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    • 1. 发明授权
    • Golf club
    • 高尔夫俱乐部
    • US5855526A
    • 1999-01-05
    • US598076
    • 1996-02-07
    • Yukihiro Honma
    • Yukihiro Honma
    • A63B53/02A63B59/00
    • A63B53/02A63B60/54
    • A golf club having a head made of metallic material such as aluminum, stainless steel, titanium or the like is provided with a shaft sleeve made of non-metallic material such as fiber reinforced plastic, wood or the like is mounted on a tip end portion of a shaft or a shaft insertion portion of a head with which player's wrists, elbows, shoulders or the like would hardly be damaged, it is easy to enjoy an inherent performance of the shaft, to enhance a repulsive force by a kick back phenomenon to increase a hit distance of the ball.
    • 具有由铝,不锈钢,钛等金属材料制成的头部的高尔夫球杆设置有由诸如纤维增强塑料等非金属材料制成的轴套,木头等安装在前端部分上 头部的轴或轴插入部分,玩家的手腕,肘部,肩膀等几乎不会被损坏,容易享受轴的固有性能,通过反冲现象增强排斥力 增加球的命中距离。
    • 3. 发明授权
    • Silicon substrate apparatus and method of manufacturing the silicon substrate apparatus
    • 硅基板装置及其制造方法
    • US07081370B2
    • 2006-07-25
    • US10492360
    • 2002-09-04
    • Munehito KumagaiYukihisa YoshidaTsukasa MatsuuraYukihiro Honma
    • Munehito KumagaiYukihisa YoshidaTsukasa MatsuuraYukihiro Honma
    • H01L21/00
    • H03D9/0616
    • A first rectangular groove having a rectangular cross section and a second rectangular groove substantially orthogonal to the first rectangular groove and having a rectangular cross section are formed in a first silicon substrate. A third rectangular groove located at a position facing the first rectangular groove and having a rectangular cross section is formed on a second silicon substrate. A device substrate including a frequency conversion device is provided in the second rectangular groove, so that the frequency conversion device is located where the first and second rectangular grooves are orthogonal to each other. Further, the first silicon substrate on which the device substrate is located is bonded to the second silicon substrate, so that the first rectangular groove opposes the third rectangular groove, forming a rectangular waveguide which includes the first rectangular groove and the third rectangular groove, and in which a received high frequency signal propagates and is incident on the frequency conversion device.
    • 在第一硅衬底中形成具有矩形截面的第一矩形槽和与第一矩形槽基本正交并且具有矩形横截面的第二矩形槽。 在第二硅衬底上形成位于面对第一矩形槽并且具有矩形横截面的位置处的第三矩形槽。 包括变频装置的装置基板设置在第二矩形槽中,使得变频装置位于第一和第二矩形槽彼此正交的位置。 此外,器件基板所在的第一硅基板与第二硅基板接合,使得第一矩形槽与第三矩形槽相对,形成包括第一矩形槽和第三矩形槽的矩形波导,以及 其中接收的高频信号传播并入射在变频装置上。
    • 5. 发明申请
    • Silicon substrate device and its manufacturing method
    • 硅衬底器件及其制造方法
    • US20050009226A1
    • 2005-01-13
    • US10492360
    • 2002-09-04
    • Munehito KumagaiYukihisa YoshidaTsukasa MatsuuraYukihiro Honma
    • Munehito KumagaiYukihisa YoshidaTsukasa MatsuuraYukihiro Honma
    • H03D9/06H01L21/00H01L33/00
    • H03D9/0616
    • A first narrow rectangular groove having a rectangular cross section and a second narrow rectangular groove substantially orthogonal to the first narrow rectangular groove and having a rectangular cross section are formed in a first silicon substrate. A third narrow rectangular groove located at a position facing the first narrow rectangular groove and having a rectangular cross section is formed on a second silicon substrate. A device substrate including a frequency conversion device is provided in the second narrow rectangular groove, so that the frequency conversion device is located where the first and second narrow rectangular grooves are orthogonal to each other. Further, the first silicon substrate on which the device substrate is located is bonded to the second silicon substrate, so that the first narrow rectangular groove opposes the third narrow rectangular groove, forming a rectangular waveguide which includes the first narrow rectangular groove and the third narrow rectangular groove, and in which a received high frequency signal propagates and is incident on the frequency conversion device.
    • 在第一硅衬底中形成具有矩形横截面的第一窄矩形槽和与第一窄矩形槽基本正交并具有矩形横截面的第二窄矩形槽。 在第二硅衬底上形成位于面对第一窄矩形槽并且具有矩形横截面的位置的第三窄矩形槽。 包括频率转换装置的装置基板设置在第二窄矩形槽中,使得变频装置位于第一和第二窄矩形槽彼此正交的位置。 此外,器件基板所在的第一硅基板与第二硅基板接合,使得第一窄矩形槽与第三窄矩形槽相对,形成包括第一窄矩形槽和第三窄矩形槽的矩形波导 矩形槽,并且其中接收的高频信号传播并入射在变频装置上。