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1. 发明授权

US08113757B2 Intermediate transfer chamber, substrate processing system, and exhaust method for the intermediate transfer chamber 有权
标题翻译：中间转移室，衬底处理系统和中间转移室的排气方法
公开(公告)号：US08113757B2
公开(公告)日：2012-02-14
申请号：US11831361
申请日：2007-07-31
申请人： Tsuyoshi Moriya , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
发明人： Tsuyoshi Moriya , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
IPC分类号： B65G65/34
CPC分类号： H01L21/67201 , Y10S414/135
摘要： An intermediate transfer chamber that can prevent formation of defects in substrates. The intermediate transfer chamber is provided between a loader module being in a first environment where the interior thereof is at a first pressure and contains moisture, and a chamber of a process module being in a second environment where the interior thereof is at a second pressure lower than the first pressure. The intermediate transfer chamber comprises a transfer arm comprising a pick that bidirectionally transfers a substrate between the loader module and the chamber and supports the substrate, a load-lock module exhaust system that exhausts the interior of the intermediate transfer chamber so as to reduce pressure in the intermediate transfer chamber from the first pressure to the second pressure, and a plate-like member that controls the conductance of exhaust on at least a principal surface of the substrate opposite to the pick when the interior of the intermediate transfer chamber is exhausted.
摘要翻译：可以防止在基板中形成缺陷的中间转印室。中间转移室设置在处于第一环境中的第一环境中的装载器模块和处于第二环境中的处于第二环境的第二环境中的第二环境中的处理模块室，比第一个压力。中间传送室包括传送臂，传送臂包括在装载器模块和室之间双向传送衬底并支撑衬底的拾取器，负载锁定模块排气系统，其排出中间转印室的内部，以便减少所述中间转印室从所述第一压力到所述第二压力，以及板状构件，其在所述中间转印室的内部被耗尽时控制与所述拾取器相对的所述基板的至少主表面上的排气的电导。

2. 发明授权

US08048235B2 Gate valve cleaning method and substrate processing system 有权
标题翻译：闸阀清洗方法和基板处理系统
公开(公告)号：US08048235B2
公开(公告)日：2011-11-01
申请号：US11969428
申请日：2008-01-04
申请人： Tsuyoshi Moriya , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
发明人： Tsuyoshi Moriya , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
IPC分类号： B08B6/00 , B08B5/02 , B08B7/02
CPC分类号： H01L21/67126
摘要： A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.
摘要翻译：一种闸阀清洗方法，其能够清洁使大气传送室和内部压力可变转移室的闸阀彼此连通或彼此连通或将它们彼此关闭，而不会导致生产量的降低基板处理系统。在闸阀将大气传送室和内压可变传送室彼此连通之前，内压可变传送室中的压力增加，使得内压可变传送室中的压力可以变得高于压力在大气传递室。

3. 发明申请

US20120012254A1 GATE VALVE CLEANING METHOD AND SUBSTRATE PROCESSING SYSTEM 有权
标题翻译：门阀清洗方法和基板处理系统
公开(公告)号：US20120012254A1
公开(公告)日：2012-01-19
申请号：US13243462
申请日：2011-09-23
申请人： Tsuyoshi MORIYA , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
发明人： Tsuyoshi MORIYA , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
IPC分类号： B08B13/00 , C23F1/08
CPC分类号： H01L21/67126
摘要： A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.
摘要翻译：一种闸阀清洗方法，其能够清洁使大气传送室和内部压力可变转移室的闸阀彼此连通或彼此连通或将它们彼此关闭，而不会导致生产量的降低基板处理系统。在闸阀将大气传送室和内压可变传送室彼此连通之前，内压可变传送室中的压力增加，使得内压可变传送室中的压力可以变得高于压力在大气传递室。

4. 发明授权

US08382938B2 Gate valve cleaning method and substrate processing system 有权
标题翻译：闸阀清洗方法和基板处理系统
公开(公告)号：US08382938B2
公开(公告)日：2013-02-26
申请号：US13243462
申请日：2011-09-23
申请人： Tsuyoshi Moriya , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
发明人： Tsuyoshi Moriya , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
IPC分类号： H01L21/00 , B08B9/00
CPC分类号： H01L21/67126
摘要： A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.
摘要翻译：一种闸阀清洗方法，其能够清洁使大气传送室和内部压力可变转移室的闸阀彼此连通或彼此连通或将它们彼此关闭，而不会导致生产量的降低基板处理系统。在闸阀将大气传送室和内压可变传送室彼此连通之前，内压可变传送室中的压力增加，使得内压可变传送室中的压力可以变得高于压力在大气传递室。

5. 发明申请

US20080181750A1 GATE VALVE CLEANING METHOD AND SUBSTRATE PROCESSING SYSTEM 有权
标题翻译：门阀清洗方法和基板处理系统
公开(公告)号：US20080181750A1
公开(公告)日：2008-07-31
申请号：US11969428
申请日：2008-01-04
申请人： Tsuyoshi Moriya , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
发明人： Tsuyoshi Moriya , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
IPC分类号： H01L21/677 , B08B5/02
CPC分类号： H01L21/67126
摘要： A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.
摘要翻译：一种闸阀清洗方法，其能够清洁使大气传送室和内部压力可变转移室的闸阀彼此连通或彼此连通或将它们彼此关闭，而不会导致生产量的降低基板处理系统。在闸阀将大气传送室和内压可变传送室彼此连通之前，内压可变传送室中的压力增加，使得内压可变传送室中的压力可以变得高于压力在大气传递室。

