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    • 9. 发明授权
    • Method for cleaning elements in vacuum chamber and apparatus for processing substrates
    • 用于清洁真空室中的元件的方法和用于处理衬底的装置
    • US08137473B2
    • 2012-03-20
    • US10921947
    • 2004-08-20
    • Tsuyoshi MoriyaHiroshi NagaikeHiroyuki Nakayama
    • Tsuyoshi MoriyaHiroshi NagaikeHiroyuki Nakayama
    • B08B5/00B08B7/00
    • H01L21/67028B08B3/12H01J37/32862H01L21/6831
    • To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.
    • 为了通过使颗粒粘附到元件上来清洁真空室中的元件散射,本发明使用了一种用于向元件施加电压并且通过利用麦克斯韦应力使颗粒散射的装置,用于对颗粒进行充电的装置和 通过利用库仑力使颗粒散射,用于将气体引入真空室中并通过使气体冲击波撞击元件而使颗粒粘附到元件上的装置,用于加热元件并引起 通过利用热应力和热压力来散射的颗粒,或通过对元件施加机械振动来使颗粒散射的装置。 通过在相对高压气氛中的气流中携带它们来除去如此散落的颗粒。