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1. 发明授权

US5065271A Thin film magnetic head apparatus and method of manufacturing the same 失效
标题翻译：薄膜磁头装置及其制造方法
公开(公告)号：US5065271A
公开(公告)日：1991-11-12
申请号：US484796
申请日：1990-02-26
申请人： Tsukasa Matsuura , Jun Fujita , Manabu Uchizawa , Shigehisa Suzuki
发明人： Tsukasa Matsuura , Jun Fujita , Manabu Uchizawa , Shigehisa Suzuki
IPC分类号： G11B5/60 , G11B5/31 , G11B5/48 , G11B21/21
CPC分类号： G11B5/3103 , G11B5/484
摘要： A small light-weight thin film magnetic head apparatus for a rigid disk or a floppy disc. The apparatus includes a magnetic head formed directly on a distal end of a suspension as a thin layer, one end of the suspension being supported by an arm. This magnetic head is very small-sized and light-weight and has a head gap in direct contact with a recording medium, increasing the recording density and the read/write speed. Because of its reduced weight of the thin film magnetic head, a remarkably improved degree of followability with respect to the recording medium can be achieved. A method of manufacturing this magnetic head apparatus is also disclosed.
摘要翻译：一种用于刚性盘或软盘的小型轻量薄膜磁头装置。该装置包括直接形成在作为薄层的悬架的远端上的磁头，悬架的一端由臂支撑。该磁头尺寸非常小，重量轻，并且具有与记录介质直接接触的磁头间隙，增加记录密度和读/写速度。由于薄膜磁头的重量减轻，可以实现相对于记录介质的显着提高的追随程度。还公开了一种制造该磁头装置的方法。

2. 发明授权

US5161076A Magnetic head slider suspension apparatus and method of fabrication 失效
标题翻译：磁头滑块悬挂装置及其制造方法
公开(公告)号：US5161076A
公开(公告)日：1992-11-03
申请号：US537047
申请日：1990-06-12
申请人： Mitsuo Inumochi , Tsukasa Matsuura , Shinsuke Yura , Munehito Kumagai
发明人： Mitsuo Inumochi , Tsukasa Matsuura , Shinsuke Yura , Munehito Kumagai
IPC分类号： G11B21/21 , G11B5/48
CPC分类号： G11B5/4826 , Y10T29/49021 , Y10T29/49027
摘要： A magnetic head suspension according to the present disclosure includes a protrusion provided at the center of a flexure for mounting and supporting a magnetic head slider or on the tip end of a load beam for exerting a given load on the magnetic head slider such that the tip end of the protrusion is a support point, further including a fixing section for fixing said flexure on the tip end of said load beam and a magnetic head slider mounting section separated from said fixing section through a stepped portion.
摘要翻译：根据本公开的磁头悬架包括设置在弯曲部的中心处的突起，用于安装和支撑磁头滑块或者在负载梁的尖端上施加给磁头滑块上的给定负载，使得尖端突起的端部是支撑点，还包括用于将所述挠曲件固定在所述负载梁的末端上的固定部分和通过阶梯部分与所述固定部分分离的磁头滑动器安装部分。

3. 发明授权

US07081370B2 Silicon substrate apparatus and method of manufacturing the silicon substrate apparatus 有权
标题翻译：硅基板装置及其制造方法
公开(公告)号：US07081370B2
公开(公告)日：2006-07-25
申请号：US10492360
申请日：2002-09-04
申请人： Munehito Kumagai , Yukihisa Yoshida , Tsukasa Matsuura , Yukihiro Honma
发明人： Munehito Kumagai , Yukihisa Yoshida , Tsukasa Matsuura , Yukihiro Honma
IPC分类号： H01L21/00
CPC分类号： H03D9/0616
摘要： A first rectangular groove having a rectangular cross section and a second rectangular groove substantially orthogonal to the first rectangular groove and having a rectangular cross section are formed in a first silicon substrate. A third rectangular groove located at a position facing the first rectangular groove and having a rectangular cross section is formed on a second silicon substrate. A device substrate including a frequency conversion device is provided in the second rectangular groove, so that the frequency conversion device is located where the first and second rectangular grooves are orthogonal to each other. Further, the first silicon substrate on which the device substrate is located is bonded to the second silicon substrate, so that the first rectangular groove opposes the third rectangular groove, forming a rectangular waveguide which includes the first rectangular groove and the third rectangular groove, and in which a received high frequency signal propagates and is incident on the frequency conversion device.
摘要翻译：在第一硅衬底中形成具有矩形截面的第一矩形槽和与第一矩形槽基本正交并且具有矩形横截面的第二矩形槽。在第二硅衬底上形成位于面对第一矩形槽并且具有矩形横截面的位置处的第三矩形槽。包括变频装置的装置基板设置在第二矩形槽中，使得变频装置位于第一和第二矩形槽彼此正交的位置。此外，器件基板所在的第一硅基板与第二硅基板接合，使得第一矩形槽与第三矩形槽相对，形成包括第一矩形槽和第三矩形槽的矩形波导，以及其中接收的高频信号传播并入射在变频装置上。

