench isolations is described. A plurality of isolation trenches are etched through a first etch stop layer into the underlying semiconductor substrate. An oxide layer is deposited over the first etch stop layer and within the isolation trenches using a high density plasma chemical vapor deposition process (HDP-CVD) wherein after the oxide layer fills the isolation trenches, the deposition component is discontinued while continuing the sputtering component until corners of the first etch stop layer are exposed at edges of the isolation trenches whereby the oxide layer within the isolation trenches is disconnected from the oxide layer overlying the first etch stop layer. Thereafter, a second etch stop layer is deposited overlying the oxide layer within the isolation trenches, the oxide layer overlying the first etch stop layer, and the exposed first etch stop layer corners. The second etch stop layer is polished away until the oxide layer overlying the first etch stop layer is exposed. The exposed oxide layer overlying the first etch stop layer is removed. The first and second etch stop layers are removed to complete the planarized shallow trench isolation regions in the manufacture of an integrated circuit device.
    • 描述了形成浅沟槽隔离的方法。 通过第一蚀刻停止层将多个隔离沟槽蚀刻到下面的半导体衬底中。 使用高密度等离子体化学气相沉积工艺(HDP-CVD)在第一蚀刻停止层和隔离沟槽内沉积氧化物层,其中在氧化物层填充隔离沟槽之后,沉积组分被中断,同时继续溅射组分 直到第一蚀刻停止层的角部暴露在隔离沟槽的边缘处,由此隔离沟槽内的氧化物层与覆盖在第一蚀刻停止层上的氧化物层断开。 此后,沉积在隔离沟槽内的氧化物层上的第二蚀刻停止层,覆盖在第一蚀刻停止层上的氧化物层和暴露的第一蚀刻停止层拐角。 将第二蚀刻停止层抛光,直到暴露出覆盖在第一蚀刻停止层上的氧化物层。 去除覆盖在第一蚀刻停止层上的暴露的氧化物层。 去除第一和第二蚀刻停止层以在集成电路器件的制造中完成平坦化的浅沟槽隔离区。