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    • 3. 发明授权
    • Vacuum interrupter and vacuum switch thereof
    • 真空灭弧室及其真空开关
    • US06346683B1
    • 2002-02-12
    • US09495317
    • 2000-02-01
    • Tsutomu OkutomiTakashi KusanoIwao OhshimaMitsutaka HommaAtsushi YamamotoTakanobu Nishimura
    • Tsutomu OkutomiTakashi KusanoIwao OhshimaMitsutaka HommaAtsushi YamamotoTakanobu Nishimura
    • H01H3366
    • H01H1/0203
    • {W—CuxSb-balance Cu} alloy is employed for contacts. As the anti-arcing constituent in the alloy W or WMo in a content of 65 to 85%, of grain diameter 0.4 to 9 &mgr;m is employed. As auxiliary constituent, CuxSb is employed, the content of the CuxSb being 0.09 to 1.4 weight %, the x being x=1.9 to 5.5, the grain diameter being 0.02 to 20 &mgr;m, and the mean distance between grains being 0.2 to 300 &mgr;m. As conductive constituent, Cu or CuSb solid solution is employed, the Sb content present in solid solution form in the CuSb solid solution being less than 0.5%. As a result, not only is dispersion of CuxSb, which is evaporated on subjection to arcing, reduced, but also generation of severe cracks, which have an adverse effect in terms of occurrence of restriking. Arcing at the contacts surfaces is prevented, suppressing dispersion and exfoliation of W grains. In this way, damage due to melting and dispersion at the contacts surfaces is reduced, enabling both restriking to be prevented and the contact resistance characteristic to be improved.
    • {W-CuxSb-余量Cu}合金用于接触。 由于合金W或WMo中抗弧成分含量为65〜85%,粒径为0.4〜9μm。 作为辅助成分,使用CuxSb,CuxSb的含量为0.09〜1.4重量%,x为x = 1.9〜5.5,粒径为0.02〜20μm,晶粒间的平均距离为0.2〜300μm。 作为导电成分,使用Cu或CuSb固溶体,CuSb固溶体中以固溶体形式存在的Sb含量小于0.5%。 结果是,不仅在电弧放电时蒸发的CuxSb的分散减少,而且产生严重的裂纹,这在再起弧的发生方面具有不利的影响。 防止了在接触表面的电弧,抑制了W晶粒的分散和剥落。 以这种方式,由于触点表面的熔化和分散而导致的损坏减少,从而能够防止再起弧,并且提高接触电阻特性。