4. 发明申请

US20050009226A1 Silicon substrate device and its manufacturing method 有权
标题翻译：硅衬底器件及其制造方法
公开(公告)号：US20050009226A1
公开(公告)日：2005-01-13
申请号：US10492360
申请日：2002-09-04
申请人： Munehito Kumagai , Yukihisa Yoshida , Tsukasa Matsuura , Yukihiro Honma
发明人： Munehito Kumagai , Yukihisa Yoshida , Tsukasa Matsuura , Yukihiro Honma
IPC分类号： H03D9/06 , H01L21/00 , H01L33/00
CPC分类号： H03D9/0616
摘要： A first narrow rectangular groove having a rectangular cross section and a second narrow rectangular groove substantially orthogonal to the first narrow rectangular groove and having a rectangular cross section are formed in a first silicon substrate. A third narrow rectangular groove located at a position facing the first narrow rectangular groove and having a rectangular cross section is formed on a second silicon substrate. A device substrate including a frequency conversion device is provided in the second narrow rectangular groove, so that the frequency conversion device is located where the first and second narrow rectangular grooves are orthogonal to each other. Further, the first silicon substrate on which the device substrate is located is bonded to the second silicon substrate, so that the first narrow rectangular groove opposes the third narrow rectangular groove, forming a rectangular waveguide which includes the first narrow rectangular groove and the third narrow rectangular groove, and in which a received high frequency signal propagates and is incident on the frequency conversion device.
摘要翻译：在第一硅衬底中形成具有矩形横截面的第一窄矩形槽和与第一窄矩形槽基本正交并具有矩形横截面的第二窄矩形槽。在第二硅衬底上形成位于面对第一窄矩形槽并且具有矩形横截面的位置的第三窄矩形槽。包括频率转换装置的装置基板设置在第二窄矩形槽中，使得变频装置位于第一和第二窄矩形槽彼此正交的位置。此外，器件基板所在的第一硅基板与第二硅基板接合，使得第一窄矩形槽与第三窄矩形槽相对，形成包括第一窄矩形槽和第三窄矩形槽的矩形波导矩形槽，并且其中接收的高频信号传播并入射在变频装置上。

5. 发明授权

US06528724B1 Microdevice and its production method 失效
标题翻译：微设备及其生产方法
公开(公告)号：US06528724B1
公开(公告)日：2003-03-04
申请号：US09889424
申请日：2001-10-19
申请人： Yukihisa Yoshida , Martial Chabloz , Jiwei Jiao , Tsukasa Matsuura , Kazuhiko Tsutsumi
发明人： Yukihisa Yoshida , Martial Chabloz , Jiwei Jiao , Tsukasa Matsuura , Kazuhiko Tsutsumi
IPC分类号： H01L2302
CPC分类号： G01P15/125 , B81B2201/0228 , B81B2203/0136 , B81C1/0015 , B81C1/00579 , G01P1/023 , G01P15/0802 , G01P2015/0814 , Y10T29/49002 , Y10T29/49117
摘要： A micro device including an insulating substrate having a recess formed on a surface, and a beam-like silicon structure on the front surface of the insulating substrate surrounding the recess. The beam-like structure includes at least one functional section, and the functional section has a supporting section bonded to the insulating substrate and at least one cantilever integral with the supporting section and extending across the recess. The micro device also has an electrically conductive film electrically connected to the supporting section, on the surface of the recess at least directly under a cantilever. The electrically conductive film prevents the surface of the recess from being positively charged in the dry etching process. Thus, an etching gas having a positive charge is not subjected to electrical repulsion from the recess and does not impinge on the back surface of the silicon substrate, and therefore erosion of the cantilever does not occur. As a result, since the beam-like structure is formed with high accuracy in shape and dimensions, the micro device has improved reliability and an improved degree of freedom in design.
摘要翻译：一种微型器件，包括具有形成在表面上的凹部的绝缘基板和围绕凹部的绝缘基板的前表面上的梁状硅结构。梁状结构包括至少一个功能部分，并且功能部分具有结合到绝缘基板的支撑部分和与支撑部分一体并延伸穿过凹部的至少一个悬臂。微型装置还具有导电膜，该导电膜电连接到支撑部分，至少在悬臂下方的凹部的表面上。在干蚀刻工艺中，导电膜防止凹部的表面带正电。因此，具有正电荷的蚀刻气体不会受到来自凹部的电斥力，并且不会撞击到硅衬底的背面，因此不会发生悬臂的侵蚀。结果，由于在形状和尺寸方面形成了高度精确的束状结构，所以微型器件具有提高的可靠性和改进的设计自由度。

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