6. 发明申请

US20080031710A1 INTERMEDIATE TRANSFER CHAMBER, SUBSTRATE PROCESSING SYSTEM, AND EXHAUST METHOD FOR THE INTERMEDIATE TRANSFER CHAMBER 有权
标题翻译：中间传送室，基板处理系统和中间传送室的排气方法
公开(公告)号：US20080031710A1
公开(公告)日：2008-02-07
申请号：US11831361
申请日：2007-07-31
申请人： Tsuyoshi MORIYA , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
发明人： Tsuyoshi MORIYA , Hiroyuki Nakayama , Keisuke Kondoh , Hiroki Oka
IPC分类号： B65H1/24
CPC分类号： H01L21/67201 , Y10S414/135
摘要： An intermediate transfer chamber that can prevent formation of defects in substrates. The intermediate transfer chamber is provided between a loader module being in a first environment where the interior thereof is at a first pressure and contains moisture, and a chamber of a process module being in a second environment where the interior thereof is at a second pressure lower than the first pressure. The intermediate transfer chamber comprises a transfer arm comprising a pick that bidirectionally transfers a substrate between the loader module and the chamber and supports the substrate, a load-lock module exhaust system that exhausts the interior of the intermediate transfer chamber so as to reduce pressure in the intermediate transfer chamber from the first pressure to the second pressure, and a plate-like member that controls the conductance of exhaust on at least a principal surface of the substrate opposite to the pick when the interior of the intermediate transfer chamber is exhausted.
摘要翻译：可以防止在基板中形成缺陷的中间转印室。中间转移室设置在处于第一环境中的第一环境中的装载器模块和处于第二环境中的处于第二环境的第二环境中的第二环境中的处理模块室，比第一个压力。中间传送室包括传送臂，传送臂包括在装载器模块和室之间双向传送衬底并支撑衬底的拾取器，负载锁定模块排气系统，其排出中间转印室的内部，以便减少所述中间转印室从所述第一压力到所述第二压力，以及板状构件，其在所述中间转印室的内部被耗尽时控制与所述拾取器相对的所述基板的至少主表面上的排气的电导。

7. 外观设计

USD527751S1 Transfer-chamber 有权
标题翻译：转移室
公开(公告)号：USD527751S1
公开(公告)日：2006-09-05
申请号：US29217729
申请日：2004-11-22
申请人： Keisuke Kondoh , Hiroki Oka , Hiroshi Narushima
设计人： Keisuke Kondoh , Hiroki Oka , Hiroshi Narushima

8. 外观设计

USD556157S1 Load-lock chamber 有权
标题翻译：加载锁定室
公开(公告)号：USD556157S1
公开(公告)日：2007-11-27
申请号：US29217730
申请日：2004-11-22
申请人： Keisuke Kondoh , Hiroki Oka , Makoto Tashiro
设计人： Keisuke Kondoh , Hiroki Oka , Makoto Tashiro

9. 发明授权

US08740535B2 Delivery position aligning method for use in vacuum processing apparatus, vacuum processing apparatus and computer storage medium 有权
标题翻译：用于真空处理装置，真空处理装置和计算机存储介质的输送位置对准方法
公开(公告)号：US08740535B2
公开(公告)日：2014-06-03
申请号：US13079356
申请日：2011-04-04
申请人： Keisuke Kondoh , Hiroshi Koizumi
发明人： Keisuke Kondoh , Hiroshi Koizumi
IPC分类号： H01L21/677
CPC分类号： H01L21/68 , H01L21/67196 , H01L21/67259
摘要： In a vacuum transfer chamber, a position detecting mechanism for detecting the positions of semiconductor wafers is arranged. The semiconductor wafers disposed at predetermined positions in a load lock chamber and vacuum processing chambers are transferred to the position detecting mechanism by a vacuum transfer mechanism and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber and the vacuum processing chambers is performed.
摘要翻译：在真空传送室中，布置有用于检测半导体晶片的位置的位置检测机构。设置在负载锁定室和真空处理室中的预定位置的半导体晶片通过真空传递机构传送到位置检测机构，并且检测晶片的位置。然后，基于检测结果，进行负载锁定室与真空处理室的对准。

10. 发明授权

US07942622B2 Transfer/alignment method in vacuum processing apparatus, vacuum processing apparatus and computer storage medium 有权
标题翻译：真空处理装置，真空处理装置和计算机存储介质中的转移/取向方法
公开(公告)号：US07942622B2
公开(公告)日：2011-05-17
申请号：US12094783
申请日：2007-03-12
申请人： Keisuke Kondoh , Hiroshi Koizumi
发明人： Keisuke Kondoh , Hiroshi Koizumi
IPC分类号： H01L21/68
CPC分类号： H01L21/68 , H01L21/67196 , H01L21/67259
摘要： In a vacuum transfer chamber 10, a position detecting mechanism 33 for detecting the positions of semiconductor wafers W is arranged. The semiconductor wafers W disposed at predetermined positions in a load lock chamber 17 and vacuum processing chambers 11 to 16 are transferred to the position detecting mechanism 33 by a vacuum transfer mechanism 30 and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber 17 and the vacuum processing chambers 11 to 16 is performed.
摘要翻译：在真空传送室10中设置有检测半导体晶片W的位置的位置检测机构33。设置在负载锁定室17和真空处理室11至16中的预定位置的半导体晶片W通过真空传送机构30传送到位置检测机构33，并且检测晶片的位置。然后，基于检测结果，进行负载锁定室17与真空处理室11〜16的对准。

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